Printed electronics

526:

elements were glued to the dielectric, in this case, paraffined paper. The first printed circuit was produced in 1936 by Paul Eisler, and that process was used for large-scale production of radios by the USA during World War II. Printed circuit technology was released for commercial use in the US in 1948 (Printed Circuits Handbook, 1995). In the over a half-century since its inception, printed electronics has evolved from the production of printed circuit boards (PCBs), through the everyday use of membrane switches, to today's RFID, photovoltaic and electroluminescent technologies. Today it is nearly impossible to look around a modern American household and not see devices that either uses printed electronic components or that are the direct result of printed electronic technologies. Widespread production of printed electronics for household use began in the 1960s when the Printed Circuit Board became the foundation for all consumer electronics. Since then printed electronics have become a cornerstone in many new commercial products.

211:, soluble materials like organic semiconductors. With high-viscosity materials, like organic dielectrics, and dispersed particles, like inorganic metal inks, difficulties due to nozzle clogging occur. Because ink is deposited via droplets, thickness and dispersion homogeneity is reduced. Using many nozzles simultaneously and pre-structuring the substrate allows improvements in productivity and resolution, respectively. However, in the latter case non-printing methods must be employed for the actual patterning step. Inkjet printing is preferable for organic semiconductors in 111:. The solution usually consist of filler materials dispersed in a suitable solvent. The most commonly used solvents include ethanol, xylene, Dimethylformamide (DMF),Dimethyl sulfoxide (DMSO), toluene and water, whereas, the most common conductive fillers include silver nanoparticles, silver flakes, carbon black, graphene, carbon nanotubes, conductive polymers (such as polyaniline and polypyrrole), and metal powders (such as copper or nickel). Considering the environmental impacts of the organic solvents, researchers are now focused on developing printable iks using water. 538:

materials printing to develop printed memory in commercial volumes. LG announce significant investment, potentially $ 8.71 billion in OLEDs on Plastic. Sharp (Foxconn) will invest $ 570m in pilot line for OLED displays. BOE announce potential $ 6.8 billion in flexible AMOLED fab. Heliatek has secured €80m in additional funding for OPV manufacturing in Dresden. PragmatIC has raised ~ €20m from investors including Avery Dennison. Thinfilm invests in new production site in Silicon Valley (formerly owned by Qualcomm). Cambrios back in business after acquisition by TPK.

534:

reason for this increase in revenue is because of the incorporation of printed electronic into cellphones. Nokia was one of the companies that pioneered the idea of creating a “Morph” phone using printed electronics. Since then, Apple has implemented this technology into their iPhone XS, XS Max, and XR devices. Printed electronics can be used to make all of the following components of a cellphone: 3D main antenna, GPS antenna, energy storage, 3D interconnections, multi-layer PCB, edge circuits, ITO jumpers, hermetic seals, LED packaging, and tactile feedback.

260:>10 μm. A wide nozzle print head enables efficient patterning of millimeter size electronic features and surface coating applications. All printing occurs without the use of vacuum or pressure chambers. The high exit velocity of the jet enables a relatively large separation between the print head and the substrate, typically 2–5 mm. The droplets remain tightly focused over this distance, resulting in the ability to print conformal patterns over three dimensional substrates. 131: 256:

The droplets are entrained in a gas stream and delivered to the print head. Here, an annular flow of clean gas is introduced around the aerosol stream to focus the droplets into a tightly collimated beam of material. The combined gas streams exit the print head through a converging nozzle that compresses the aerosol stream to a diameter as small as 10 μm. The jet of droplets exits the print head at high velocity (~50 meters/second) and impinges upon the substrate.

634: 27: 284:. This method uses techniques such as thermal, e-beam, sputter and other traditional production technologies to deposit materials through a high precision shadow mask (or stencil) that is registered to the substrate to better than 1 μm. By layering different mask designs and/or adjusting materials, reliable, cost-effective circuits can be built additively, without the use of photo-lithography. 92:, in which one or more inks are composed of carbon-based compounds. These other terms refer to the ink material, which can be deposited by solution-based, vacuum-based, or other processes. Printed electronics, in contrast, specifies the process, and, subject to the specific requirements of the printing process selected, can utilize any solution-based material. This includes 530:

be painted or printed onto surfaces. These solar cells have been shown to max out at fifteen percent efficiency. Konarka Technologies, now a defunct company in the US, was the pioneering company in producing inkjet solar cells. Today there are more than fifty companies across a diverse number of countries that are producing printed solar cells.

264:

Post-treatment is driven more by the specific ink and substrate combination than by the printing process. A wide range of materials has been successfully deposited with the Aerosol Jet process, including diluted thick film pastes, conducting polymer inks, thermosetting polymers such as UV-curable epoxies, and solvent-based

554:, including photovoltaic, sensing and processing devices, driven by the desire to extend and integrate the latest advances in (opto-)electronic technologies into a broad range of low-cost (even disposable) consumer products of our everyday life, and as tools to bring together the digital and physical worlds. 484:

Printed electronics allows the use of flexible substrates, which lowers production costs and allows fabrication of mechanically flexible circuits. While inkjet and screen printing typically imprint rigid substrates like glass and silicon, mass-printing methods nearly exclusively use flexible foil and

382:

In most organic materials, hole transport is favored over electron transport. Recent studies indicate that this is a specific feature of organic semiconductor/dielectric-interfaces, which play a major role in OFETs. Therefore, p-type devices should dominate over n-type devices. Durability (resistance

332:

With a few exceptions, inorganic ink materials are dispersions of metallic or semiconducting micro- and nano-particles. Semiconducting nanoparticles used include silicon and oxide semiconductors. Silicon is also printed as an organic precursor which is then converted by pyrolisis and annealing into

300:

are of interest. Here, μm- and nm-sized layers, respectively, are prepared by methods similar to stamping with soft and hard forms, respectively. Often the actual structures are prepared subtractively, e.g. by deposition of etch masks or by lift-off processes. For example, electrodes for OFETs can be

255:

of an ink, via ultrasonic or pneumatic means, producing droplets on the order of one to two micrometers in diameter. The droplets then flow through a virtual impactor which deflects the droplets having lower momentum away from the stream. This step helps maintaining a tight droplet size distribution.

238:

is appropriate for fabricating electrics and electronics due to its ability to produce patterned, thick layers from paste-like materials. This method can produce conducting lines from inorganic materials (e.g. for circuit boards and antennas), but also insulating and passivating layers, whereby layer

728:

Coatanéa, E., Kantola, V., Kulovesi, J., Lahti, L., Lin, R., & Zavodchikova, M. (2009). Printed Electronics, Now and Future. In Neuvo, Y., & Ylönen, S. (eds.), Bit Bang – Rays to the Future. Helsinki University of Technology (TKK), MIDE, Helsinki University Print, Helsinki, Finland, 63-102.

529:

The biggest trend in recent history when it comes to printed electronics is the widespread use of them in solar cells. In 2011, researchers from MIT created a flexible solar cell by inkjet printing on normal paper. In 2018, researchers at Rice University have developed organic solar cells which can

525:

Albert Hanson, a German by birth, is credited to have introduced the concept of printed electronics. in 1903 he filled a patent for “Printed Wires,” and thus printed electronics were born. Hanson proposed forming a Printed Circuit Board pattern on copper foil through cutting or stamping. The drawn

156:

The attraction of printing technology for the fabrication of electronics mainly results from the possibility of preparing stacks of micro-structured layers (and thereby thin-film devices) in a much simpler and cost-effective way compared to conventional electronics. Also, the ability to implement

533:

While printed electronics have been around since the 1960s, they are predicted to have a major boom in total revenue. As of 2011, the total printed electronic revenue was reported to be at $ 12.385 (billion). A report by IDTechEx predicts the PE market will reach $ 330 (billion) in 2027. A big

741:- "Moreover, PE technology could provide a number of enabling factors like flexibility and robustness, allowing incorporation of electronics functions into objects that do not yet contain any active electronic components, e.g. toy applications, printed advertising material or electronic labels ." 537:

With the revolutionary discoveries and advantages that printed electronic gives to companies many large companies have made recent investments into this technology. In 2007, Soligie Inc. and Thinfilm Electronics entered into an agreement to combine IPs for soluble memory materials and functional

351:

Organic printed electronics integrates knowledge and developments from printing, electronics, chemistry, and materials science, especially from organic and polymer chemistry. Organic materials in part differ from conventional electronics in terms of structure, operation and functionality, which

263:

Despite the high velocity, the printing process is gentle; substrate damage does not occur and there is generally minimal splatter or overspray from the droplets. Once patterning is complete, the printed ink typically requires post treatment to attain final electrical and mechanical properties.

