430:
467:(the propagation velocity depends on the dielectric and the geometry). Reflections of previous pulses at impedance mismatches die down after a few bounces up and down the line (i.e. on the order of the flight time). At low bit rates, the echoes die down on their own, and by midpulse, they are not a concern. Impedance matching is neither necessary nor desirable. There are many circuit board types other than FR-4, but usually they are more costly to manufacture.
577:
17:
589:
76:, and inter-system connections. While there are some common themes at these various levels, there are also practical considerations, in particular the interconnect flight time versus the bit period, that cause substantial differences in the approach to signal integrity for on-chip connections versus chip-to-chip connections.
541:
remain acutely aware of not only the intended signal path for every signal, but also the path of returning signal current for every signal. The signal itself and its returning signal current path are equally capable of generating inductive crosstalk. Differential trace pairs help to reduce these effects.
318:
associated with the layout. Usually worst-case parasitics and best-case parasitics are extracted and used in the simulations. For ICs, unlike PCBs, physical measurement of the parasitics is almost never done, since in-situ measurements with external equipment are extremely difficult. Furthermore, any
540:
As a consequence of the low impedance required by matching, PCB signal traces carry much more current than their on-chip counterparts. This larger current induces crosstalk primarily in a magnetic or inductive mode as opposed to a capacitive mode. To combat this crosstalk, digital PCB designers must
131:
On printed circuit boards, signal integrity became a serious concern when the transition (rise and fall) times of signals started to become comparable to the propagation time across the board. Very roughly speaking, this typically happens when system speeds exceed a few tens of MHz. At first, only a
111:
Signal integrity primarily involves the electrical performance of the wires and other packaging structures used to move signals about within an electronic product. Such performance is a matter of basic physics and as such has remained relatively unchanged since the inception of electronic signaling.
244:
In digital ICs, noise in a signal of interest arises primarily from coupling effects from switching of other signals. Increasing interconnect density has led to each wire having neighbors that are physically closer together, leading to increased crosstalk between neighboring nets. As circuits have
717:
tools that help the engineer perform all these steps on each signal in a design, pointing out problems or verifying the design is ready for manufacture. In selecting which tool is best for a particular task, one must consider characteristics of each such as capacity (how many nodes or elements),
59:
and over longer distances or through various mediums, various effects can degrade the electrical signal to the point where errors occur and the system or device fails. Signal integrity engineering is the task of analyzing and mitigating these effects. It is an important activity at all levels of
132:
few of the most important, or highest speed, signals needed detailed analysis or design. As speeds increased, a larger and larger fraction of signals needed SI analysis and design practices. In modern (> 100 MHz) circuit designs, essentially all signals must be designed with SI in mind.
512:
At these new multigigabit/s bit rates, the bit period is shorter than the flight time; echoes of previous pulses can arrive at the receiver on top of the main pulse and corrupt it. In communication engineering this is called intersymbol interference (ISI). In signal integrity engineering it is
1304:
Using realistic case studies and downloadable software examples, two leading experts demonstrate today's best techniques for designing and modeling interconnects to efficiently distribute power and minimize noise. The authors carefully introduce the core concepts of power distribution design,
268:
Logic speeds, and clock speeds in particular, have increased significantly, thus leading to faster transition (rise and fall) times. These faster transition times are closely linked to higher capacitive crosstalk. Also, at such high speeds the inductive properties of the wires come into play,
362:
Modern signal integrity tools for IC design perform all these steps automatically, producing reports that give a design a clean bill of health, or a list of problems that must be fixed. However, such tools generally are not applied across an entire IC, but only selected signals of interest.
156:. In nanometer technologies at 0.13 μm and below, unintended interactions between signals (e.g. crosstalk) became an important consideration for digital design. At these technology nodes, the performance and correctness of a design cannot be assured without considering noise effects.
