334:
reflow technology using either standard air or nitrogen gas. Each method has its advantages and disadvantages. With infrared reflow, the board designer must lay the board out so that short components do not fall into the shadows of tall components. Component location is less restricted if the designer knows that vapor phase reflow or convection soldering will be used in production. Following reflow soldering, certain irregular or heat-sensitive components may be installed and soldered by hand, or in large-scale automation, by focused infrared beam (FIB) or localized convection equipment.
772:
478:
Whereas through-hole components will stay in place (under gravitational force) once inserted and can be mechanically secured prior to soldering by bending out two leads on the solder side of the board, SMDs are easily moved out of place by a touch of a soldering iron. Without developed skill, when manually soldering or desoldering a component, it is easy to accidentally reflow the solder of an adjacent SMT component and unintentionally displace it, something that is almost impossible to do with through-hole components.
821:
colours and these can give an approximate idea of the capacitance of the component. Generally physical size is proportional to capacitance and (squared) voltage for the same dielectric. For example, a 100 nF, 50 V capacitor may come in the same package as a 10 nF, 150 V device. SMD (non-electrolytic) capacitors, which are usually monolithic ceramic capacitors, exhibit the same body color on all four faces not covered by the end caps. SMD electrolytic capacitors, usually tantalum capacitors, and
167:
temperature-controlled manual soldering iron, but unfortunately, those that are very small or have too fine a lead pitch are impossible to manually solder without expensive hot-air solder reflow equipment. SMDs can be one-quarter to one-tenth the size and weight, and one-half to one-quarter the cost of equivalent through-hole parts, but on the other hand, the costs of a certain SMT part and of an equivalent through-hole part may be quite similar, though rarely is the SMT part more expensive.
244:
381:
according to IPC, are acceptable "provided that these residues have been qualified and documented as benign". However, while shops conforming to IPC standard are expected to adhere to the
Association's rules on board condition, not all manufacturing facilities apply IPC standard, nor are they required to do so. Additionally, in some applications, such as low-end electronics, such stringent manufacturing methods are excessive both in expense and time required.
47:
887:
522:
407:
255:
31:
58:
836:(nH) range and are often used as power supply rail decouplers or in high frequency parts of a circuit. Larger inductors and transformers may of course be through-hole mounted on the same board. SMT inductors with larger inductance values often have turns of wire or flat strap around the body or embedded in clear epoxy, allowing the wire or strap to be seen. Sometimes a
854:
Discrete semiconductors, such as diodes and transistors are often marked with a two- or three-symbol code. The same code marked on different packages or on devices from different manufacturers can translate to different devices. Many of these codes, used because the devices are too small to be marked
511:
SMDs, usually being smaller than equivalent through-hole components, have less surface area for marking, requiring marked part ID codes or component values to be more cryptic and smaller, often requiring magnification to be read, whereas a larger through-hole component could be read and identified by
507:
Solder joint dimensions in SMT quickly become much smaller as advances are made toward ultra-fine pitch technology. The reliability of solder joints becomes more of a concern, as less and less solder is allowed for each joint. Voiding is a fault commonly associated with solder joints, especially when
309:
oven. They first enter a pre-heat zone, where the temperature of the board and all the components is gradually, uniformly raised to prevent thermal shock. The boards then enter a zone where the temperature is high enough to melt the solder particles in the solder paste, bonding the component leads to
430:
Small errors in component placement are corrected automatically as the surface tension of molten solder pulls components into alignment with solder pads. (On the other hand, through-hole components cannot be slightly misaligned, because once the leads are through the holes, the components are fully
123:
Surface-mount technology was developed in the 1960s. By 1986 surface mounted components accounted for 10% of the market at most, but was rapidly gaining popularity. By the late 1990s, the great majority of high-tech electronic printed circuit assemblies were dominated by surface mount devices. Much
831:
Smaller inductance with moderately high current ratings are usually of the ferrite bead type. They are simply a metal conductor looped through a ferrite bead and almost the same as their through-hole versions but possess SMD end caps rather than leads. They appear dark grey and are magnetic, unlike
809:
For 5% precision SMD resistors usually are marked with their resistance values using three digits: two significant digits and a multiplier digit. These are quite often white lettering on a black background, but other colored backgrounds and lettering can be used. For 1% precision SMD resistors, the
367:
and detergent, followed by an air blast to quickly remove residual water. However, most electronic assemblies are made using a "No-Clean" process where the flux residues are designed to be left on the circuit board, since they are considered harmless. This saves the cost of cleaning, speeds up the
144:
vehicles. Components were mechanically redesigned to have small metal tabs or end caps that could be directly soldered to the surface of the PCB. Components became much smaller and component placement on both sides of a board became far more common with surface mounting than through-hole mounting,
682:
Today, nozzles can often no longer be deposited on the PCB by neighboring components, which means that there is no longer a closed process chamber and adjacent components can be blown on strongly from the side. This can lead to the blowing of adjacent components and even to thermal damage. In this
99:
construction method of fitting components, in large part because SMT allows for increased manufacturing automation which reduces cost and improves quality. It also allows for more components to fit on a given area of substrate. Both technologies can be used on the same board, with the through-hole
820:
Non-electrolytic capacitors are usually unmarked and the only reliable method of determining their value is removal from the circuit and subsequent measurement with a capacitance meter or impedance bridge. The materials used to fabricate the capacitors, such as nickel tantalate, possess different
372:
and underfill materials. Regardless of cleaning or not those PCBs, current industry trend suggests to carefully review a PCB assembly process where "No-Clean" is applied, since flux residues trapped under components and RF shields may affect surface insulation resistance (SIR), especially on high
333:
liquids with high boiling points which use a method called vapor phase reflow. Due to environmental concerns, this method was falling out of favor until lead-free legislation was introduced which requires tighter controls on soldering. At the end of 2008, convection soldering was the most popular
840:
is present also. These higher inductance types are often limited to small current ratings, although some of the flat strap types can handle a few amps. As with capacitors, component values and identifiers for smaller inductors are not usually marked on the component itself; if not documented or
741:
Closed loop temperature control directly on the component possible by applied thermocouple or pyrometric measurement. This allows compensation of varying environmental influences and temperature losses. Enables use of the same temperature profile on slightly different assemblies, as the heating
599:
Closed loop temperature control directly on the component possible by applied thermocouple or pyrometric measurement. This allows compensation of varying environmental influences and temperature losses. Enables use of the same temperature profile on slightly different assemblies, as the heating
477:
Manual prototype assembly or component-level repair is more difficult and requires skilled operators and more expensive tools, due to the small sizes and lead spacings of many SMDs. Handling of small SMT components can be difficult, requiring tweezers, unlike nearly all through-hole components.