144:

resolution and smaller structures are necessary in most electronics printing, because they directly affect circuit density and functionality (especially transistors). A similar requirement holds for the precision with which layers are printed on top of each other (layer to layer registration).

157:

new or improved functionalities (e.g. mechanical flexibility) plays a role. The selection of the printing method used is determined by requirements concerning printed layers, by the properties of printed materials as well as economic and technical considerations of the final printed products.

321:

Electronic functionality and printability can interfere with each other, mandating careful optimization. For example, a higher molecular weight in polymers enhances conductivity, but diminishes solubility. For printing, viscosity, surface tension and solid content must be tightly controlled.

143:

The maximum required resolution of structures in conventional printing is determined by the human eye. Feature sizes smaller than approximately 20 μm cannot be distinguished by the human eye and consequently exceed the capabilities of conventional printing processes. In contrast, higher

239:

thickness is more important than high resolution. Its 50 m/h throughput and 100 μm resolution are similar to inkjets. This versatile and comparatively simple method is used mainly for conductive and dielectric layers, but also organic semiconductors, e.g. for OPVCs, and even complete

259:

Electrical interconnects, passive and active components are formed by moving the print head, equipped with a mechanical stop/start shutter, relative to the substrate. The resulting patterns can have features ranging from 10 μm wide, with layer thicknesses from tens of nanometers to

126:

printing does not impact performance. Printing on flexible substrates allows electronics to be placed on curved surfaces, for example: printing solar cells on vehicle roofs. More typically, conventional semiconductors justify their much higher costs by providing much higher performance.

114:

For the preparation of printed electronics nearly all industrial printing methods are employed. Similar to conventional printing, printed electronics applies ink layers one atop another. So the coherent development of printing methods and ink materials are the field's essential tasks.

317:

Both organic and inorganic materials are used for printed electronics. Ink materials must be available in liquid form, for solution, dispersion or suspension. They must function as conductors, semiconductors, dielectrics, or insulators. Material costs must be fit for the application.

271:

Recently, printing paper was proposed to be used as the substrate of the printing. Highly conductive (close to bulk copper) and high-resolution traces can be printed on foldable and available office printing papers, with 80°Celsius curing temperature and 40 minutes of curing time.

325:

Material properties largely determine the differences between printed and conventional electronics. Printable materials provide decisive advantages beside printability, such as mechanical flexibility and functional adjustment by chemical modification (e.g. light color in OLEDs).

189:

printing is especially suitable for quality-sensitive layers like organic semiconductors and semiconductor/dielectric-interfaces in transistors, due to high layer quality. If high resolution is needed, gravure is also suitable for inorganic and organic conductors. Organic

775:

Khan, Junaid; Mariatti, M; Zubir, Syazana A; Rusli, Arjulizan; Manaf, Asrulnizam Abd; Khirotdin, Rd Khairilhijra (29 January 2024). "Eco-friendly alkali lignin-assisted water-based graphene oxide ink and its application as a resistive temperature sensor".

322:

Cross-layer interactions such as wetting, adhesion, and solubility as well as post-deposition drying procedures affect the outcome. Additives often used in conventional printing inks are unavailable, because they often defeat electronic functionality.

2426:

Carey, T., Cacovich, S., Divitini, G., Ren, J., Mansouri, A., Kim, J. M., ... & Torrisi, F. (2017). Fully inkjet-printed two-dimensional material field-effect heterojunctions for wearable and textile electronics. Nature communications, 8(1),

147:

Control of thickness, holes, and material compatibility (wetting, adhesion, solubility) are essential, but matter in conventional printing only if the eye can detect them. Conversely, the visual impression is irrelevant for printed electronics.

453:(EL) multi-color displays can cover many tens of square meters, or be incorporated in watch faces and instrument displays. They involve six to eight printed inorganic layers, including a copper doped phosphor, on a plastic film substrate. 412:

like poly(3-hexylthiophene) (P3HT) and poly(9,9-dioctylfluorene co-bithiophen) (F8T2). The latter material has also been gravure printed. Different electroluminescent polymers are used with inkjet printing, as well as active materials for

184:

are more common for high-volume production, such as solar cells, reaching 10,000 square meters per hour (m/h). While offset and flexographic printing are mainly used for inorganic and organic conductors (the latter also for dielectrics),

505:

have traditionally made it problematic for electronics. This is an active research area, however, and print-compatible metal deposition techniques have been demonstrated that adapt to the rough 3D surface geometry of paper.

607:

IPC—Association Connecting Electronics Industries has published three standards for printed electronics. All three have been published in cooperation with the Japan Electronic Packaging and Circuits Association (JPCA):

206:

Inkjets are flexible and versatile, and can be set up with relatively low effort. However, inkjets offer lower throughput of around 100 m/h and lower resolution (ca. 50 μm). It is well suited for

2828:

Vicente, António T.; Araújo, Andreia; Mendes, Manuel J.; Nunes, Daniela; Oliveira, Maria J.; Sanchez-Sobrado, Olalla; Ferreira, Marta P.; Águas, Hugo; Fortunato, Elvira; Martins, Rodrigo (2018-03-29).

2582: 405:) (PANI). Both polymers are commercially available in different formulations and have been printed using inkjet, screen and offset printing or screen, flexo and gravure printing, respectively. 61:. By electronic-industry standards, these are low-cost processes. Electrically functional electronic or optical inks are deposited on the substrate, creating active or passive devices, such as 2644: 251:

Aerosol Jet Printing (also known as Maskless Mesoscale Materials Deposition or M3D) is another material deposition technology for printed electronics. The Aerosol Jet process begins with

546:

Printed electronics are in use or under consideration include wireless sensors in packaging, skin patches that communicate with the internet, and buildings that detect leaks to enable

2282: 3041: 305:

is used in a similar manner. Occasionally so-called transfer methods, where solid layers are transferred from a carrier to the substrate, are considered printed electronics.

2550:

Vicente, António T.; Araújo, Andreia; Gaspar, Diana; Santos, Lídia; Marques, Ana C.; Mendes, Manuel J.; Pereira, Luís; Martins, Elvira Fortunato and Rodrigo (2017-02-22).

3020: 41:

methods used to create electrical devices on various substrates. Printing typically uses common printing equipment suitable for defining patterns on material, such as

2491:

Grell, Max; Dincer, Can; Le, Thao; Lauri, Alberto; Nunez Bajo, Estefania; Kasimatis, Michael; Barandun, Giandrin; Maier, Stefan A.; Cass, Anthony E. G. (2018-11-09).

1625:

Chen, Yi-Dan; Nagarajan, Vijayasarathi; Rosen, David W.; Yu, Wenwei; Huang, Shao Ying (Oct 2020). "Wireless Power Transfer via Strongly Coupled Magnetic Resonances".

580:

standards, etc.) This strategy of standards development mirrors the approach used by silicon-based electronics over the past 50 years. Initiatives include:

2780: 2866: 596: 2890: 2415:

in Germany and others are involved in EL displays. Spectrolab already offers commercially flexible solar cells based on various inorganic compounds.

1849:

Moliton; Hiorns, R.C. (2004). "Review of electronic and optical properties of semiconductingπ-conjugated polymers: applications in optoelectronics".

2878: 2416: 3012: 2652: 3015: 1561:

Fisher, Christine; Warmack, Bruce J.; Yu, Yongchao; Skolrood, Lydia N.; Li, Kai; Joshi, Pooran C.; Saito, Tomonori; Aytug, Tolga (2021-04-19).

476:

demonstrated 40.7% conversion efficiency, eight times that of the best organic cells, approaching the best performance of crystalline silicon.

359:

and their development into soluble materials provided the first organic ink materials. Materials from this class of polymers variously possess

3083: 2015:

de Leeuw, D. M.; et al. (1997). "Stability of n-type doped conducting polymers and consequences for polymeric microelectronic devices".

1563:"All-aerosol-jet-printed highly sensitive and selective polyaniline-based ammonia sensors: a route toward low-cost, low-power gas detection" 69:. Some researchers expect printed electronics to facilitate widespread, very low-cost, low-performance electronics for applications such as 2902: 2286: 2181:

Speakman, S.P.; et al. (2001). "High performance organic semiconducting thin films: Ink jet printed polythiophene [rr-P3HT]".

1105:

Mäkelä, T.; et al. (2005). "Utilizing roll-to-roll techniques for manufacturing source-drain electrodes for all-polymer transistors".

846:

Khan, Junaid; Mariatti, M. (November 2022). "Effect of natural surfactant on the performance of reduced graphene oxide conductive ink".

