298:
217:
346:
358:
334:
322:
42:
68:
310:
80:
216:
30:
195:
SLT uses dual diode chips and individual transistor chips each approximately 0.025 inches (0.64 mm) square. The chips are mounted on a 0.5 inches (13 mm) square substrate with silk-screened resistors and printed connections. The whole is encapsulated to form a 0.5 inches (13 mm) square
280:
Monolithic System
Technology (MST) increased packaging density and circuit performance by replacing discrete transistors and diodes with one to four monolithic integrated circuits (resistors now external from the package on the module). Each MST chip holds about five circuits and is the approximate
253:
Unit Logic Device (ULD) use flat-pack ceramic packages, much smaller than SLT's metal cans. Each package contains a ceramic wafer with up to four silicon dies on top, each die implementing one transistor or two diodes; and thick-film resistors underneath. ULDs were used in the
232:
inch (13 mm) square. Circuits are laid down first, followed by resistive material. Pins are added, the circuits are soldered and the resistors trimmed to the desired value. Then individual transistors and diodes are added and the package is
137:
on a ceramic substrate, forming an SLT module. The circuits were either encapsulated in plastic or covered with a metal lid. Several of these SLT modules (20 in the image on the right) were then mounted on a small multi-layer
297:
249:
Solid Logic Dense (SLD) increased packaging density and circuit performance by mounting the discrete transistors and diodes on top of the substrate and the resistors on the bottom. SLD voltages were the same as
196:
module. Up to 36 modules are mounted on each card, though a few card types had just discrete components and no modules. Cards plug into boards which are connected to form gates which form frames.
149:
technology too immature at the time. SLT was a revolutionary technology for 1964, with much higher circuit densities and improved reliability over earlier packaging techniques such as the
142:
board to make an SLT card. Each SLT card had a socket on one edge that plugged into pins on the computer's backplane (the exact reverse of how most other companies' modules were mounted).
245:
The same basic packaging technology (both device and module) was also used for the devices that replaced SLT as IBM gradually transitioned to the use of monolithic integrated circuits:
357:
265:
Advanced Solid Logic
Technology (ASLT) increased packaging density and circuit performance by stacking two substrates in the same package. ASLT is based on the
466:
606:
506:
542:
Davis, E.M.; Harding, W.E.; Schwartz, R.S.; Corning, J.J. (April 1964). "Solid Logic
Technology: Versatile, High-Performance Microelectronics".
419:
Davis, E.M.; Harding, W.E.; Schwartz, R.S.; Corning, J.J. (April 1964). "Solid Logic
Technology: Versatile, High-Performance Microelectronics".
345:
601:
153:. It helped propel the IBM System/360 mainframe family to overwhelming success during the 1960s. SLT research produced ball chip assembly,
285:. MST was first introduced in January 1968 and provided improved cost/performance for IBM's System/370 product line of the 1970s.
591:
309:
157:, trimmed thick-film resistors, printed discrete functions, chip capacitors and one of the first volume uses of hybrid
516:
266:
255:
596:
168:, although some later SMS cards held SLT modules. SLT had several updates during its life, the last being the
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Steps in manufacturing Solid Logic
Technology hybrid modules. The process starts with a blank ceramic wafer,
146:
333:
479:
150:
321:
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374:
165:
110:
series of computers. It was also used in the 1130, announced in 1965. IBM chose to design custom
586:
492:
270:
158:
394:
8:
559:
436:
177:
106:'s method for hybrid packaging of electronic circuitry introduced in 1964 with the IBM
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563:
440:
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428:
139:
131:
363:
Closeup shows the raised squares of the transistors and the flat black resistors
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111:
580:
480:"A circuit board from the Saturn V rocket, reverse-engineered and explained"
273:. ASLT voltage levels were : > +235 mV is high, < -239 mV is low.
573:, Vintage Computer Chips, includes video of automated manufacturing process
67:
41:
35:
A double-width SLT card. The square metal cans contain the hybrid circuits.