380:
require cleaning regardless of the solder flux type used to ensure a thoroughly clean board. Proper cleaning removes all traces of solder flux, as well as dirt and other contaminants that may be invisible to the naked eye. No-Clean or other soldering processes may leave "white residues" that,
562:
Sometimes hundreds or thousands of the same part need to be repaired. Such errors, if due to assembly, are often caught during the process. However, a whole new level of rework arises when component failure is discovered too late, and perhaps unnoticed until the end user of the device being
368:
manufacturing process, and reduces waste. However, it is generally suggested to wash the assembly, even when a "No-Clean" process is used, when the application uses very high frequency clock signals (in excess of 1 GHz). Another reason to remove no-clean residues is to improve adhesion of
166:
Conversely, SMT does not lend itself well to manual or low-automation fabrication, which is more economical and faster for one-off prototyping and small-scale production, and this is one reason why many through-hole components are still manufactured. Some SMDs can be soldered with a
841:
printed on the PCB, measurement, usually removed from the circuit, is the only way of determining them. Larger inductors, especially wire-wound types in larger footprints, usually have the value printed on the top. For example, "330", which equates to a value of 33
563:
manufactured experiences it. Rework can also be used if products of sufficient value to justify it require revision or re-engineering, perhaps to change a single firmware-based component. Reworking in large volume requires an operation designed for that purpose.
298:, where they are placed on a conveyor belt. The components to be placed on the boards are usually delivered to the production line in either paper/plastic tapes wound on reels or plastic tubes. Some large integrated circuits are delivered in static-free trays.
38:'s circuit board. The small rectangular chips with numbers are resistors, while the unmarked small rectangular chips are capacitors. The capacitors and resistors pictured are 0603 (1608 metric) package sizes, along with a very slightly larger 0805 (2012 metric)
162:
mask is used to prevent the solder holding those parts in place from reflowing and the parts floating away during wave soldering. Surface mounting lends itself well to a high degree of automation, reducing labor cost and greatly increasing production rates.
157:
process is used to solder both SMT and through-hole components simultaneously. Alternatively, SMT and through-hole components can be soldered on the same side of a board without adhesive if the SMT parts are first reflow-soldered, then a
869:
Generally, integrated circuit packages are large enough to be imprinted with the complete part number which includes the manufacturer's specific prefix, or a significant segment of the part number and the manufacturer's name or
148:
Often the surface tension of the solder is enough to hold the parts to the board; in rare cases parts on the bottom or "second" side of the board may be secured with a dot of adhesive to keep components from dropping off inside
466:
SMT may be unsuitable as the sole attachment method for components that are subject to frequent mechanical stress, such as connectors that are used to interface with external devices that are frequently attached and
492:(a quick snap-and-play prototyping tool), requiring either a custom PCB for every prototype or the mounting of the SMD upon a pin-leaded carrier. For prototyping around a specific SMD component, a less-expensive
542:(for some connections), or using a non-contact rework system. In most cases a rework system is the better choice because SMD work with a soldering iron requires considerable skill and is not always feasible.
855:
with more traditional numbers used on larger packages, correlate to more familiar traditional part numbers when a correlation list is consulted. GM4PMK in the United
Kingdom has prepared a
698:
A direct temperature control of the component is not possible, because the measurement of the actual component temperature is difficult due to the high gas velocity (measurement failure!)
485:, which provide for easy installation or exchange of components to modify a circuit and easy replacement of failed components. (Virtually all through-hole components can be socketed.)
686:
Local turbulence of the hot gas can create hot and cold spots on the heated surfaces, resulting in uneven heating. Perfectly designed, high-quality nozzles are therefore a must!
689:
Swirls at component edges, especially at bases and connectors, can heat these edges significantly more than other surfaces. Overheating can occur (burns, melting of plastics)
337:
If the circuit board is double-sided then this printing, placement, reflow process may be repeated using either solder paste or glue to hold the components in place. If a
810:
code is used, as three digits would otherwise not convey enough information. This code consists of two digits and a letter: the digits denote the value's position in the
759:
Temperature sensitive nearby components must be shielded from heat to prevent damage, which requires additional time for every board. Shield must cover also from gas flow
427:
Higher density of connections because holes do not block routing space on inner layers, nor on back-side layers if components are mounted on only one side of the PCB.
310:
the pads on the circuit board. The surface tension of the molten solder helps keep the components in place, and if the solder pad geometries are correctly designed,
776:
437:
Lower resistance and inductance at the connection; consequently, fewer unwanted RF signal effects and better and more predictable high-frequency performance.
745:
Direct setting of target profile temperatures and gradients possible through direct control of component temperature in each individual soldering process.
679:
Precise, sometimes very complex, component-specific hot gas nozzles are needed to direct the hot gas to the target component. These can be very expensive.
603:
Direct setting of target profile temperatures and gradients possible through direct control of component temperature in each individual soldering process.
153:
if the part is above the limit of 30g per square inch of pad area. Adhesive is sometimes used to hold SMT components on the bottom side of a board if a
789:
Surface-mount components are usually smaller than their counterparts with leads, and are designed to be handled by machines rather than by humans. The
1523:
DerMarderosian, Aaron; Gionet, Vincent (1983). "The
Effects of Entrapped Bubbles in Solder Used for the Attachment of Leadless Ceramic Chip Carriers".
574:
With infrared soldering, the energy for heating up the solder joint is transmitted by long-, medium- or short-wave infrared electromagnetic radiation.
1562:
398:(AOI) systems are commonly used in PCB manufacturing. This technology has proven highly efficient for process improvements and quality achievements.
1628:
348:
After soldering, the boards may be washed to remove flux residues and any stray solder balls that could short out closely spaced component leads.
2082:
103:
An SMT component is usually smaller than its through-hole counterpart because it has either smaller leads or no leads at all. It may have short
508:
reflowing a solder paste in the SMT application. The presence of voids can deteriorate the joint strength and eventually lead to joint failure.
1358:
1116:
994:
692:
Losses due to environmental influences are not compensated for, since the component temperature is not measured in the production process
100:
technology often used for components not suitable for surface mounting such as large transformers and heat-sinked power semiconductors.
2023:
1454:
925:
175:
Different terms describe the components, technique, and machines used in manufacturing. These terms are listed in the following table:
2956:
617:
Temperature sensitive nearby components must be shielded from heat to prevent damage, which requires additional time for every board
1804:
1798:
1792:
1780:
1768:
1762:
1750:
1654:
1333:
434:
Better mechanical performance under shock and vibration conditions (partly due to lower mass, and partly due to less cantilevering)
384:
Finally, the boards are visually inspected for missing or misaligned components and solder bridging. If needed, they are sent to a
676:
Thermal capacity of the heat generator results in slow reaction whereby thermal profiles can be distorted (depends on system used)
512:
the unaided eye. This is a disadvantage for prototyping, repair, rework, reverse engineering, and possibly for production set-up.