3315: 2754: 1891:

Maennl, U.; et al. (2013). "Interfacial and Network Characteristics of Silicon Nanoparticle Layers Used in Printed Electronics".

118:

The most important benefit of printing is low-cost volume fabrication. The lower cost enables use in more applications. An example is

3353: 2146:

Bharathan, J.; Yang, Y. (2006). "Polymer electroluminescent devices processed by inkjet printing: I. Polymer light-emitting logo".

819:

Khan, Junaid; Mariatti, M (1 September 2023). "In-situ graphene oxide reduction via inkjet printing using natural reducing inks".

3255: 280:

Evaporation printing uses a combination of high precision screen printing with material vaporization to print features to 5

1278:

Subramanian, V.; et al. (2005). "Progress Toward Development of All-Printed RFID Tags: Materials, Processes, and Devices".

1017:

Harrey, P.M.; et al. (2002). "Capacitive-type humidity sensors fabricated using the offset lithographic printing process".

3358: 3037: 897: 550:. Most of these applications are still in the prototyping and development stages. There is a particularly growing interest for 1067:

Zielke, D.; et al. (2005). "Polymer-based organic field-effect transistor using offset printed source/drain structures".

2561: 734: 473: 2698: 3190: 1926:

Faber, H.; et al. (2009). "Low-Temperature Solution-Processed Memory Transistors Based on Zinc Oxide Nanoparticles".

509:

Other important substrate criteria are low roughness and suitable wet-ability, which can be tuned pre-treatment by use of

428:

Printable organic and inorganic insulators and dielectrics exist, which can be processed with different printing methods.

1689:"Micron-scale organic thin film transistors with conducting polymer electrodes patterned by polymer inking and stamping" 547: 3518: 3303: 3202: 436:

Inorganic electronics provides highly ordered layers and interfaces that organic and polymer materials cannot provide.

3237: 3076: 2993: 599:(ITRS), the International Electronics Manufacturing Initiative (iNEMI) has published a roadmap for printed and other 2940: 2988:, edited by D. Gamota, P. Brazis, K. Kalyanasundaram, and J. Zhang (Kluwer Academic Publishers: New York, 2004). 2915: 1801:

Hines, D.R.; et al. (2007). "Transfer printing methods for the fabrication of flexible organic electronics".

3249: 3185: 240: 3051: 2596: 1486:

Shaheen, S.E.; et al. (2001). "Fabrication of bulk heterojunction plastic solar cells by screen printing".

1139:

Hübler, A.; et al. (2007). "Ring oscillator fabricated completely by means of mass-printing technologies".

911:

Thomas, D.J. (2016). "Integration of Silicon and Printed Electronics for Rapid Diagnostic Disease Biosensing".

669: 2111:

Zaumseil, J.; Sirringhaus, H. (2007). "Electron and Ambipolar Transport in Organic Field-Effect Transistors".

1652:

Gate, B.D.; et al. (2005). "New Approaches to Nanofabrication: Molding, Printing, and Other Techniques".

884:

Roth, H.-K.; et al. (2001). "Organische Funktionsschichten in Polymerelektronik und Polymersolarzellen".

3523: 3375: 3243: 1243:

de Gans, B.-J.; et al. (2004). "Inkjet Printing of Polymers: State of the Art and Future Developments".

501:'s low costs and manifold applications make it an attractive substrate, however, its high roughness and high 3069: 1364:

Sirringhaus, H.; et al. (2000). "High-Resolution Inkjet Printing of All-Polymer Transistor Circuits".

216: 3005: 2366:

Noh, Y.-Y.; et al. (2007). "Downscaling of self-aligned, all-printed polymer thin-film transistors".

2328: 1878: 1766:

Knobloch, A.; et al. (2004). "Fully printed integrated circuits from solution processable polymers".

1329:

Arias, A.C.; et al. (2004). "All jet-printed polymer thin-film transistor active-matrix backplanes".

3492: 3387: 751: 2411:

Mflex UK (formerly Pelikon) and elumin8, both in the UK, Emirates Technical Innovation Centre in Dubai,

1688: 3407: 3365: 2724: 1456:

Bao, Z.; et al. (1997). "High-Performance Plastic Transistors Fabricated by Printing Techniques".

585: 486: 422: 2493:"Autocatalytic Metallization of Fabrics Using Si Ink, for Biosensors, Batteries and Energy Harvesting" 3308: 3293: 3219: 3179: 558: 2829: 3320: 3225: 3213: 2577: 1178:

Mäkelä, T.; et al. (2003). "Roll-to-roll method for producing polyaniline patterns on paper".

490: 219:(OLEDs), but also OFETs completely prepared by this method have been demonstrated. Frontplanes and 191: 122:-systems, which enable contactless identification in trade and transport. In some domains, such as 3370: 3148: 3143: 2042:

Vardeny, Z.V.; et al. (2005). "Fundamental research needs in organic electronic materials".

297: 3464: 3261: 489:-foil (PET) is a common choice, due to its low cost and moderately high temperature stability. 376: 622:

These standards, and others in development, are part of IPC's Printed Electronics Initiative.

3476: 3430: 3298: 3196: 3133: 1739:

Leising, G.; et al. (2006). "Nanoimprinted devices for integrated organic electronics".

360: 293: 123: 93: 77:, decorative and animated posters, and active clothing that do not require high performance. 62: 20: 3402: 3397: 3380: 3100: 2449: 2375: 2340: 2256: 2217: 2155: 1970: 1935: 1900: 1810: 1775: 1703: 1574: 1495: 1373: 1338: 1252: 1076: 1026: 855: 785: 704: 689: 551: 224: 2208:

Paul, K.E.; et al. (2003). "Additive jet printing of polymer thin-film transistors".

8: 3449: 3392: 3231: 3153: 3092: 694: 600: 439: 368: 89: 85: 2453: 2379: 2344: 2260: 2221: 2159: 1974: 1939: 1904: 1814: 1779: 1707: 1578: 1499: 1377: 1342: 1256: 1080: 1030: 859: 789: 421:

derivatives), which in part also can be deposited using screen printing (e.g. blends of

3469: 3454: 3335: 3173: 3138: 2673: 2527: 2492: 1994: 1598: 1438: 1295: 1222: 928: 738: 664: 639: 569: 450: 356: 195: 54: 2300:

Harrey, P. M.; et al. (2000). "Interdigitated Capacitors by Offset Lithography".

2194: 2096: 2079: 2028: 1191: 1038: 959: 3425: 3024: 2989: 2849: 2830:"Multifunctional cellulose-paper for light harvesting and smart sensing applications" 2557: 2532: 2514: 2473: 2465: 2391: 2244: 2128: 1986: 1961:

Shimoda, T.; et al. (2006). "Solution-processed silicon films and transistors".

1669: 1602: 1590: 1389: 946:

Xu, J.M.(Jimmy) (2000). "Plastic electronics and future trends in microelectronics".

801: 730: 648: 352:

influences device and circuit design and optimization as well as fabrication method.

1442: 1226: 1205:

Parashkov, R.; et al. (2005). "Large Area Electronics Using Printing Methods".

932: 517:. In contrast to conventional printing, high absorbency is usually disadvantageous. 3158: 2841: 2522: 2504: 2457: 2383: 2348: 2309: 2264: 2225: 2190: 2163: 2120: 2091: 2055: 2051: 2024: 1998: 1978: 1943: 1908: 1858: 1818: 1783: 1748: 1719: 1711: 1661: 1634: 1582: 1503: 1465: 1430: 1381: 1346: 1299: 1287: 1260: 1214: 1187: 1148: 1118: 1114: 1084: 1034: 955: 920: 893: 863: 828: 793: 684: 679: 615:

IPC/JPCA-4591, Requirements for Printed Electronics Functional Conductive Materials

577: 514: 70: 1385: 867: 752:"Printed & Flexible Electronics - IDTechEx Research Reports and Subscriptions" 3348: 3343: 3325: 3288: 3283: 3208: 3168: 1638: 924: 235: 177: 169: 108: 42: 2802: 1152: 3278: 2867:

Thinfilm and InkTec awarded IDTechEx' Technical Development Manufacturing Award

1586: 832: 797: 674: 3046: 3031: 2313: 1752: 1434: 1291: 1218: 3512: 3459: 3442: 3437: 2853: 2518: 2469: 2428: 1594: 1562: 1551:

B. H. King et al, Photovoltaic Specialists Conference (PVSC), 2009 34th IEEE.

409: 372: 364: 100: 3056: 2551: 130: 2536: 2509: 2477: 2461: 2395: 2387: 2352: 2132: 1990: 1947: 1912: 1673: 1421:

Bock, K.; et al. (2005). "Polymer Electronics Systems - Polytronics".