253:
To keep resistance tolerable despite decreased width, modern wire geometries are thicker in proportion to their spacing. This increases the sidewall capacitance at the expense of capacitance to ground, hence increasing the induced noise voltage (expressed as a fraction of supply
1305:
systematically present and compare leading techniques for modeling noise, and link these techniques to specific applications. Their many examples range from the simplest (using analytical equations to compute power supply noise) through complex system-level applications.
628:
For interfaces where multiple packages are receiving from the same line, (for example with a backplane configuration), the line must be split at some point to service all receivers. Some stubs and impedance mismatches are deemed to occur. Multipackage interfaces include
152:) brought electrical effects back to the forefront in recent technology nodes. With scaling of technology below 0.25 μm, the wire delays have become comparable or even greater than the gate delays. As a result, the wire delays needed to be considered to achieve
420:
in transmission lines is located within a semiconductor chip, instead of a separate, discrete device mounted on a circuit board. The closeness of the termination from the receiver shorten the stub between the two, thus improving the overall signal integrity.
513:
usually called eye closure (a reference to the clutter in the center of a type of oscilloscope trace called an eye diagram). When the bit period is shorter than the flight time, elimination of reflections using classic microwave techniques like matching the
273:
These effects have increased the interactions between signals and decreased the noise immunity of digital CMOS circuits. This has led to noise being a significant problem for digital ICs that must be considered by every digital chip designer prior to
654:
to get the parasitics associated with the layout. Usually worst-case parasitics and best-case parasitics are extracted and used in the simulations. Because of the distributed nature of many of the impairments, electromagnetic simulation is used for
482:) links called "lanes." Such serial links eliminate parallel bus clock skew and reduce the number of traces and resultant coupling effects but these advantages come at the cost of a large increase in bit rate on the lanes, and shorter bit periods.
704:
Analyze the simulation results and decide whether any re-design is required. To analyze the results quite often a data eye is generated and a timing budget is calculated. An example video for generating a data eye can be found on YouTube:
135:
For ICs, SI analysis became necessary as an effect of reduced design rules. In the early days of the modern VLSI era, digital chip circuit design and layout were manual processes. The use of abstraction and the application of
167:
board technology. Nevertheless, the principles of SI are not exclusive to the signalling technology used. SI existed long before the advent of either technology, and will do so as long as electronic communications persist.
525:), a geometric form factor and by the square root of the relative dielectric constant of the stripline filler (typically FR-4, with a relative dielectric constant of ~4). Together, these properties determine the trace's
718:
performance (simulation speed), accuracy (how good are the models), convergence (how good is the solver), capability (non-linear versus linear, frequency dependent versus frequency independent etc.), and ease of use.
555:
The main challenge often depends on whether the project is a cost-driven consumer application or a performance-driven infrastructure application. They tend to require extensive post-layout verification (using an
600:
The noise levels on a trace/network is highly dependent on the routing topology selected. In a point-to-point topology, the signal is routed from the transmitter directly to the receiver (this is applied in
282:
Noise may cause a signal to assume the wrong value. This is particularly critical when the signal is about to be latched (or sampled), for a wrong value could be loaded into a storage element, causing logic
552:(typically 0.1 Ω/cm) at DC. The high frequency component of the pulse is however attenuated by additional resistance due to the skin effect and dielectric loss tangent associated with the PCB material.
1059:
For cost-driven consumer applications ... t's tempting to compact , but the risk is postlayout failure ... For performance-driven applications, the pinch points prelayout design-space exploration ...
375:
Removing impedance discontinuities. Finding places where significant shifts in the impedance exist and adjusting the geometry of the path to shift the impedance to better match the rest of the path.
293:
Noise (e.g. ringing) may cause the input voltage of a gate to drop below ground level, or to exceed the supply voltage. This can reduce the lifetime of the device by stressing components, induce
128:(circa 1940), based on the wire-spring relay, suffered almost all the effects seen today - the ringing, crosstalk, ground bounce, and power supply noise that plague modern digital products.