444:(lower radiated emissions) due to the smaller radiation loop area (because of the smaller package) and the lesser lead inductance.
2597:
145:
allowing much higher circuit densities and smaller circuit boards and, in turn, machines or subassemblies containing the boards.
639:
During hot gas soldering, the energy for heating up the solder joint is transmitted by a hot gas. This can be air or inert gas (
920:
129:
1590:
17:
453:
Simpler and faster automated assembly. Some placement machines are capable of placing more than 136,000 components per hour.
2514:
1935:
1621:
345:
to the board prior to processing to prevent them from floating off when the solder paste holding them in place is melted.
2295:
2075:
3130:
1862:
1424:
1395:
915:
748:
No increased oxidation due to strong blowing of the solder joints with hot air, reduces flux wear or flux blowing away
723:
No requirement for different nozzles for many component shapes and sizes, reducing cost and the need to change nozzles
720:
Heat transfer does not depend entirely on the flow velocity of hot gas at the component/assembly surface (see hot gas)
606:
No increased oxidation due to strong blowing of the solder joints with hot air, reduces flux wear or flux blowing away
587:
No requirement for different nozzles for many component shapes and sizes, reducing cost and the need to change nozzles
2278:
2174:
2049:
It is relatively common to find packages that contain other components than their designated ones, such as diodes or
1992:
1872:
545:
Reworking usually corrects some type of error, either human- or machine-generated, and includes the following steps:
566:
There are essentially two non-contact soldering/desoldering methods: infrared soldering and soldering with hot gas.
286:
and tiny solder particles, is first applied to all the solder pads with a stainless steel or nickel stencil using a
2418:
2145:
1857:
695:
Creation of a suitable reflow profile requires an adjustment and test phase, in some cases involving several stages
825:
are marked like resistors, with two significant figures and a multiplier in units of picofarads or pF, (10 farad.)
2466:
2265:
1614:
1499:
1265:
717:
The low flow velocity hot air supporting the IR radiation improves heat transfer, but cannot blow away components
363:(derived from orange peels) which require extra rinsing or drying cycles. Water-soluble fluxes are removed with
2068:
500:
style protoboards can be used, some of which include pads for standard sized SMD components. For prototyping, "
1666:
729:
Heating even very large / long and exotically shaped components possible, depending on the type of top heater
441:
1011:
2497:
2249:
2018:
832:
capacitors with a similar dark grey appearance. These ferrite bead type are limited to small values in the
395:
128:. The design approach first demonstrated by IBM in 1960 in a small-scale computer was later applied in the
2301:
2238:
1901:
935:
930:
683:
case, adjacent components must be protected from the air flow, e.g. by covering them with polyimide tape.
1112:
Artifact: Digital
Computer Memory and Circuit Boards, LVDC, Saturn IB/V Guidance, Navigation and Control
3125:
2961:
2508:
1906:
1867:
1852:
1837:
1231:
388:
station where a human operator repairs any errors. They are then usually sent to the testing stations (
1064:
501:
2715:
2429:
2272:
2157:
751:
Documentation of the temperature elapsed on the component for each individual rework process possible
609:
Documentation of the temperature elapsed on the component for each individual rework process possible
1484:
1143:
2724:
2582:
2434:
2290:
1697:
1110:
900:
302:
pick-and-place machines remove the parts from the tapes, tubes or trays and place them on the PCB.
133:
526:
2735:
2455:
2254:
2038:
1877:
1157:
955:
950:
421:
Much higher component density (components per unit area) and many more connections per component.
295:
96:
738:
No compressed air required for the heating process (some systems use compressed air for cooling)
584:
No compressed air required for the heating process (some systems use compressed air for cooling)
3120:
2904:
2471:
2336:
2312:
1847:
1821:
1207:
985:
248:
742:
process adapts itself automatically. Enables (re)entry into the profile even on hot assemblies
600:
process adapts itself automatically. Enables (re)entry into the profile even on hot assemblies
2973:
2925:
2746:
2562:
2477:
2408:
2244:
2028:
1997:
1637:
1039:
940:
860:
668:
Rapid cooling after reflow, resulting in small-grained solder joints (depends on system used)
471:
263:
84:
1441:
83:, is a method in which the electrical components are mounted directly onto the surface of a
3047:
2791:
2686:
2460:
2353:
2207:
2168:
2099:
2091:
2013:
1896:
1842:
1689:
1387:
790:
533:
8:
2767:
2675:
2567:
2403:
2380:
1955:
1678:
771:
450:
Lower initial cost and time of setting up for mass production, using automated equipment.
410:
SMD resistors in original packaging - this packaging allows for use in a mounting machine
159:
3072:
2932:
2640:
2607:
2423:
2307:
2285:
1982:
1972:
1544:
1472:
1131:
892:
104:
1080:
735:
Gentle reflow process with low surface temperatures, assuming correct profile settings
593:
Gentle reflow process with low surface temperatures, assuming correct profile settings
3067:
2988:
2879:
2831:
2660:
2587:
2549:
2050:
1911:
1536:
1450:
1420:
1391:
1084:
377:
369:
299:
283:
1548:
653:
Standard and component-specific nozzles allow high reliability and faster processing
2783:
2730:
2557:
2196:
1528:
1076:
306:
2592:
1586:
726:
Adjustment of the heating surface possible through various attachments if required
3060:
2993:
2846:
2577:
2487:
2331:
1987:
1940:
1930:
662:
Even heating of the affected board area (depends on system / nozzle quality used)
447:
Fewer holes need to be drilled. (Drilling PCBs is time-consuming and expensive.)