1393: 1264: 805: 699: 414: 302: 161: 104: 74: 3052:

Printed Electronics – avistando el futuro. Printed Electronics en Español

2944: 1724: 573: 502: 466: 329:

Printed conductors offer lower conductivity and charge carrier mobility.

181: 46: 1982: 138: 3497: 3163: 3108: 2919: 2845: 2440:

Tobjörk, Daniel; Österbacka, Ronald (2011-03-23). "Paper Electronics".

2245:"Polymer based organic solar cells using ink-jet printed active layers" 1879:

http://nobelprize.org/nobel_prizes/chemistry/laureates/2000/chemadv.pdf

460: 336: 306: 3061: 2781:"New iPhones models support native 'background' NFC tag read function" 2329:"Ink-jet Printing and Microwave Sintering of Conductive Silver Tracks" 2268: 2229: 2124: 1822: 1787: 1715: 1665: 1507: 1469: 1350: 1088: 898:

10.1002/1521-4052(200110)32:10<789::AID-MAWE789>3.0.CO;2-E

3123: 2604: 2412: 2167: 494: 456: 418: 398: 394: 220: 208: 97: 66: 2631:

An Investigation of Fundamental Competencies for Printed Electronics

1862: 979:

A. Blayo and B. Pineaux, Joint sOC-EUSAI Conference, Grenoble, 2005.

408:

Polymer semiconductors are processed using inkjet printing, such as

3118: 3113: 913:

Point of Care: The Journal of Near-Patient Testing & Technology

709: 659: 633: 134:

Printed and conventional electronics as complementary technologies.

38: 2879:

PolyIC, ThinFilm announce pilot of volume printed plastic memories

612:

IPC/JPCA-4921, Requirements for Printed Electronics Base Materials

26: 2966:"iNEMI | International Electronics Manufacturing Initiative" 510: 463: 402: 391: 387: 383:

to dispersion) and lifetime is less than conventional materials.

265: 252: 186: 173: 50: 2651:, National Geographic Partners, LLC, 10 May 2013, archived from 2726:

Printed Electronics:Manufacturing Technologies and Applications

2553:

Optoelectronics and Bio Devices on Paper Powered by Solar Cells

1406:

V.G. Shah and D.B. Wallace, IMAPS Conference, Long Beach, 2004.

653: 165: 58: 497:-foil (PI) are higher performance, higher cost alternatives. 198:

can be prepared completely by means of mass-printing methods.

2597:"The printed circuit board is the base of modern electronics" 1165:

S. Leppavuori et al., Sensors and Actuators 41-42 (1994) 593.

498: 281: 589: 443: 340: 212: 119: 2903:

Thin Film Electronics Plans to Provide ‘Memory Everywhere’

2580:, Hanson, Albert, "Printed Wires", issued 1903 2407: 2405: 561:

demonstrated roll-to-roll printed organic memory in 2009.

2965: 2549: 268:

like polyurethane and polyimide, and biologic materials.

3021:

New Nano Silver Powder Enables Flexible Printed Circuits

2827: 572:

and road-mapping initiatives are intended to facilitate

375:

and other properties. Other polymers are used mostly as

292:

Other methods with similarities to printing, among them

2402: 1560: 618:

IPC/JPCA-2291, Design Guideline for Printed Electronics

564: 2891:

All set for high-volume production of printed memories

1054:

J. Siden et al., Polytronic Conference, Wroclaw, 2005.

774: 16:

Electronic devices created by various printing methods

3047:

Major Trends in Gravure Printed Electronics June 2010

160:

Printing technologies divide between sheet-based and

139:

Resolution, registration, thickness, holes, materials

3057:

Organic Solar Cells - Theory and Practice (Coursera)

3038:

Center for Advancement of Printed Electronics (CAPE)

1624: 739:

http://lib.tkk.fi/Reports/2009/isbn9789522480781.pdf

629: 576:

development (for sharing of product specifications,

2110: 597:

International Technology Roadmap for Semiconductors

2756:Printed Electronics: Markets, Technologies, Trends 2490: 1615:Ingo Grunwald et al, 2010 Biofabrication 2 014106. 1529:J.H. Cho et al, Nature Materials, 19 October 2008. 390:poly(3,4-ethylene dioxitiophene), doped with poly( 30:Gravure printing of electronic structures on paper 2439: 3510: 227:and other devices can be prepared with inkjets. 1520:M. Renn, US Patent number 7,485,345 B2. Page 3. 386:Organic semiconductors include the conductive 309:is currently not used in printed electronics. 172:are best for low-volume, high-precision work. 3077: 2145: 1848: 845: 818: 2603:. Rostec. November 24, 2014. Archived from 1363: 1277: 3084: 3070: 3011:Printed Electronics conference/exhibition 2893:Printed Electronics World, April 12th 2010 2429:https://doi.org/10.1038/s41467-017-01210-2 2986:Printed Organic and Molecular Electronics 2624: 2622: 2526: 2508: 2095: 1723: 1481: 1479: 1204: 886:Materialwissenschaft und Werkstofftechnik 442:are used with flexo, offset and inkjet. 2674:"While You're Pp, Print Me a Solar Cell" 2326: 2242: 2180: 2080:"Semiconductors for organic transistors" 2077: 2014: 2010: 2008: 1874: 1872: 1765: 1416: 1414: 1412: 1311: 1309: 1238: 1236: 1173: 1171: 1134: 1132: 1130: 1128: 1100: 1098: 1062: 1060: 1050: 1048: 999: 997: 987: 985: 151: 129: 25: 3256:Application-specific integrated circuit 3091: 2041: 1960: 1738: 1485: 1242: 991:U. Fügmann et al., mstNews 2 (2006) 13. 975: 973: 971: 969: 879: 877: 275: 246: 223:of OLED-displays, integrated circuits, 3511: 2748: 2746: 2628: 2619: 2576: 2299: 1890: 1476: 1177: 1138: 1104: 1066: 1016: 910: 431: 3065: 2359: 2320: 2293: 2236: 2201: 2174: 2139: 2104: 2071: 2062: 2035: 2005: 1954: 1925: 1919: 1884: 1869: 1842: 1829: 1800: 1794: 1759: 1732: 1686: 1645: 1609: 1545: 1532: 1523: 1514: 1449: 1409: 1400: 1357: 1328: 1322: 1306: 1271: 1233: 1198: 1168: 1159: 1125: 1095: 1057: 1045: 1010: 994: 982: 474:gallium arsenide germanium solar cell 3191:Three-dimensional integrated circuit 2699:"Stretchy solar cells a step closer" 2302:Journal of Electronics Manufacturing 2207: 1680: 1651: 1420: 966: 883: 874: 722: 565:Standards development and activities 346: 343:is possible in printed electronics. 2743: 2365: 1893:Japanese Journal of Applied Physics 1455: 939: 13: 3203:Erasable programmable logic device 3006:Cleaner Electronics Research Group 2979: 2327:Perelaer, J.; et al. (2006). 2243:Aernouts, T.; et al. (2008). 1627:Journal of Manufacturing Processes 945: 230: 225:organic photovoltaic cells (OPVCs) 201: 14: 3535: 3238:Complex programmable logic device 2999: 2905:Printed Electronics Now, May 2010 2068:H. Kempa et al., it 3 (2008) 167. 552:flexible smart electronic systems 2834:Journal of Materials Chemistry C 821:Flexible and Printed Electronics 632: 595:Similar to the well-established 446:particles are used with inkjet. 287: 213:organic field-effect transistors 3250:Field-programmable object array 3186:Mixed-signal integrated circuit 2958: 2933: 2908: 2896: 2884: 2872: 2860: 2821: 2795: 2773: 2716: 2691: 2680:, MIT News Office, 11 July 2011 2666: 2637: 2589: 2570: 2543: 2484: 2433: 2420: 2275: 1618: 1554: 1540:Organic and Printed Electronics 592:1620-2004 and IEEE 1620.1-2006. 541: 164:-based approaches. Sheet-based 3036:Western Michigan University's 2056:10.1016/j.synthmet.2004.09.001 1881:Nobel prize in chemistry, 2000 1119:10.1016/j.synthmet.2005.07.140 904: 839: 812: 768: 744: 670:Coating and printing processes 1: 3376:Hardware description language 3244:Field-programmable gate array 2633:(Thesis). Clemson University. 2497:Advanced Functional Materials 2195:10.1016/S1566-1199(01)00011-8 2097:10.1016/S1369-7021(07)70017-2 2029:10.1016/s0379-6779(97)80097-5 1386:10.1126/science.290.5499.2123 1192:10.1016/s0379-6779(02)00753-1 1039:10.1016/s0925-4005(02)00240-x 1005:Journal of Materials Research 960:10.1016/s0379-6779(00)00291-5 868:10.1016/j.jclepro.2022.134254 848:Journal of Cleaner Production 716: 479: 459:can be printed directly onto 425:with fullerene derivatives). 217:organic light-emitting diodes 2881:EETimes, September 22nd 2009 2803:"Custom Printed Electronics" 2705:, IDTechEx, 15 November 2018 1741:Microelectronics Engineering 1639:10.1016/j.jmapro.2020.07.064 1567:Journal of Materials Science 925:10.1097/POC.0000000000000091 487:Poly(ethylene terephthalate) 312: 7: 3388:Formal equivalence checking 2645:"Printing Electronics Just" 1542:, Volume 1, Issue 2 (2007). 1153:10.1016/j.orgel.2007.02.009 625: 10: 3540: 3408:Hierarchical state machine 3366:Transaction-level modeling 1803:Journal of Applied Physics 1768:Journal of Applied Physics 1687:Li, D.; Guo, L.J. (2006). 1587:10.1007/s10853-021-06080-0 586:IEEE Standards Association 520: 491:Poly(ethylene naphthalate) 417:(e.g. blends of P3HT with 377:insulators and dielectrics 18: 3519:Electronics manufacturing 3485: 3418: 3334: 3309:Digital signal processing 3294:Logic in computer science 3271: 3220:Programmable logic device 3180:Hybrid integrated circuit 3099: 3042:AccuPress gravure printer 2941:"IEEE P1620.1 Index page" 2869:IDTechEx, April 15th 2009 2783:(Press release). Thinfilm 2703:Printed Electronics World 2314:10.1142/s096031310000006x 1753:10.1016/j.mee.2006.01.241 1435:10.1109/jproc.2005.851513 1292:10.1109/jproc.2005.850305 1219:10.1109/jproc.2005.850304 3321:Switching circuit theory 3226:Programmable Array Logic 3214:Programmable logic array 2649:National Geographic News 833:10.1088/2058-8585/acf143 798:10.1088/1361-6528/ad06d4 548:preventative maintenance 423:poly(phenylene vinylene) 298:nano-imprint lithography 192:field-effect transistors 19:Not to be confused with 3371:Register-transfer level 2916:"IEEE P1620 Index page" 2249:Applied Physics Letters 2210:Applied Physics Letters 2148:Applied Physics Letters 1696:Applied Physics Letters 1488:Applied Physics Letters 1423:Proceedings of the IEEE 1331:Applied Physics Letters 1280:Proceedings of the IEEE 1207:Proceedings of the IEEE 1069:Applied Physics Letters 1019:Sensors and Actuators B 301:prepared. Sporadically 103:, metallic conductors, 3262:Tensor Processing Unit 2510:10.1002/adfm.201804798 2462:10.1002/adma.201004692 2388:10.1038/nnano.2007.365 2353:10.1002/adma.200502422 1948:10.1002/adma.200900440 1913:10.7567/JJAP.52.05DA11 1809:(2): 024503–024503–9. 1458:Chemistry of Materials 1265:10.1002/adma.200300385 135: 94:organic semiconductors 31: 3477:Electronic literature 3431:Hardware acceleration 3299:Computer architecture 3197:Emitter-coupled logic 3134:Printed circuit board 2791:– via IDTechEx. 2629:Jacobs, John (2010). 2368:Nature Nanotechnology 2289:on November 14, 2011. 1851:Polymer International 333:crystalline silicon. 