1323:
544:
A third difference between on-chip and chip-to-chip connection involves the cross-sectional size of the signal conductor, namely that PCB conductors are much larger (typically
501:
in the metal trace and dielectric loss tangent. Examples of mitigation techniques for these impairments are a redesign of the via geometry to ensure an impedance match, use of
241:. These noise sources on the one hand present a lower limit to the smallest signal that can be amplified, and on the other, define an upper limit to the useful amplification.
445:
For wired connections, it is important to compare the interconnect flight time to the bit period to decide whether an impedance matched or unmatched connection is needed.
625:
DQ/DQS etc.). A point-to-point topology has the least SI-problems since there is no large impedance matches being introduced by line T's (a two-way split of a trace).
387:
Add shielding. Add shielding of critical nets or clock nets using GND and VDD shields to reduce the effect of crosstalk (this technique may lead to routing overhead).
478:
standard. Following this lead, the majority of chip-to-chip connection standards underwent an architectural shift from parallel buses to serializer/deserializer (
658:
If the PCB or package already exists, the designer can also measure the impairment presented by the connection using high speed instrumentation such as a
565:
1070:
886:
148:
to create very complex designs, ignoring the electrical characteristics of the underlying circuits to a large degree. However, scaling trends (see
393:
changes. Routing changes can be very effective in fixing noise problems, mainly by reducing the most troublesome coupling effects via separation.
1114:...with continued increase in clock rates of digital circuits, the realms of RF and digital circuits are now more closely tied than ever before.
354:
Run SPICE simulations. Analyze the simulation results and decide whether any re-design is required. It is common to analyze the results with an
978:
681:
1180:
Advanced-level reference text for experienced digital designers who want to press their designs to the upper limits of speed and distance.
521:
is a synonym for matching at the two ends. The interconnect impedance that can be selected is constrained by the impedance of free space (
381:
Buffer insertion. In this approach, instead of upsizing the victim driver, a buffer is inserted at an appropriate point in the victim net.
1343:
1081:
1051:"Voices: Signal-integrity experts speak out: Two experts discuss signal-integrity challenges and their expectations for signal integrity"
120:, and analysis of the problems yielded many of the mathematical tools still used today to analyze signal integrity problems, such as the
1308:
517:
of the transmitter to the interconnect, the sections of interconnect to each other, and the interconnect to the receiver, is crucial.
1313:
1265:
This book approaches electrical engineering and signal integrity principles from a basic level, assuming little prior understanding.
676:
Accurate noise modeling is a must. Create a list of expected noise events, including different types of noise, such as coupling and
117:
315:
226:, non-ideal gate operation, and other sources. The fixes normally involve changing the sizes of drivers and/or spacing of wires.
1185:
485:
At multigigabit/s data rates, link designers must consider reflections at impedance changes (e.g. where traces change levels at
384:
Aggressor downsizing. This works by increasing the transition time of the attacking net by reducing the strength of its driver.
925:
A book for digital PCB designers, highlighting and explaining analog circuit principles relevant to high-speed digital design.
329:
Create a model for each noise event. It is critical that the model is as accurate as necessary to model the given noise event.
55:, and loss. Over short distances and at low bit rates, a simple conductor can transmit this with sufficient fidelity. At high
1382:
1297:
1278:
1195:
1337:
43:, a stream of binary values is represented by a voltage (or current) waveform. However, digital signals are fundamentally
1344:"Understanding Signal Integrity - Signal integrity is becoming a more significant problem as clock frequencies increase"
1206:
From the backcover: Draws from author's industrial experience and his work teaching more than five thousand engineers.
176:
Signal integrity problems in modern integrated circuits (ICs) can have many drastic consequences for digital designs:
1258:
1238:
1219:
1173:
918:
857:
434:
433:
Reflections occurring as a consequence of termination mismatch. the pulse has a 100 ps rise time. Simulated using
261:
for MOS transistors, and has also reduced the difference between threshold and supply voltages, thereby reducing
557:
125:
962:"Using Digitally Controlled Impedance: Signal Integrity vs. Power Dissipation Considerations, XAPP863 (v1.0)"
961:
825:
784:
659:
113:
1377:
1346:
by Eric
Bogatin, GigaTest Labs, Agilent Application Note 5988-5978EN, April 2002, 8 pages, PDF, 0.9 MB
1328:
892:
820:
714:
199:
65:
1094:
319:
measurement would occur after the chip has been created, which is too late to fix any problems observed.