389:
364:
311:
287:
112:
35:
2218:
3035:
2816:
2806:
2572:
2375:
1945:
1443:
High Speed
Amplifier Techniques - A Designer's Companion for Wideband Circuitry
856:
822:
793:
has standardized package shapes and sizes (the leading standardisation body is
539:
493:
338:
291:
154:
3114:
3097:
2920:
2836:
2655:
2482:
2450:
1540:
1532:
1088:
620:
On short wavelength IR only: Surface temperature depends on the component's
2978:
2966:
2854:
2821:
2650:
2635:
2202:
905:
837:
784:
732:
Very uniform heating possible, assuming high quality hybrid heating systems
665:
Temperature of the component will never exceed the adjusted gas temperature
330:
290:
process. It can also be applied by a jet-printing mechanism, similar to an
279:
258:
PCB assembly line: pick-and-place machine followed by an SMT soldering oven
39:
707:
Hybrid rework systems combine medium-wave infrared radiation with hot air
243:
87:(PCB). An electrical component mounted in this manner is referred to as a
3020:
2762:
2711:
2617:
2602:
2385:
2347:
1606:
1384:
EMC and the
Printed Circuit Board: Design, Theory, and Layout Made Simple
910:
356:
353:
192:
Surface-mount devices (active, passive and electromechanical components)
150:
108:
2060:
1359:"Surface Mount Technology Advantages and Disadvantages for PCB Assembly"
3092:
3082:
3015:
2889:
2859:
2826:
2801:
2796:
2773:
2645:
2625:
2503:
2365:
2342:
2228:
2130:
2125:
2120:
845:
811:
590:
Very uniform heating possible, assuming high quality IR heating systems
497:
489:
482:
326:
65:
1290:"PCB Manufacturer with HDI Circuit Board fabrication for PCB and PCBA"
1182:
414:
The main advantages of SMT over the older through-hole technique are:
46:
3055:
2899:
2894:
2884:
2811:
2691:
2525:
2520:
2445:
2370:
1977:
960:
833:
137:
51:
1314:
3077:
3025:
3005:
2983:
2869:
2864:
2752:
2741:
2670:
2440:
1416:
1040:"(SMT) Surface-Mount Technology: Meaning, Definition, and Examples"
965:
886:
640:
521:
360:
325:
lamps; this is called infrared reflow. Another is to use a hot gas
322:
141:
406:
392:
and/or functional testing) to verify that they operate correctly.
254:
2937:
2874:
2696:
2681:
2535:
2492:
2140:
552:
Remove residual solder (may be not required for some components)
329:. Another technology which is becoming popular again is special
3010:
2701:
2665:
2630:
2190:
2162:
2135:
2110:
1786:
1774:
1756:
1744:
1672:
1660:
1289:
1012:"Surface Mount Technology - an overview | ScienceDirect Topics"
621:
555:
Print solder paste on PCB, directly or by dispensing or dipping
271:
62:
57:
1411:
Judd, Mike; Brindley, Keith (1999). "CS soldering processes".
656:
Allow reproducible soldering profiles (depends on system used)
376:
Certain manufacturing standards, such as those written by the
200:
Surface-mount technology (assembling and mounting technology)
30:
3087:
2998:
2757:
2530:
2323:
2185:
2180:
1738:
1732:
1726:
1720:
1646:
794:
349:
1338:
Electronics
Tutorial | The Best Electronics Tutorial Website
987:
Status of the
Technology Industry Activities and Action Plan
538:
Defective surface-mount components can be repaired by using
481:
Many types of SMT component packages cannot be installed in
456:
Many SMT parts cost less than equivalent through-hole parts.
424:
Components can be placed on both sides of the circuit board.
3030:
2413:
2359:
2260:
2213:
2151:
1714:
1708:
1702:
945:
871:
659:
Efficient heating, large amounts of heat can be transferred
342:
1563:"Two Prevalent Rework Heating Methods--Which One is Best?"
1315:"3D Solder Joint Reconstruction on SMD based on 2D Images"
775:
Example of component sizes, metric and imperial codes for
68:, placed upon a British postage stamp for size comparison.
863:
is also available, although these lists are not complete.
650:
Some systems allow switching between hot air and nitrogen
624:: dark surfaces will be heated more than lighter surfaces
596:
Fast reaction of infrared source (depends on system used)
267:
125:
1334:"Surface Mount Technology Advantages and Disadvantages"
107:
or leads of various styles, flat contacts, a matrix of
95:). In industry, this approach has largely replaced the
124:
of the pioneering work in this technology was done by
814:
of values, while the letter indicates the multiplier.
630:
No reflow atmosphere possible (but also not required)
1522:
882:
431:
aligned and cannot move laterally out of alignment.)
1102:
993:. Surface Mount Technology. Surface Mount Council.
762:
Convective loss of energy at the component possible
627:
Convective loss of energy at the component possible
378:
IPC - Association
Connecting Electronics Industries
314:automatically aligns the components on their pads.
208:Surface-mount assembly (module assembled with SMT)
232:Surface-mount equipment (SMT assembling machines)
352:flux is removed with fluorocarbon solvents, high
115:), or terminations on the body of the component.
3112:
1579:
1382:Montrose, Mark I. (1999). "Components and EMC".
1266:"SMT Manufacturing: Everything You Need to Know"
216:Surface-mount components (components for SMT)
2076:
1622:
1498:Dr. Lee, Ning-Cheng; Hance, Wanda B. (1993).
294:. After pasting, the boards proceed to the
1497:
1410:
1404:
1062:
1375:
470:SMDs' solder connections may be damaged by
2083:
2069:
2024:List of integrated circuit packaging types
1636:
1629:
1615:
1491:
1433:
926:List of integrated circuit packaging types
488:SMDs cannot be used directly with plug-in
2090:
1312:
1439:
1381:
983:
770:
520:
474:compounds going through thermal cycling.
405:
341:process is used, then the parts must be
253:
242:
224:Surface-mount packages (SMD case forms)
56:
45:
29:
27:Method for producing electronic circuits
1681:(SOD-123 / SOD-323 / SOD-523 / SOD-923)
1516:
262:Where components are to be placed, the
170:
14:
3113:
1357:Team, VSE | Engineering (2020-05-07).
1232:"No-clean is a process, not a product"
1108:
1038:Staff, History Computer (2022-05-19).
977:
921:List of electronics package dimensions
525:Removal of surface-mount device using
305:The boards are then conveyed into the
238:
2064:
1610:
1063:Garner, R.; Taylor, D. (1 May 1986).
1037:
359:solvents, or low flash solvents e.g.
2515:Three-dimensional integrated circuit
1356:
1180:
1033:
1031:
702:
321:for reflowing solder. One is to use
2296:Programmable unijunction transistor
1331:
1263:
549:Melt solder and remove component(s)
24:
2197:Multi-gate field-effect transistor
916:Electronics manufacturing services
25:
3142:
2175:Insulated-gate bipolar transistor
1413:Soldering in Electronics Assembly
1158:"Reflow of double sided assembly"
1028:
800:
2419:Heterostructure barrier varactor
2146:Chemical field-effect transistor
1181:Jena, Hanings (4 January 2016).
1000:from the original on 2015-12-28.
885:
460:
2467:Mixed-signal integrated circuit
1593:from the original on 2015-12-28
1555:
1460:from the original on 2015-12-28
1350:
1325:
1306:
1282:
1257:
1248:
1119:from the original on 2015-12-28
558:Place new component and reflow.