294:microcontact printing 182:flexographic printing 152:Printing technologies 133: 124:light-emitting diodes 65:; capacitors; coils; 63:thin film transistors 29: 21:Printed circuit board 3524:Flexible electronics 3403:Finite-state machine 3381:High-level synthesis 3316:Circuit minimization 705:Nanoparticle silicon 690:Flexible electronics 440:Silver nanoparticles 276:Evaporation printing 247:Aerosol jet printing 84:is often related to 3450:Digital photography 3232:Generic Array Logic 3154:Combinational logic 3129:Printed electronics 3093:Digital electronics 3008:- Brunel University 2454:2011AdM....23.1935T 2380:2007NatNa...2..784N 2345:2006AdM....18.2101P 2283:"Ion Gel Insulator" 2261:2008ApPhL..92c3306A 2222:2003ApPhL..83.2070P 2183:Organic Electronics 2160:1998ApPhL..72.2660B 1983:10.1038/nature04613 1975:2006Natur.440..783S 1940:2009AdM....21.3099F 1905:2013JaJAP..52eDA11M 1815:2007JAP...101b4503H 1780:2004JAP....96.2286K 1708:2006ApPhL..88f3513L 1579:2021JMatS..5612596F 1573:(22): 12596–12606. 1500:2001ApPhL..79.2996S 1378:2000Sci...290.2123S 1372:(5499): 2123–2126. 1343:2004ApPhL..85.3304A 1257:2004AdM....16..203D 1141:Organic Electronics 1081:2005ApPhL..87l3508Z 1031:2002SeAcB..87..226H 860:2022JCPro.37634254K 790:2024Nanot..35e5301K 695:Laminar electronics 601:organic electronics 570:Technical standards 432:Inorganic materials 357:conjugated polymers 196:integrated circuits 90:plastic electronics 86:organic electronics 82:printed electronics 35:Printed electronics 3398:Asynchronous logic 3174:Integrated circuit 3139:Electronic circuit 3032:Inkjet Roll Labels 2846:10.1039/C7TC05271E 2809:. 30 December 2016 2607:on August 28, 2019 2442:Advanced Materials 2333:Advanced Materials 1928:Advanced Materials 1837:Advanced Materials 1317:Advanced Materials 1245:Advanced Materials 665:Circuit deposition 640:Electronics portal 557:Norwegian company 451:electroluminescent 369:electroluminescent 307:Electrophotography 136: 55:offset lithography 32: 3506: 3505: 3455:Digital telephone 3426:Computer hardware 3393:Synchronous logic 3025:Ferro Corporation 2840:(13): 3143–3181. 2563:978-953-51-2936-3 2448:(17): 1935–1961. 2339:(16): 2101–2104. 2269:10.1063/1.2833185 2230:10.1063/1.1609233 2125:10.1021/cr0501543 2078:Fachetti (2007). 1969:(7085): 783–786. 1857:(10): 1397–1412. 1823:10.1063/1.2403836 1788:10.1063/1.1767291 1716:10.1063/1.2168669 1666:10.1021/cr030076o 1508:10.1063/1.1413501 1470:10.1021/cm9701163 1351:10.1063/1.1801673 1089:10.1063/1.2056579 735:978-952-248-078-1 649:Amorphous silicon 355:The discovery of 347:Organic materials 71:flexible displays 3531: 3159:Sequential logic 3086: 3079: 3072: 3063: 3062: 2974: 2973: 2962: 2956: 2955: 2953: 2952: 2943:. Archived from 2937: 2931: 2930: 2928: 2927: 2918:. Archived from 2912: 2906: 2900: 2894: 2888: 2882: 2876: 2870: 2864: 2858: 2857: 2825: 2819: 2818: 2816: 2814: 2799: 2793: 2792: 2790: 2788: 2777: 2771: 2770: 2769: 2767: 2761: 2750: 2741: 2740: 2739: 2737: 2731: 2720: 2714: 2713: 2712: 2710: 2695: 2689: 2688: 2687: 2685: 2670: 2664: 2663: 2662: 2660: 2641: 2635: 2634: 2626: 2617: 2616: 2614: 2612: 2593: 2587: 2586: 2585: 2581: 2574: 2568: 2567: 2547: 2541: 2540: 2530: 2512: 2488: 2482: 2481: 2437: 2431: 2424: 2418: 2409: 2400: 2399: 2363: 2357: 2356: 2324: 2318: 2317: 2297: 2291: 2290: 2285:. Archived from 2279: 2273: 2272: 2240: 2234: 2233: 2205: 2199: 2198: 2178: 2172: 2171: 2168:10.1063/1.121090 2143: 2137: 2136: 2119:(4): 1296–1323. 2113:Chemical Reviews 2108: 2102: 2101: 2099: 2075: 2069: 2066: 2060: 2059: 2044:Synthetic Metals 2039: 2033: 2032: 2017:Synthetic Metals 2012: 2003: 2002: 1958: 1952: 1951: 1923: 1917: 1916: 1888: 1882: 1876: 1867: 1866: 1846: 1840: 1833: 1827: 1826: 1798: 1792: 1791: 1763: 1757: 1756: 1736: 1730: 1729: 1727: 1693: 1684: 1678: 1677: 1654:Chemical Reviews 1649: 1643: 1642: 1622: 1616: 1613: 1607: 1606: 1558: 1552: 1549: 1543: 1536: 1530: 1527: 1521: 1518: 1512: 1511: 1483: 1474: 1473: 1464:(6): 1299–1301. 1453: 1447: 1446: 1429:(8): 1400–1406. 1418: 1407: 1404: 1398: 1397: 1361: 1355: 1354: 1326: 1320: 1313: 1304: 1303: 1275: 1269: 1268: 1240: 1231: 1230: 1213:(7): 1321–1329. 1202: 1196: 1195: 1180:Synthetic Metals 1175: 1166: 1163: 1157: 1156: 1136: 1123: 1122: 1113:(1–3): 285–288. 1107:Synthetic Metals 1102: 1093: 1092: 1064: 1055: 1052: 1043: 1042: 1014: 1008: 1001: 992: 989: 980: 977: 964: 963: 948:Synthetic Metals 943: 937: 936: 908: 902: 901: 881: 872: 871: 843: 837: 836: 816: 810: 809: 772: 766: 765: 763: 762: 756:www.idtechex.com 748: 742: 726: 685:Flexible battery 680:Electronic paper 642: 637: 636: 578:characterization 515:Corona discharge 243:can be printed. 3539: 3538: 3534: 3533: 3532: 3530: 3529: 3528: 3509: 3508: 3507: 3502: 3481: 3414: 3349:Place and route 3344:Logic synthesis 3330: 3326:Gate equivalent 3289:Logic synthesis 3284:Boolean algebra 3267: 3209:Macrocell array 3169:Boolean circuit 3095: 3090: 3002: 2982: 2980:Further reading 2977: 2964: 2963: 2959: 2950: 2948: 2939: 2938: 2934: 2925: 2923: 2914: 2913: 2909: 2901: 2897: 2889: 2885: 2877: 2873: 2865: 2861: 2826: 2822: 2812: 2810: 2801: 2800: 2796: 2786: 2784: 2779: 2778: 2774: 2765: 2763: 2759: 2752: 2751: 2744: 2735: 2733: 2729: 2722: 2721: 2717: 2708: 2706: 2697: 2696: 2692: 2683: 2681: 2672: 2671: 2667: 2658: 2656: 2655:on May 13, 2013 2643: 2642: 2638: 2627: 2620: 2610: 2608: 2595: 2594: 2590: 2583: 2575: 2571: 2564: 2548: 2544: 2489: 2485: 2438: 2434: 2425: 2421: 2410: 2403: 2374:(12): 784–789. 2364: 2360: 2325: 2321: 2298: 2294: 2281: 2280: 2276: 2241: 2237: 2206: 2202: 2179: 2175: 2144: 2140: 2109: 2105: 2084:Materials Today 2076: 2072: 2067: 2063: 2040: 2036: 2013: 2006: 1959: 1955: 1924: 1920: 1899:(5S1): 05DA11. 1889: 1885: 1877: 1870: 1863:10.1002/pi.1587 1847: 1843: 1834: 1830: 1799: 1795: 1764: 1760: 1737: 1733: 1691: 1685: 1681: 1650: 1646: 1623: 1619: 1614: 1610: 1559: 1555: 1550: 1546: 1537: 1533: 1528: 1524: 1519: 1515: 1484: 1477: 1454: 1450: 1419: 1410: 1405: 1401: 1362: 1358: 1327: 1323: 1319:2001; 13 1753. 1314: 1307: 1276: 1272: 1241: 1234: 1203: 1199: 1176: 1169: 1164: 1160: 1137: 1126: 1103: 1096: 1065: 1058: 1053: 1046: 1015: 1011: 1007:2004; 19 1974. 