798:
Each of these fixes may possibly cause other problems. This type of issue must be addressed as part of
777:
397:
Each of these fixes may possibly cause other problems. This type of issue must be addressed as part of
121:
229:
In analog circuits, designers are also concerned with noise that arise from physical sources, such as
438:
1271:
A signal integrity engineer's companion : real-time test and measurement and design simulation
526:
416:(ODT) or Digitally Controlled Impedance (DCI) is the technology where the termination resistor for
895:. Portions of IC section of this article were derived (with permission) from Vol II, Chapter 21,
322:
Create a list of expected noise events, including different types of noise, such as coupling and
141:
1361:
1355:
1349:
1145:
1012:
470:
The gentle trend to higher bit rates accelerated dramatically in 2004, with the introduction by
747:
518:
502:
159:
Most of this article is about SI in relation to modern electronic technology - notably the use
1212:
High speed digital system design : a handbook of interconnect theory and design practices
879:
549:
230:
69:
998:
847:
741:
514:
332:
For each signal event, decide how to excite the circuit so that the noise event will occur.
1129:
1028:
726:
An IC package or PCB designer removes signal integrity problems through these techniques:
687:
For each noise event, decide how to excite the circuit so that the noise event will occur.
371:
Once a problem is found, it must be fixed. Typical fixes for IC on-chip problems include:
8:
219:
160:
40:
1318:
867:
799:
490:
417:
413:
398:
223:
203:
145:
61:
740:
Controlling the trace width spacing to the reference plane to create consistent trace
343:
that represents the desired excitation, to include as many effects (such as parasitic
286:
Noise may delay the settling of the signal to the correct value. This is often called
1293:
1274:
1254:
1234:
1215:
1201:
1191:
1169:
914:
853:
651:
486:
311:
297:, or cause multiple cycling of signals that should only cycle once in a given period.
258:
36:
202:(EDA) tools have been developed to analyze, prevent, and correct these problems. In
1350:"Signal Integrity Analysis Series Part 1: Single-Port TDR, TDR/TDT, and 2-Port TDR"
751:
610:
195:
84:
48:
180:
Products can fail to operate at all, or worse yet, become unreliable in the field.
1358:(Agilent Application Note 5989-5764EN, February 2007, 56 pages, PDF, 3.6 MB)
1352:(Agilent Application Note 5989-5763EN, February 2007, 72 pages, PDF, 5.2 MB)
1245:
Textbook on the problems of building digital systems, including signal integrity.
815:
767:
164:
137:
803:
791:
766:(this sub-discipline of signal integrity is sometimes called out separately as
677:
402:
323:
246:
153:
149:
1209:
936:
706:
306:
Typically, an IC designer would take the following steps for SI verification:
1371:
1364:(Agilent Application Note 5989-5765EN, July 2007, 48 pages, PDF, 2.5 MB)
763:
429:
390:
234:
92:
44:
1050:
731:
663:
262:
100:
588:
1146:"Using Clock Jitter Analysis to Reduce BER in Serial Data Applications",
948:
506:
498:
475:
355:
348:
215:
21:
1329:"Design tip: Model instruments to improve signal integrity simulation",
684:(IBIS) or circuit models may be used to represent drivers and receivers.
576:
614:
581:
344:
238:
96:
52:
1095:"High Speed Digital Design Benefits from Recent EDA Tools Development"
773:
Distributing power with solid plane layers to limit power supply noise
378:
Driver optimization. You can have too much drive, and also not enough.