130:Launch Vehicle Digital Computer
1663:(DO-7 / DO-26 / DO-35 / DO-41)
1313:Vitoriano, Pedro (June 2016).
1224:
1200:
1174:
1150:
1056:
1004:
270:-lead, silver, or gold plated
34:Surface-mount components on a
13:
1:
1525:Reliability Physics Symposium
1504:Indium Corporation Tech Paper
1254:IPC-A-610E, paragraph 10.6.3.
1081:10.1016/S0026-2692(86)80170-7
971:
401:
2498:Silicon controlled rectifier
2360:Organic light-emitting diode
2250:Diffused junction transistor
2053:in transistor packages, etc.
2019:Integrated circuit packaging
1183:"PCB Assembly - Description"
984:Williams, Paul, ed. (1999).
504:" breadboarding can be used.
396:Automated optical inspection
7:
2302:Static induction transistor
2239:Bipolar junction transistor
2191:MOS field-effect transistor
2163:Fin field-effect transistor
1500:"Voiding Mechanisms in SMT"
1332:Das, Santosh (2019-10-01).
936:Point-to-point construction
931:Plastic leaded chip carrier
878:
766:
569:
496:may be used. Additionally,
385:
274:pads without holes, called
266:normally has flat, usually
10:
3147:
2509:Static induction thyristor
1453:. pp. 26–29, 98–121.
782:
634:
531:
373:component density boards.
118:
3131:Electronics manufacturing
3046:
2946:
2913:
2845:
2782:
2710:
2678:(Hexode, Heptode, Octode)
2616:
2548:
2430:Hybrid integrated circuit
2394:
2322:
2273:Light-emitting transistor
2227:
2109:
2098:
2047:
2006:
1954:
1923:
1886:
1830:
1814:
1688:
1644:
1065:"Surface mount packaging"
901:Board-to-board connectors
516:
2725:Backward-wave oscillator
2435:Light emitting capacitor
2291:Point-contact transistor
2261:Junction Gate FET (JFET)
2034:Surface-mount technology
1533:10.1109/IRPS.1983.361989
1069:Microelectronics Journal
73:Surface-mount technology
2736:Crossed-field amplifier
2255:Field-effect transistor
2039:Through-hole technology
956:Through-hole technology
951:SMT placement equipment
851:Discrete semiconductors
779:and comparison included
296:pick-and-place machines
249:pick-and-place machines
97:through-hole technology
2905:Voltage-regulator tube
2472:MOS integrated circuit
2337:Constant-current diode
2313:Unijunction transistor
1669:(MELF / SOD-80 / LL34)
1638:Semiconductor packages
1440:Williams, Jim (1991).
780:
529:
411:
317:There are a number of
282:, a sticky mixture of
259:
251:
69:
54:
43:
2974:Electrolytic detector
2747:Inductive output tube
2563:Low-dropout regulator
2478:Organic semiconductor
2409:Printed circuit board
2245:Darlington transistor
2092:Electronic components
2029:Printed circuit board
1208:"Why Clean No-Clean?"
1162:SURFACE MOUNT PROCESS
1016:www.sciencedirect.com
941:Printed circuit board
777:two-terminal packages
774:
524:
409:
264:printed circuit board
257:
246:
85:printed circuit board
79:), originally called
60:
49:
33:
18:Surface Mount Devices
2792:Beam deflection tube
2461:Metal-oxide varistor
2354:Light-emitting diode
2208:Thin-film transistor
2169:Floating-gate MOSFET
2014:Electronic packaging
791:electronics industry
534:Rework (electronics)
171:Common abbreviations
89:surface-mount device
2768:Traveling-wave tube
2568:Switching regulator
2404:Printed electronics
2381:Step recovery diode
2158:Depletion-load NMOS
1587:"Resistor SMD code"
1567:smt.iconnect007.com
1294:www.hemeixinpcb.com
1109:Schneeweis, Scott.
866:Integrated circuits
418:Smaller components.
247:Assembly line with
239:Assembly techniques
3073:Crystal oscillator
2933:Variable capacitor
2608:Switched capacitor
2550:Voltage regulators
2424:Integrated circuit
2308:Tetrode transistor
2286:Pentode transistor
2279:Organic LET (OLET)
2266:Organic FET (OFET)
2051:voltage regulators
1589:. Resistor Guide.
1388:Wiley-Interscience
893:Electronics portal
781:
530:
527:soldering tweezers
412:
390:in-circuit testing
370:conformal coatings
260:
252:
70:
55:
44:
3126:Electronic design
3108:
3107:
3068:Ceramic resonator
2880:Mercury-arc valve
2832:Video camera tube
2784:Cathode-ray tubes
2544:
2543:
2152:Complementary MOS
2058:
2057:
1807:(Super-247) (SMT)
1801:(Super-220) (SMT)
1675:(SMA / SMB / SMC)
1451:Linear Technology
1321:. pp. 82–93.
1264:Ayodele, Abiola.
1212:Assembly Magazine
861:similar .pdf list
703:Hybrid technology
300:Numerical control
236:
235:
16:(Redirected from
3138:
2962:electrical power
2847:Gas-filled tubes
2731:Cavity magnetron
2558:Linear regulator
2107:
2106:
2085:
2078:
2071:
2062:
2061:
1631:
1624:
1617:
1608:
1607:
1602:
1601:
1599:
1598:
1583:
1577:
1576:
1574:
1573:
1559:
1553:
1552:
1520:
1514:
1513:
1511:
1510:
1495:
1489:
1488:
1482:
1478:
1476:
1468:
1466:
1465:
1459:
1448:
1437:
1431:
1430:
1408:
1402:
1401:
1379:
1373:
1372:
1370:
1369:
1354:
1348:
1347:
1345:
1344:
1329:
1323:
1322:
1310:
1304:
1303:
1301:
1300:
1286:
1280:
1279:
1277:
1276:
1261:
1255:
1252:
1246:
1245:
1243:
1242:
1228:
1222:
1221:
1219:
1218:
1204:
1198:
1197:
1195:
1193:
1178:
1172:
1171:
1169:
1168:
1154:
1148:
1147:
1141:
1137:
1135:
1127:
1125:
1124:
1106:
1100:
1099:
1097:
1095:
1060:
1054:
1053:
1051:
1050:
1044:History-Computer
1035:
1026:
1025:
1023:
1022:
1008:
1002:
1001:
999:
992:
981:
895:
890:
889:
857:correlation list
844:
307:reflow soldering
178:
177:
160:selective solder
136:that guided all
21:
3146:
3145:
3141:
3140:
3139:
3137:
3136:
3135:
3111:
3110:
3109:
3104:
3042:
2957:audio and video
2942:
2909:
2841:
2778:
2706:
2687:Photomultiplier
2612:
2540:
2488:Quantum circuit
2396:
2390:
2332:Avalanche diode
2318:
2230:
2223:
2112:
2101:
2094:
2089:
2059:
2054:
2043:
2002:
1950:
1919:
1882:
1826:
1810:
1684:
1640:
1635:
1605:
1596:
1594:
1585:
1584:
1580:
1571:
1569:
1561:
1560:
1556:
1521:
1517:
1508:
1506:
1496:
1492:
1480:
1479:
1470:
1469:
1463:
1461:
1457:
1446:
1438:
1434:
1427:
1419:. p. 128.