1002: 995: 990: 983: 978: 967: 944: 940: 909: 905: 882: 875: 844: 840: 817: 813: 773: 769: 760: 758: 750: 749: 745: 727: 723: 719: 714: 638: 631: 628: 567: 544: 523: 482: 434: 410:poly(thiopene)s 349: 315: 290: 278: 249: 236:Screen printing 233: 231:Screen printing 204: 202:Inkjet printing 170:screen printing 154: 141: 43:screen printing 24: 17: 12: 11: 5: 3537: 3527: 3526: 3521: 3504: 3503: 3501: 3500: 3495: 3489: 3487: 3483: 3482: 3480: 3479: 3474: 3473: 3472: 3467: 3465:cinematography 3457: 3452: 3447: 3446: 3445: 3435: 3434: 3433: 3422: 3420: 3416: 3415: 3413: 3412: 3411: 3410: 3400: 3395: 3390: 3385: 3384: 3383: 3378: 3368: 3363: 3362: 3361: 3356: 3346: 3340: 3338: 3332: 3331: 3329: 3328: 3323: 3318: 3313: 3312: 3311: 3304:Digital signal 3301: 3296: 3291: 3286: 3281: 3279:Digital signal 3275: 3273: 3269: 3268: 3266: 3265: 3259: 3253: 3247: 3241: 3235: 3229: 3223: 3217: 3211: 3206: 3200: 3194: 3188: 3183: 3177: 3171: 3166: 3161: 3156: 3151: 3146: 3141: 3136: 3131: 3126: 3121: 3116: 3111: 3105: 3103: 3097: 3096: 3089: 3088: 3081: 3074: 3066: 3060: 3059: 3054: 3049: 3044: 3034: 3028: 3018: 3009: 3001: 3000:External links 2998: 2997: 2996: 2981: 2978: 2976: 2975: 2957: 2932: 2907: 2895: 2883: 2871: 2859: 2820: 2794: 2772: 2742: 2732:, Georgia Tech 2723:Zhang, Chuck, 2715: 2690: 2665: 2636: 2618: 2588: 2569: 2562: 2556:. IntechOpen. 2542: 2503:(1): 1804798. 2483: 2432: 2419: 2401: 2358: 2319: 2292: 2274: 2235: 2200: 2173: 2138: 2103: 2070: 2061: 2034: 2004: 1953: 1918: 1883: 1868: 1841: 1839:2000; 12: 227. 1828: 1793: 1758: 1731: 1679: 1660:(4): 1171–96. 1644: 1617: 1608: 1553: 1544: 1531: 1522: 1513: 1475: 1448: 1408: 1399: 1356: 1321: 1315:S. Holdcroft, 1305: 1270: 1232: 1197: 1167: 1158: 1124: 1094: 1075:(12): 123508. 1056: 1044: 1025:(2): 226–232. 1009: 1003:J. R. Sheats, 993: 981: 965: 938: 903: 873: 838: 811: 778:Nanotechnology 767: 743: 720: 718: 715: 713: 712: 707: 702: 697: 692: 687: 682: 677: 675:Conductive ink 672: 667: 662: 657: 651: 645: 644: 643: 627: 624: 620: 619: 616: 613: 605: 604: 593: 588:has published 566: 563: 543: 540: 522: 519: 481: 478: 433: 430: 365:semiconducting 348: 345: 314: 311: 289: 286: 277: 274: 248: 245: 232: 229: 203: 200: 153: 150: 140: 137: 101:semiconductors 15: 9: 6: 4: 3: 2: 3536: 3525: 3522: 3520: 3517: 3516: 3514: 3499: 3496: 3494: 3493:Metastability 3491: 3490: 3488: 3486:Design issues 3484: 3478: 3475: 3471: 3468: 3466: 3463: 3462: 3461: 3460:Digital video 3458: 3456: 3453: 3451: 3448: 3444: 3441: 3440: 3439: 3438:Digital audio 3436: 3432: 3429: 3428: 3427: 3424: 3423: 3421: 3417: 3409: 3406: 3405: 3404: 3401: 3399: 3396: 3394: 3391: 3389: 3386: 3382: 3379: 3377: 3374: 3373: 3372: 3369: 3367: 3364: 3360: 3357: 3355: 3352: 3351: 3350: 3347: 3345: 3342: 3341: 3339: 3337: 3333: 3327: 3324: 3322: 3319: 3317: 3314: 3310: 3307: 3306: 3305: 3302: 3300: 3297: 3295: 3292: 3290: 3287: 3285: 3282: 3280: 3277: 3276: 3274: 3270: 3263: 3260: 3257: 3254: 3251: 3248: 3245: 3242: 3239: 3236: 3233: 3230: 3227: 3224: 3221: 3218: 3215: 3212: 3210: 3207: 3204: 3201: 3198: 3195: 3192: 3189: 3187: 3184: 3181: 3178: 3175: 3172: 3170: 3167: 3165: 3162: 3160: 3157: 3155: 3152: 3150: 3147: 3145: 3142: 3140: 3137: 3135: 3132: 3130: 3127: 3125: 3122: 3120: 3117: 3115: 3112: 3110: 3107: 3106: 3104: 3102: 3098: 3094: 3087: 3082: 3080: 3075: 3073: 3068: 3067: 3064: 3058: 3055: 3053: 3050: 3048: 3045: 3043: 3039: 3035: 3033: 3029: 3026: 3022: 3019: 3017: 3014: 3010: 3007: 3004: 3003: 2995: 2994:1-4020-7707-6 2991: 2987: 2984: 2983: 2971: 2970:www.inemi.org 2967: 2961: 2947:on 2011-06-10 2946: 2942: 2936: 2922:on 2011-06-10 2921: 2917: 2911: 2904: 2899: 2892: 2887: 2880: 2875: 2868: 2863: 2855: 2851: 2847: 2843: 2839: 2835: 2831: 2824: 2808: 2804: 2798: 2782: 2776: 2758: 2757: 2749: 2747: 2728: 2727: 2719: 2704: 2700: 2694: 2679: 2675: 2669: 2654: 2650: 2646: 2640: 2632: 2625: 2623: 2606: 2602: 2598: 2592: 2579: 2573: 2565: 2559: 2555: 2554: 2546: 2538: 2534: 2529: 2524: 2520: 2516: 2511: 2506: 2502: 2498: 2494: 2487: 2479: 2475: 2471: 2467: 2463: 2459: 2455: 2451: 2447: 2443: 2436: 2430: 2423: 2417: 2414: 2408: 2406: 2397: 2393: 2389: 2385: 2381: 2377: 2373: 2369: 2362: 2354: 2350: 2346: 2342: 2338: 2334: 2330: 2323: 2315: 2311: 2307: 2303: 2296: 2288: 2284: 2278: 2270: 2266: 2262: 2258: 2255:(3): 033306. 2254: 2250: 2246: 2239: 2231: 2227: 2223: 2219: 2215: 2211: 2204: 2196: 2192: 2188: 2184: 2177: 2169: 2165: 2161: 2157: 2153: 2149: 2142: 2134: 2130: 2126: 2122: 2118: 2114: 2107: 2098: 2093: 2089: 2085: 2081: 2074: 2065: 2057: 2053: 2049: 2045: 2038: 2030: 2026: 2022: 2018: 2011: 2009: 2000: 1996: 1992: 1988: 1984: 1980: 1976: 1972: 1968: 1964: 1957: 1949: 1945: 1941: 1937: 1933: 1929: 1922: 1914: 1910: 1906: 1902: 1898: 1894: 1887: 1880: 1875: 1873: 1864: 1860: 1856: 1852: 1845: 1838: 1832: 1824: 1820: 1816: 1812: 1808: 1804: 1797: 1789: 1785: 1781: 1777: 1773: 1769: 1762: 1754: 1750: 1746: 1742: 1735: 1726: 1725:2027.42/87779 1721: 1717: 1713: 1709: 1705: 1702:(6): 063513. 1701: 1697: 1690: 1683: 1675: 1671: 1667: 1663: 1659: 1655: 1648: 1640: 1636: 1632: 1628: 1621: 1612: 1604: 1600: 1596: 1592: 1588: 1584: 1580: 1576: 1572: 1568: 1564: 1557: 1548: 1541: 1535: 1526: 1517: 1509: 1505: 1501: 1497: 1493: 1489: 1482: 1480: 1471: 1467: 1463: 1459: 1452: 1444: 1440: 1436: 1432: 1428: 1424: 1417: 1415: 1413: 1403: 1395: 1391: 1387: 1383: 1379: 1375: 1371: 1367: 1360: 1352: 1348: 1344: 1340: 1336: 1332: 1325: 1318: 1312: 1310: 1301: 1297: 1293: 1289: 1285: 1281: 1274: 1266: 1262: 1258: 1254: 1250: 1246: 1239: 1237: 1228: 1224: 1220: 1216: 1212: 1208: 1201: 1193: 1189: 1185: 1181: 1174: 1172: 1162: 1154: 1150: 1146: 1142: 1135: 1133: 1131: 1129: 1120: 1116: 1112: 1108: 1101: 1099: 1090: 1086: 1082: 1078: 1074: 1070: 1063: 1061: 1051: 1049: 1040: 1036: 1032: 1028: 1024: 1020: 1013: 1006: 1000: 998: 988: 986: 976: 974: 972: 970: 961: 957: 953: 949: 942: 934: 930: 926: 922: 918: 914: 907: 899: 895: 891: 887: 880: 878: 869: 865: 861: 857: 853: 849: 842: 834: 830: 827:(3): 035009. 826: 822: 815: 807: 803: 799: 795: 791: 787: 784:(5): 055301. 783: 779: 771: 757: 753: 747: 740: 736: 732: 725: 721: 711: 708: 706: 703: 701: 698: 696: 693: 691: 688: 686: 683: 681: 678: 676: 673: 671: 668: 666: 663: 661: 658: 655: 652: 650: 647: 646: 641: 635: 630: 623: 617: 614: 611: 610: 609: 602: 598: 594: 591: 587: 583: 582: 581: 579: 575: 571: 562: 560: 555: 553: 549: 539: 535: 531: 527: 518: 516: 512: 507: 504: 500: 496: 492: 488: 477: 475: 470: 468: 465: 462: 458: 454: 452: 447: 445: 441: 437: 429: 426: 424: 420: 416: 415:photovoltaics 411: 406: 404: 400: 396: 393: 389: 384: 380: 378: 374: 370: 366: 362: 358: 353: 344: 342: 338: 334: 330: 327: 323: 319: 310: 308: 304: 299: 295: 288:Other methods 285: 283: 273: 269: 267: 261: 257: 254: 244: 242: 237: 228: 226: 222: 218: 214: 210: 199: 197: 193: 188: 183: 179: 175: 171: 167: 163: 158: 149: 145: 132: 128: 125: 121: 116: 112: 110: 106: 105:nanoparticles 102: 99: 95: 91: 87: 83: 78: 76: 72: 68: 64: 60: 56: 52: 48: 44: 40: 36: 28: 22: 3419:Applications 3128: 2985: 2969: 2960: 2949:. Retrieved 2945:the original 2935: 2924:. Retrieved 2920:the original 2910: 2898: 2886: 2874: 2862: 2837: 2833: 2823: 2811:. Retrieved 2806: 2797: 2787:November 30, 2785:. Retrieved 2775: 2766:November 30, 2764:, retrieved 2755: 2753:Das, Raghu, 2736:November 30, 2734:, retrieved 2725: 2718: 2709:November 30, 2707:, retrieved 2702: 2693: 2684:November 30, 2682:, retrieved 2677: 2668: 2659:November 30, 2657:, retrieved 2653:the original 2648: 2639: 2630: 2611:November 28, 2609:. Retrieved 2605:the original 2600: 2591: 2572: 2552: 2545: 2500: 2496: 2486: 2445: 2441: 2435: 2422: 2371: 2367: 2361: 2336: 2332: 2322: 2305: 2301: 2295: 2287:the original 2277: 2252: 2248: 2238: 2216:(10): 2070. 