16:
1268:
1148:
Application Note, literature number 5989-5718EN, Agilent
Technologies
735:
494:
464:
207:
191:
88:
73:
56:
1362:"Signal Integrity Analysis Series Part 3: The ABC's of De-Embedding"
848:
Louis
Kossuth Scheffer; Luciano Lavagno; Grant Martin (eds) (2006).
60:
electronics packaging and assembly, from internal connections of an
670:
275:
1290:
Power integrity modeling and design for semiconductors and systems
941:
756:
Route traces perpendicular on adjacent layers to reduce crosstalk
695:
638:
606:
340:
294:
1228:
641:. There are two main multipackage topologies: Tree and fly-by.
479:
448:
The channel flight time (delay) of the interconnect is roughly
249:, several effects have conspired to make noise problems worse:
1356:"Signal Integrity Analysis Series Part 2: 4-Port TDR/VNA/PLTS"
908:
1013:"Eight Hints for Debugging and Validating High-Speed Buses,"
850:
Electronic design automation for integrated circuits handbook
762:
Providing sufficient ground (and power) connections to limit
691:
634:
561:
471:
336:
1163:
493:), noise induced by densely packed neighboring connections (
140:
have since allowed designers to express their designs using
1338:
Topics in signal integrity were discussed at DesignCon 2008
1210:
Stephen H. Hall; Garrett W. Hall; James A. McCall. (2000).
630:
622:
618:
602:
593:
461:
211:
183:
The design may work, but only at speeds slower than planned
47:
in nature, and all signals are subject to effects such as
1166:
High-speed signal propagation : advanced black magic
405:. Re-analysis after design changes is a prudent measure.
206:, or ICs, the main cause of signal integrity problems is
1251:
Signal integrity issues and printed circuit board design
548:
or more in width). Thus, PCB traces have a small series
1324:
Agilent EEsof EDA - Signal
Integrity Analysis Resources
1269:
Geoff Lawday; David
Ireland & Greg Edlund. (2008).
1187:
Signal and Power
Integrity - Simplified, Second Edition
666:
as test cases for proposed solutions to the problem of
301:
662:. For example, IEEE P802.3ap Task Force uses measured
366:
190:
The cost of these failures is very high, and includes
1253:. Upper Saddle River, New Jersey: Prentice Hall PTR.
1168:. Upper Saddle River, New Jersey: Prentice Hall PTR.
1130:"Using Pre-Emphasis and Equalization with Stratix GX"
759:
Increasing spacing between traces to reduce crosstalk
278:. There are several concerns that must be mitigated:
644:
913:. Englewood Cliffs, New Jersey: Prentice Hall PTR.
911:
High speed digital design a handbook of black magic
721:
979:"Rule of Thumb #3 Signal speed on an interconnect"
1292:. Upper Saddle River, New Jersey: Prentice Hall.
1273:. Upper Saddle River, New Jersey: Prentice Hall.
1190:. Upper Saddle River, New Jersey: Prentice Hall.
852:. Boca Raton, Florida: CRC/Taylor & Francis.
533:is a convenient choice for single-end lines, and
1369:
1287:
497:), and high-frequency attenuation caused by the
424:
214:technologies, this is primarily due to coupling
198:due to delayed product introduction. Therefore,
1248:
351:, and various distortion effects) as necessary.
1183:
947:Gives an example video of construction of an
682:Input Output Buffer Information Specification
1071:"Hurdle the multigigabit per second barrier"
999:"Signal Integrity: Problems and Solutions,"
560:) and pre-layout design optimization (using
1229:William J. Dally; John W. Poulton. (1999).
794:(CDR) circuitry with low jitter/phase noise
186:Yield may be lowered, sometimes drastically
171:
1124:
1122:
124:. Products as old as the Western Electric
35:is a set of measures of the quality of an
909:Howard W. Johnson; Martin Graham (1993).
885:CS1 maint: multiple names: authors list (
734:adjacent to the signal traces to control
843:
841:
587:
575:
428:
15:
1164:Howard Johnson; Martin Graham. (2002).
1119:
1082:IEEE P802.3ap Task Force Channel Models
934:
698:that represents the desired excitation.