1409:
1405:
1398:
1380:
1376:
1367:
1365:
1355:
1351:
1342:
1340:
1330:
1326:
1311:
1307:
1298:
1296:
1288:
1287:
1283:
1274:
1272:
1262:
1258:
1253:
1249:
1240:
1238:
1230:
1229:
1225:
1216:
1214:
1206:
1205:
1201:
1191:
1189:
1179:
1175:
1166:
1164:
1156:
1155:
1151:
1139:
1138:
1129:
1128:
1122:
1120:
1115:. Spaceaholic.
1107:
1103:
1093:
1091:
1061:
1057:
1048:
1046:
1036:
1029:
1020:
1018:
1010:
1009:
1005:
997:
990:
982:
978:
974:
891:
884:
881:
842:
823:film capacitors
803:
787:
769:
705:
672:Disadvantages:
637:
613:Disadvantages:
572:
540:soldering irons
536:
519:
463:
442:EMC performance
404:
365:deionized water
312:surface tension
288:screen printing
241:
173:
134:Instrument Unit
121:
81:planar mounting
36:USB flash drive
28:
23:
22:
15:
12:
11:
5:
3144:
3134:
3133:
3128:
3123:
3106:
3105:
3103:
3102:
3101:
3100:
3095:
3085:
3080:
3075:
3070:
3065:
3064:
3063:
3052:
3050:
3044:
3043:
3041:
3040:
3039:
3038:
3036:Wollaston wire
3028:
3023:
3018:
3013:
3008:
3003:
3002:
3001:
2996:
2986:
2981:
2976:
2971:
2970:
2969:
2964:
2959:
2950:
2948:
2944:
2943:
2941:
2940:
2935:
2930:
2929:
2928:
2917:
2915:
2911:
2910:
2908:
2907:
2902:
2897:
2892:
2887:
2882:
2877:
2872:
2867:
2862:
2857:
2851:
2849:
2843:
2842:
2840:
2839:
2834:
2829:
2824:
2819:
2817:Selectron tube
2814:
2809:
2807:Magic eye tube
2804:
2799:
2794:
2788:
2786:
2780:
2779:
2777:
2776:
2771:
2765:
2760:
2755:
2750:
2744:
2739:
2733:
2728:
2721:
2719:
2708:
2707:
2705:
2704:
2699:
2694:
2689:
2684:
2679:
2673:
2668:
2663:
2658:
2653:
2648:
2643:
2638:
2633:
2628:
2622:
2620:
2614:
2613:
2611:
2610:
2605:
2600:
2595:
2590:
2585:
2580:
2575:
2570:
2565:
2560:
2554:
2552:
2546:
2545:
2542:
2541:
2539:
2538:
2533:
2528:
2523:
2518:
2512:
2506:
2501:
2495:
2490:
2485:
2480:
2475:
2469:
2464:
2458:
2453:
2448:
2443:
2438:
2432:
2427:
2421:
2416:
2411:
2406:
2400:
2398:
2392:
2391:
2389:
2388:
2383:
2378:
2376:Schottky diode
2373:
2368:
2363:
2357:
2351:
2345:
2340:
2334:
2328:
2326:
2320:
2319:
2317:
2316:
2310:
2305:
2299:
2293:
2288:
2283:
2282:
2281:
2270:
2269:
2268:
2263:
2252:
2247:
2242:
2235:
2233:
2225:
2224:
2222:
2221:
2216:
2211:
2205:
2200:
2194:
2188:
2183:
2178:
2172:
2166:
2160:
2155:
2149:
2143:
2138:
2133:
2128:
2123:
2117:
2115:
2104:
2096:
2095:
2088:
2087:
2080:
2073:
2065:
2056:
2055:
2048:
2045:
2044:
2042:
2041:
2036:
2031:
2026:
2021:
2016:
2010:
2008:
2007:Related topics
2004:
2003:
2001:
2000:
1995:
1990:
1985:
1980:
1975:
1970:
1967:
1964:
1960:
1958:
1952:
1951:
1949:
1948:
1943:
1938:
1933:
1927:
1925:
1921:
1920:
1918:
1917:
1914:
1909:
1904:
1899:
1894:
1890:
1888:
1884:
1883:
1881:
1880:
1875:
1873:TSSOP / HTSSOP
1870:
1865:
1860:
1855:
1850:
1845:
1840:
1834:
1832:
1828:
1827:
1825:
1824:
1818:
1816:
1812:
1811:
1809:
1808:
1802:
1796:
1790:
1784:
1778:
1772:
1766:
1760:
1754:
1748:
1742:
1736:
1730:
1724:
1718:
1712:
1706:
1700:
1694:
1692:
1686:
1685:
1683:
1682:
1676:
1670:
1664:
1658:
1651:
1649:
1642:
1641:
1634:
1633:
1626:
1619:
1611:
1604:
1603:
1578:
1554:
1515:
1490:
1432:
1426:978-0750635455
1425:
1415:(2 ed.).
1403:
1397:978-0780347038
1396:
1390:. p. 64.