2213: 2209: 2203: 2186: 2182: 2176: 2154:(21): 2660. 2151: 2147: 2141: 2116: 2112: 2106: 2087: 2083: 2073: 2064: 2047: 2043: 2037: 2020: 2016: 1966: 1962: 1956: 1934:(30): 3099. 1931: 1927: 1921: 1896: 1892: 1886: 1854: 1850: 1844: 1836: 1831: 1806: 1802: 1796: 1771: 1767: 1761: 1747:(4–9): 831. 1744: 1740: 1734: 1699: 1695: 1682: 1657: 1653: 1647: 1630: 1626: 1620: 1611: 1570: 1566: 1556: 1547: 1539: 1534: 1525: 1516: 1494:(18): 2996. 1491: 1487: 1461: 1457: 1451: 1426: 1422: 1402: 1369: 1365: 1359: 1337:(15): 3304. 1334: 1330: 1324: 1316: 1283: 1279: 1273: 1248: 1244: 1210: 1206: 1200: 1183: 1179: 1161: 1144: 1140: 1110: 1106: 1072: 1068: 1022: 1018: 1012: 1004: 954:(1–3): 1–3. 951: 947: 941: 919:(2): 61–71. 916: 912: 906: 889: 885: 851: 847: 841: 824: 820: 814: 781: 777: 770: 759:. Retrieved 755: 746: 724: 700:Microcontact 621: 606: 568: 556: 545: 542:Applications 536: 532: 528: 524: 508: 493:- (PEN) and 483: 471: 467:glass sheets 455: 448: 438: 435: 427: 407: 385: 381: 373:photovoltaic 354: 350: 335: 331: 328: 324: 320: 316: 303:pad printing 291: 279: 270: 262: 258: 250: 234: 215:(OFETs) and 205: 162:roll-to-roll 159: 155: 146: 142: 117: 113: 81: 79: 75:smart labels 37:is a set of 34: 33: 3149:Memory cell 1774:(4): 2286. 1286:(7): 1330. 892:(10): 789. 574:value chain 503:wettability 495:poly(imide) 401:) and poly( 253:atomization 47:flexography 3513:Categories 3498:Runt pulse 3470:television 3164:Logic gate 3109:Transistor 3101:Components 2951:2006-11-30 2926:2006-11-30 2807:Almax - RP 2762:, IDTechEx 1251:(3): 203. 1147:(5): 480. 854:: 134254. 761:2020-09-21 717:References 480:Substrates 472:A printed 461:molybdenum 457:CIGS cells 361:conducting 221:backplanes 3354:Placement 3144:Flip-flop 3124:Capacitor 3040:includes 2854:2050-7534 2813:13 August 2601:rostec.ru 2519:1616-301X 2470:0935-9648 2413:Schreiner 2308:: 69–77. 2189:(2): 65. 2090:(3): 38. 1633:: 55–66. 1603:233303736 1595:1573-4803 1538:B. Kahn, 419:fullerene 399:PEDOT:PSS 395:sulfonate 313:Materials 209:viscosity 109:nanotubes 98:inorganic 80:The term 67:resistors 3119:Inductor 3114:Resistor 2678:MIT News 2537:32733177 2478:21433116 2396:18654432 2133:17378616 1991:16598254 1835:Z. Bao, 1674:15826012 1443:23177369 1394:11118142 1227:27061013 933:77379659 806:37879329 710:Oligomer 660:Chip tag 626:See also 559:ThinFilm 485:paper. 388:polymers 339:but not 266:polymers 39:printing 3359:Routing 3193:(3D IC) 2578:GB 4681 2528:7384005 2450:Bibcode 2376:Bibcode 2341:Bibcode 2257:Bibcode 2218:Bibcode 2156:Bibcode 1999:4344708 1971:Bibcode 1936:Bibcode 1901:Bibcode 1811:Bibcode 1776:Bibcode 1704:Bibcode 1575:Bibcode 1496:Bibcode 1374:Bibcode 1366:Science 1339:Bibcode 1300:8915461 1253:Bibcode 1077:Bibcode 1027:Bibcode 856:Bibcode 786:Bibcode 521:History 511:coating 403:aniline 392:styrene 187:gravure 174:Gravure 51:gravure 3336:Design 3272:Theory 3258:(ASIC) 3252:(FPOA) 3246:(FPGA) 3240:(CPLD) 3205:(EPLD) 2992: 2852: 2584: 2560: 2535: 2525: 2517: 2476: 2468: 2394: 2131: 2023:: 53. 1997: 1989: 1963:Nature 1672: 1601: 1593: 1441: 1392: 1298: 1225: 1186:: 41. 931: 804: 733: 654:Anilox 464:coated 178:offset 166:inkjet 107:, and 59:inkjet 57:, and 3443:radio 3264:(TPU) 3234:(GAL) 3228:(PAL) 3222:(PLD) 3216:(PLA) 3199:(ECL) 3182:(HIC) 3030:View 2760:(PDF) 2730:(PDF) 2427:1-11. 2050:: 1. 1995:S2CID 1692:(PDF) 1599:S2CID 1439:S2CID 1296:S2CID 1223:S2CID 929:S2CID 656:rolls 499:Paper 449:A.C. 241:OFETs 3176:(IC) 3013:Asia 2990:ISBN 2850:ISSN 2815:2021 2789:2018 2768:2018 2738:2018 2711:2018 2686:2018 2661:2018 2613:2018 2558:ISBN 2533:PMID 2515:ISSN 2474:PMID 2466:ISSN 2392:PMID 2129:PMID 1987:PMID 1670:PMID 1591:ISSN 1390:PMID 802:PMID 731:ISBN 590:IEEE 584:The 444:Gold 397:), ( 341:CMOS 337:PMOS 296:and 207:low- 194:and 180:and 168:and 120:RFID 3016:USA 2842:doi 2523:PMC 2505:doi 2458:doi 2384:doi 2349:doi 2310:doi 2265:doi 2226:doi 2191:doi 2164:doi 2121:doi 2117:107 2092:doi 2052:doi 2048:148 2025:doi 1979:doi 1967:440 1944:doi 1909:doi 1859:doi 1819:doi 1807:101 1784:doi 1749:doi 1720:hdl 1712:doi 1662:doi 1658:105 1635:doi 1583:doi 1504:doi 1466:doi 1431:doi 1382:doi 1370:290 1347:doi 1288:doi 1261:doi 1215:doi 1188:doi 1184:135 1149:doi 1115:doi 1111:153 1085:doi 1035:doi 956:doi 952:115 921:doi 894:doi 864:doi 852:376 829:doi 794:doi 513:or 88:or 3515:: 2968:. 2848:. 2836:. 2832:. 2805:. 2745:^ 2701:, 2676:, 2647:, 2621:^ 2599:. 2531:. 2521:. 2513:. 2501:29 2499:. 2495:. 2472:. 2464:. 2456:. 2446:23 2444:. 2404:^ 2390:. 2382:. 2370:. 2347:. 2337:18 2335:. 2331:. 2306:10 2304:. 2263:. 2253:92 2251:. 2247:. 2224:. 2214:83 2212:. 2185:. 2162:. 2152:72 2150:. 2127:. 2115:. 2088:10 2086:. 2082:. 2046:. 2021:87 2019:. 2007:^ 1993:. 1985:. 1977:. 1965:. 1942:. 1932:21 1930:. 1907:. 1897:52 1895:. 1871:^ 1855:53 1853:. 1817:. 1805:. 1782:. 1772:96 1770:. 1745:83 1743:. 1718:. 1710:. 1700:88 1698:. 1694:. 1668:. 1656:. 1631:58 1629:. 1597:. 1589:. 1581:. 1571:56 1569:. 1565:. 1502:. 1492:79 1490:. 1478:^ 1460:. 1437:. 1427:93 1425:. 1411:^ 1388:. 1380:. 1368:. 1345:. 1335:85 1333:. 1308:^ 1294:. 1284:93 1282:. 1259:. 1249:16 1247:. 1235:^ 1221:. 1211:93 1209:. 1182:. 1170:^ 1143:. 1127:^ 1109:. 1097:^ 1083:. 1073:87 1071:. 1059:^ 1047:^ 1033:. 1023:87 1021:. 996:^ 984:^ 968:^ 950:. 927:. 917:15 915:. 890:32 888:. 876:^ 862:. 850:. 823:. 800:. 792:. 782:35 780:. 754:. 737:. 469:. 379:. 371:, 367:, 363:, 282:μm 176:, 96:, 73:, 53:, 49:, 45:, 3085:e 3078:t 3071:v 3027:) 3023:( 2972:. 2954:. 2929:. 2856:. 2844:: 2838:6 2817:. 2615:. 2566:. 2539:. 2507:: 2480:. 2460:: 2452:: 2398:. 2386:: 2378:: 2372:2 2355:. 2351:: 2343:: 2316:. 2312:: 2271:. 2267:: 2259:: 2232:. 2228:: 2220:: 2197:. 2193:: 2187:2 2170:. 2166:: 2158:: 2135:. 2123:: 2100:. 2094:: 2058:. 2054:: 2031:. 2027:: 2001:. 1981:: 1973:: 1950:. 1946:: 1938:: 1915:. 1911:: 1903:: 1865:. 1861:: 1825:. 1821:: 1813:: 1790:. 1786:: 1778:: 1755:. 1751:: 1728:. 1722:: 1714:: 1706:: 1676:. 1664:: 1641:. 1637:: 1605:. 1585:: 1577:: 1510:. 1506:: 1498:: 1472:. 1468:: 1462:9 1445:. 1433:: 1396:. 1384:: 1376:: 1353:. 1349:: 1341:: 1302:. 1290:: 1267:. 1263:: 1255:: 1229:. 1217:: 1194:. 1190:: 1155:. 1151:: 1145:8 1121:. 1117:: 1091:. 1087:: 1079:: 1041:. 1037:: 1029:: 962:. 958:: 935:. 923:: 900:. 896:: 870:. 866:: 858:: 835:. 831:: 825:8 808:. 796:: 788:: 764:. 603:. 23:.

Text is available under the Creative Commons Attribution-ShareAlike License. Additional terms may apply.