592:Fly-by topology similar to that of the
245:continued to shrink in accordance with
1370:
1092:
838:
580:Tree topology similar to that of the
408:
218:, but in general it may be caused by
1340:February 4, 2008 to February 7, 2008
1319:Basic Principles of Signal Integrity
1233:. Cambridge: Cambridge Univ. Press.
1048:
302:Finding IC signal integrity problems
257:Technology scaling has led to lower
83:of concern for signal integrity are
897:Noise Considerations in Digital ICs
571:
367:Fixing IC signal integrity problems
358:and by calculating a timing budget.
13:
1309:Signal Integrity for PCB Designers
14:
1394:
1001:Eric Bogatin, Bogatin Enterprises
959:
701:Run SPICE and record the results.
645:Finding signal integrity problems
519:Termination with a source or load
435:Quite Universal Circuit Simulator
24:displaying a DDR3 signal waveform
722:Fixing signal integrity problems
118:severe signal integrity problems
1139:
1086:
1075:
1064:
780:to the transmitter driving cell
694:(or another circuit simulator)
339:(or another circuit simulator)
1314:Altera Signal Integrity Center
1042:
1021:
1006:
992:
971:
953:
928:
902:
138:automatic synthesis techniques
1:
1157:
1049:Rako, Paul (April 23, 2009).
826:Electromagnetic compatibility
425:Chip-to-chip signal integrity
269:especially mutual inductance.
194:costs, engineering costs and
114:transatlantic telegraph cable
1383:Electronic design automation
1333:, John Olah, 2007-October-25
893:electronic design automation
821:Electromagnetic interference
200:electronic design automation
7:
1288:Raj; A. Ege Engin. (2008).
1231:Digital systems engineering
1093:Breed, Gary (August 2008).
809:
633:, DDR2/DDR3/DDR4 C/A bank,
126:crossbar telephone exchange
10:
1399:
1102:High Frequency Electronics
713:There are special purpose
106:
1015:Application Note 1382-10,
891:A survey of the field of
596:Command/Address (CA) bank
584:Command/Address (CA) bank
509:filtering, respectively.
439:Time-domain reflectometry
1249:Douglas Brooks. (2003).
831:
527:characteristic impedance
172:On-chip signal integrity
146:automated design process
792:clock and data recovery
660:vector network analyzer
122:telegrapher's equations
1184:Eric Bogatin. (2009).
935:Ruckerbauer, Hermann.
776:Adding a pre-emphasis
597:
585:
503:differential signaling
442:
25:
787:to the receiving cell
591:
579:
432:
70:printed circuit board
19:
1017:Agilent Technologies
515:electrical impedance
142:high-level languages
1378:Digital electronics
1214:. New York: Wiley.
204:integrated circuits
161:integrated circuits
99:, signal loss, and
41:digital electronics
899:, by Vinod Kariat.
878:has generic name (
598:
586:
537:for differential.
491:Transmission lines
443:
418:impedance matching
414:On-die termination
409:On-die termination
259:threshold voltages
224:substrate coupling
64:(IC), through the
62:integrated circuit
26:
1299:978-0-13-615206-4
1280:978-0-13-186006-3
1197:978-0-13-234979-6
652:layout extraction
568:), respectively.
566:channel simulator
312:layout extraction
220:mutual inductance
37:electrical signal
1390:
1303:
1284:
1264:
1244:
1225:
1205:
1200:. Archived from
1179:
1151:
1143:
1137:
1136:
1134:
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1117:
1116:
1111:
1109:
1099:
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1004:
996:
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968:
966:
957:
951:
946:
937:"An Eye is Born"
932:
926:
924:
906:
900:
890:
883:
877:
873:
871:
863:
845:
730:Placing a solid
673:over backplanes.