1374:
1349:
1324:
1305:
1281:
1256:
1247:
1223:
1199:
1187:www.ourpcb.com
1173:
1149:
1101:
1055:
1027:
1003:
975:
973:
970:
969:
968:
963:
958:
953:
948:
943:
938:
933:
928:
923:
918:
913:
908:
903:
897:
896:
880:
877:
876:
875:
867:
864:
852:
849:
829:
826:
818:
815:
807:
802:
801:Identification
799:
783:Main article:
768:
765:
764:
763:
760:
755:Disadvantages
753:
752:
749:
746:
743:
739:
736:
733:
730:
727:
724:
721:
718:
715:
704:
701:
700:
699:
696:
693:
690:
687:
684:
680:
677:
670:
669:
666:
663:
660:
657:
654:
651:
636:
633:
632:
631:
628:
625:
618:
611:
610:
607:
604:
601:
597:
594:
591:
588:
585:
582:
571:
568:
560:
559:
556:
553:
550:
532:Main article:
518:
515:
514:
513:
509:
505:
494:breakout board
486:
479:
475:
468:
462:
459:
458:
457:
454:
451:
448:
445:
438:
435:
432:
428:
425:
422:
419:
403:
400:
339:wave soldering
292:inkjet printer
240:
237:
234:
233:
230:
226:
225:
222:
218:
217:
214:
210:
209:
206:
202:
201:
198:
194:
193:
190:
186:
185:
184:Expanded form
182:
172:
169:
155:wave soldering
120:
117:
50:Surface-mount
26:
9:
6:
4:
3:
2:
3143:
3132:
3129:
3127:
3124:
3122:
3121:Chip carriers
3119:
3118:
3116:
3099:
3098:mercury relay
3096:
3094:
3091:
3090:
3089:
3086:
3084:
3081:
3079:
3076:
3074:
3071:
3069:
3066:
3062:
3059:
3058:
3057:
3054:
3053:
3051:
3049:
3045:
3037:
3034:
3033:
3032:
3029:
3027:
3024:
3022:
3019:
3017:
3014:
3012:
3009:
3007:
3004:
3000:
2997:
2995:
2992:
2991:
2990:
2987:
2985:
2982:
2980:
2977:
2975:
2972:
2968:
2965:
2963:
2960:
2958:
2955:
2954:
2952:
2951:
2949:
2945:
2939:
2936:
2934:
2931:
2927:
2924:
2923:
2922:
2921:Potentiometer
2919:
2918:
2916:
2912:
2906:
2903:
2901:
2898:
2896:
2893:
2891:
2888:
2886:
2883:
2881:
2878:
2876:
2873:
2871:
2868:
2866:
2863:
2861:
2858:
2856:
2853:
2852:
2850:
2848:
2844:
2838:
2837:Williams tube
2835:
2833:
2830:
2828:
2825:
2823:
2820:
2818:
2815:
2813:
2810:
2808:
2805:
2803:
2800:
2798:
2795:
2793:
2790:
2789:
2787:
2785:
2781:
2775:
2772:
2769:
2766:
2764:
2761:
2759:
2756:
2754:
2751:
2748:
2745:
2743:
2740:
2737:
2734:
2732:
2729:
2726:
2723:
2722:
2720:
2717:
2713:
2709:
2703:
2700:
2698:
2695:
2693:
2690:
2688:
2685:
2683:
2680:
2677:
2674:
2672:
2669:
2667:
2664:
2662:
2659:
2657:
2656:Fleming valve
2654:
2652:
2649:
2647:
2644:
2642:
2639:
2637:
2634:
2632:
2629:
2627:
2624:
2623:
2621:
2619:
2615:
2609:
2606:
2604:
2601:
2599:
2596:
2594:
2591:
2589:
2586:
2584:
2581:
2579:
2576:
2574:
2571:
2569:
2566:
2564:
2561:
2559:
2556:
2555:
2553:
2551:
2547:
2537:
2534:
2532:
2529:
2527:
2524:
2522:
2519:
2516:
2513:
2510:
2507:
2505:
2502:
2499:
2496:
2494:
2491:
2489:
2486:
2484:
2483:Photodetector
2481:
2479:
2476:
2473:
2470:
2468:
2465:
2462:
2459:
2457:
2454:
2452:
2451:Memtransistor
2449:
2447:
2444:
2442:
2439:
2436:
2433:
2431:
2428:
2425:
2422:
2420:
2417:
2415:
2412:
2410:
2407:
2405:
2402:
2401:
2399:
2393:
2387:
2384:
2382:
2379:
2377:
2374:
2372:
2369:
2367:
2364:
2361:
2358:
2355:
2352:
2349:
2346:
2344:
2341:
2338:
2335:
2333:
2330:
2329:
2327:
2325:
2321:
2314:
2311:
2309:
2306:
2303:
2300:
2297:
2294:
2292:
2289:
2287:
2284:
2280:
2277:
2276:
2274:
2271:
2267:
2264:
2262:
2259:
2258:
2256:
2253:
2251:
2248:
2246:
2243:
2240:
2237:
2236:
2234:
2232:
2226:
2220:
2217:
2215:
2212:
2209:
2206:
2204:
2201:
2198:
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2100:Semiconductor
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1797:
1795:(D3PAK) (SMT)
1794:
1791:
1789:(D2PAK) (SMT)
1788:
1785:
1783:(I2PAK) (SMT)
1782:
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461:Disadvantages
455:
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78:
74:
67:
64:
59:
53:
48:
41:
37:
32:
19:
2855:Cold cathode
2822:Storage tube
2712:Vacuum tubes
2661:Neutron tube
2636:Beam tetrode
2618:Vacuum tubes
2203:Power MOSFET
2033:
1998:WL-CSP / WLP
1868:TSOP / HTSOP
1777:(DPAK) (SMT)
1771:(IPAK) (SMT)
1765:(TH / Panel)
1759:(TH / Panel)
1753:(TH / Panel)
1747:(TH / Panel)
1735:(TH / Panel)
1705:(TH / Panel)
1595:. Retrieved
1581:
1570:. Retrieved
1566:
1557:
1524:
1518:
1507:. Retrieved
1503:
1493:
1462:. Retrieved
1442:
1435:
1412:
1406:
1383:
1377:
1366:. Retrieved
1362:
1352:
1341:. Retrieved
1337:
1327:
1319:SMT Magazine
1318:
1308:
1297:. Retrieved
1293:
1284:
1273:. Retrieved
1269:
1259:
1250:
1239:. Retrieved
1235:
1226:
1215:. Retrieved
1211:
1202:
1190:. Retrieved
1186:
1176:
1165:. Retrieved
1161:
1152:
1121:. Retrieved
1111:
1104:
1092:. Retrieved
1072:
1068:
1058:
1047:. Retrieved
1043:
1019:. Retrieved
1015:
1006:
986:
979:
906:Chip carrier
838:ferrite core
788:
785:Chip carrier
754:
710:Advantages:
709:
706:
671:
646:Advantages:
645:
638:
612:
577:Advantages:
576:
573:
565:
561:
544:
537:
413:
394:
383:
375:
347:
336:
331:fluorocarbon
318:
316:
304:
280:Solder paste
275:
261:
174:
165:
151:reflow ovens
147:
132:used in the
122:
109:solder balls
102:
92:
88:
80:
76:
72:
71:
40:ferrite bead
3021:Transformer
2763:Sutton tube
2603:Charge pump
2456:Memory cell
2386:Zener diode
2348:Laser diode
2231:transistors
2113:transistors
1916:QUIP / QUIL
1527:: 235–241.
1481:|work=
1236:www.ipc.org
1140:|work=
1075:(3): 5–13.