669:
611:Gigabit Ethernet
572:Routing topology
547:
536:
532:
524:
459:
455:
451:
196:opportunity cost
29:Signal integrity
1398:
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1393:
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1368:
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1300:
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1031:. Microwaves101
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1007:
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993:
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865:
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846:
839:
834:
816:Power integrity
812:
768:power integrity
732:reference plane
724:
667:
647:
574:
545:
534:
530:
522:
457:
453:
449:
427:
411:
369:
304:
174:
165:printed circuit
109:
12:
11:
5:
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1347:
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1311:
1306:
1298:
1285:
1279:
1266:
1259:
1246:
1239:
1226:
1220:
1207:
1204:on 2011-09-10.
1196:
1181:
1174:
1159:
1156:
1153:
1152:
1138:
1118:
1085:
1074:
1063:
1041:
1029:"Why 50 Ohms?"
1020:
1005:
991:
970:
960:Banas, David.
952:
927:
919:
901:
858:
836:
835:
833:
830:
829:
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823:
818:
811:
808:
804:design closure
796:
795:
788:
781:
774:
771:
760:
757:
754:
744:
738:
723:
720:
711:
710:
707:An Eye is Born
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116:suffered from
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235:flicker noise
232:
231:thermal noise
227:
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144:and apply an
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1186:
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1104:. p. 52
1101:
1088:
1077:
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1033:. Retrieved
1023:
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983:. Retrieved
973:
955:
940:
930:
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904:
896:
849:
800:design flows
797:
748:terminations
725:
712:
664:S-parameters
627:
599:
558:EM simulator
554:
543:
539:
511:
484:
469:
447:
444:
437:(Qucs). See
412:
399:design flows
396:
370:
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189:
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134:
130:
110:
101:power supply
80:
79:Some of the
78:
32:
28:
27:
949:eye pattern
750:to control
655:extraction.
507:preemphasis
499:skin effect
476:PCI-Express
356:eye pattern
349:capacitance
314:to get the
247:Moore's law
216:capacitance
150:Moore's law
81:main issues
72:(PCB), the
22:eye diagram
1372:Categories
1158:References
1035:2008-06-02
985:2018-03-17
783:Adding an
650:Perform a
550:resistance
345:inductance
316:parasitics
310:Perform a
239:shot noise
112:The first
97:distortion
53:distortion
20:Simulated
1135:. Altera.
868:cite book
790:Improved
785:equalizer
742:impedance
736:crosstalk
690:Create a
668:10 Gbit/s
495:crosstalk
465:stripline
335:Create a
254:voltage).
208:crosstalk
192:photomask
89:crosstalk
74:backplane
57:bit rates
810:See also
671:Ethernet
283:failure.
276:tape-out
1331:EETimes
942:YouTube
752:ringing
696:netlist
639:CAN Bus
607:RapidIO
535:100 ohm
474:of the
391:Routing
341:netlist
295:latchup
107:History
103:noise.
85:ringing
66:package
1296:
1277:
1257:
1237:
1218:
1194:
1172:
1108:May 1,
917:
856:
778:filter
746:Using
564:and a
546:100 μm
523:~377 Ω
505:, and
489:, see
480:SERDES
237:, and
68:, the
45:analog
1133:(PDF)
1098:(PDF)
981:. EDN
965:(PDF)
832:Notes
692:SPICE
635:RS485
562:SPICE
472:Intel
460:) of
454:15 cm
337:SPICE
210:. In
49:noise
39:. In
1294:ISBN
1275:ISBN
1255:ISBN
1235:ISBN
1216:ISBN
1192:ISBN
1170:ISBN
1110:2009
915:ISBN
887:link
880:help
854:ISBN
802:and
637:and
631:LVDS
623:DDR4
619:DDR3
615:DDR2
603:PCIe
594:DDR3
582:DDR2
531:50 Ω
487:vias
462:FR-4
458:6 in
452:per
450:1 ns
401:and
347:and
212:CMOS
163:and
1055:EDN
715:EDA
31:or
1374::
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629:B
621:/
617:/
456:(
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326:.
290:.
265:.
Text is available under the Creative Commons Attribution-ShareAlike License. Additional terms may apply.