911:Electronics
490:breadboards
357:hydrocarbon
354:flash point
276:solder pads
3115:Categories
3093:reed relay
3083:Parametron
3016:Thermistor
2994:resettable
2953:Connector
2914:Adjustable
2890:Nixie tube
2860:Crossatron
2827:Trochotron
2802:Iconoscope
2797:Charactron
2774:X-ray tube
2646:Compactron
2626:Acorn tube
2583:Buck–boost
2504:Solaristor
2366:Photodiode
2343:Gunn diode
2339:(CLD, CRD)
2121:Transistor
1924:Grid array
1863:SOP / SSOP
1815:Single row
1698:SOT / TSOT
1597:2015-12-28
1572:2018-07-27
1509:2015-12-28
1464:2015-12-28
1368:2022-09-30
1343:2022-09-30
1299:2022-09-30
1275:2022-09-30
1241:2017-10-03
1217:2017-10-03
1192:7 February
1167:2020-09-16
1123:2015-12-28
1094:19 January
1049:2022-09-30
1021:2022-09-30
972:References
817:Capacitors
812:E96 Series
714:Easy setup
581:Easy setup
498:stripboard
402:Advantages
327:convection
319:techniques
66:transistor
3056:Capacitor
2900:Trigatron
2895:Thyratron
2885:Neon lamp
2812:Monoscope
2692:Phototube
2676:Pentagrid
2641:Barretter
2526:Trancitor
2521:Thyristor
2446:Memristor
2371:PIN diode
2148:(ChemFET)
1978:Flip Chip
1897:QIP / QIL
1858:SO / SOIC
1848:Flat Pack
1843:DIP / DIL
1822:SIP / SIL
1690:3...5-pin
1541:0735-0791
1483:ignored (
1473:cite book
1142:ignored (
1132:cite book
1089:0026-2692
961:Wire wrap
834:nanohenry
828:Inductors
806:Resistors
467:detached.
138:Saturn IB
52:capacitor
3078:Inductor
3048:Reactive
3026:Varistor
3006:Resistor
2984:Antifuse
2870:Ignitron
2865:Dekatron
2753:Klystron
2742:Gyrotron
2671:Nuvistor
2588:Split-pi
2474:(MOS IC)
2441:Memistor
2199:(MuGFET)
2193:(MOSFET)
2165:(FinFET)
1887:Quad row
1831:Dual row
1591:Archived
1549:11459596
1455:Archived
1270:Wevolver
1117:Archived
995:Archived
966:RKM code
879:See also
859:, and a
767:Packages
641:nitrogen
570:Infrared
502:dead bug
361:limonene
323:infrared
181:SMp term
142:Saturn V
2979:Ferrite
2947:Passive
2938:Varicap
2926:digital
2875:Krytron
2697:Tetrode
2682:Pentode
2536:Varicap
2517:(3D IC)
2493:RF CMOS
2397:devices
2171:(FGMOS)
2102:devices
1657:(DO-27)
1645:Single
635:Hot gas
483:sockets
472:potting
440:Better
119:History
3011:Switch
2702:Triode
2666:Nonode
2631:Audion
2511:(SITh)
2395:Other
2362:(OLED)
2324:Diodes
2275:(LET)
2257:(FET)
2229:Other
2177:(IGBT)
2154:(CMOS)
2141:BioFET
2136:BiCMOS
1805:TO-274
1799:TO-273
1793:TO-268
1787:TO-263
1781:TO-262
1775:TO-252
1769:TO-251
1763:TO-247
1757:TO-220
1751:TO-202
1745:TO-126
1673:DO-214
1667:DO-213
1661:DO-204
1655:DO-201
1547:
1539:
1423:
1417:Newnes
1394:
1087:
843:
622:albedo
517:Rework
386:rework
272:copper
63:MOSFET
3088:Relay
3061:types
2999:eFUSE
2770:(TWT)
2758:Maser
2749:(IOT)
2738:(CFA)
2727:(BWO)
2651:Diode
2598:SEPIC
2578:Boost
2531:TRIAC
2500:(SCR)
2463:(MOV)
2437:(LEC)
2356:(LED)
2315:(UJT)
2304:(SIT)
2298:(PUT)
2241:(BJT)
2210:(TFT)
2186:LDMOS
2181:ISFET
1956:Wafer
1739:TO-92
1733:TO-66
1727:TO-39
1721:TO-18
1647:diode
1545:S2CID
1458:(PDF)
1447:(PDF)
998:(PDF)
991:(PDF)
795:JEDEC
350:Rosin
343:glued
3031:Wire
2989:Fuse
2573:Buck
2426:(IC)
2414:DIAC
2350:(LD)
2219:UMOS
2214:VMOS
2131:PMOS
2126:NMOS
2111:MOS
1993:UICC
1936:eWLB
1902:PLCC
1853:MSOP
1741:(TH)
1729:(TH)
1723:(TH)
1717:(TH)
1715:TO-8
1711:(TH)
1709:TO-5
1703:TO-3
1537:ISSN
1485:help
1421:ISBN
1392:ISBN
1194:2018
1144:help
1096:2021
1085:ISSN
946:RoHS
872:logo
284:flux
229:SME
221:SMP
213:SMC
205:SMA
197:SMT
189:SMD
140:and
113:BGAs
105:pins
2593:Ćuk
1983:PoP
1973:CSP
1969:COG
1966:COF
1963:COB
1946:PGA
1941:LGA
1931:BGA
1912:QFP
1907:QFN
1893:LCC
1878:ZIP
1838:DFN
1679:SOD
1529:doi
1363:VSE
1077:doi
797:).
643:).
278:.
268:tin
126:IBM
93:SMD
77:SMT
3117::
2967:RF
2716:RF
1988:QP
1565:.
1543:.
1535:.
1502:.
1477::
1475:}}
1471:{{
1449:.
1386:.
1361:.
1336:.
1317:.
1292:.
1268:.
1234:.
1210:.
1185:.
1160:.
1136::
1134:}}
1130:{{
1083:.
1073:17
1071:.
1067:.
1042:.
1030:^
1014:.
846:μH
61:A
2718:)
2714:(
2084:e
2077:t
2070:v
1630:e
1623:t
1616:v
1600:.
1575:.
1551:.
1531::
1512:.
1487:)
1467:.
1429:.
1400:.
1371:.
1346:.
1302:.
1278:.
1244:.
1220:.
1196:.
1170:.
1146:)
1126:.
1098:.
1079::
1052:.
1024:.
874:.
848:.
111:(
91:(
75:(
42:.
20:)
Text is available under the Creative Commons Attribution-ShareAlike License. Additional terms may apply.