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432:
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123:
107:
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SLT voltage levels, logic low to logic high, varied by circuit speed:
79:
154:
115:
259:
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SLT used silicon planar glass-encapsulated transistors and diodes.
134:
86:
176:) which replaced the single transistors of SLT with small-scale
127:
119:
505:
Pugh, Emerson W.; Johnson, Lyle R.; Palmer, John H. (1991).
303:
Monolithic System
Technology card with module covers removed
541:
418:
467:
Logic Blocks
Automated Logic Diagrams SLT, SLD, ASLT, MST
103:
351:
Module with six transistors and three resistors, cap off
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that held four or five transistors. MST was used in the
29:
315:
An uncommon half-width SLT card with no SLT modules
504:
184:, which began to replace the System/360 in 1970.
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16:IBM hybrid circuit technology introduced in 1964
495:. Popular Science. Oct 1965. p. 94-95; 206-208.
571:IBM's Solid Logic Technology (SLT) 1964-1968
215:
281:equivalent of an SLT card. Circuits used
493:"Tiny Computers Steer Mightiest Rockets"
544:IBM Journal of Research and Development
421:IBM Journal of Research and Development
258:and Launch Vehicle Data Adapter of the
607:Computer-related introductions in 1964
579:
206:Medium speed (30 ns) 0.0 to 3.0 V
203:High speed (5-10 ns) 0.9 to 3.0 V
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209:Low speed (700 ns) 0.0 to 12.0 V
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602:Printed circuit board manufacturing
73:Many SLT cards plugged into a board
13:
447:
14:
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535:
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78:
66:
40:
28:
267:Emitter-follower-coupled-switch
256:Launch Vehicle Digital Computer
508:IBM's 360 and Early 370 System
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485:
472:
1:
592:IBM System/360 mainframe line
380:
147:monolithic integrated circuit
170:Monolithic System Technology
47:Three single-width SLT cards
22:Solid Logic Technology cards
7:
393:Boyer, Chuck (April 2004).
368:
10:
623:
511:. MIT Press. p. 425.
289:
187:
164:SLT replaced the earlier
85:SLT cards in an IBM 129
491:Dr. Wernher von Braun.
375:Standard Modular System
166:Standard Modular System
151:Standard Modular System
271:current-steering logic
96:Solid Logic Technology
597:IBM computer hardware
339:Quad-width SLT module
159:thick-film technology
395:"The 360 Revolution"
178:integrated circuits
556:10.1147/rd.82.0102
433:10.1147/rd.82.0102
241:Later developments
400:. IBM. p. 18
327:Single-width card
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114:using discrete,
82:
70:
44:
32:
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417:
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371:
364:
361:
352:
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337:
328:
325:
316:
313:
304:
301:
292:
283:NPN transistors
243:
238:
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235:
234:
228:
224:
223:
190:
145:IBM considered
140:printed circuit
112:hybrid circuits
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12:
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5:
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550:(2): 102–114.
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536:External links
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532:
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478:Ken Shirriff.
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469:(PDF) 86 pages
446:
427:(2): 102–114.
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122:-encapsulated
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77:
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65:
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56:
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54:
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39:
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34:
27:
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21:
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9:
6:
4:
3:
2:
619:
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587:Chip carriers
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518:9780262161237
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233:encapsulated.
218:
208:
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200:
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185:
183:
179:
175:
171:
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155:wafer bumping
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132:silk-screened
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125:
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117:
113:
109:
105:
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97:
88:
81:
69:
60:
43:
31:
547:
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522:. Retrieved
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402:. Retrieved
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276:
244:
198:
194:
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173:
169:
163:
144:
99:
95:
94:
58:
124:transistors
581:Categories
381:References
269:used with
182:System/370
118:-mounted,
108:System/360
57:SLT cards
524:August 8,
135:resistors
116:flip chip
564:13288023
441:13288023
369:See also
260:Saturn V
87:keypunch
482:. 2020.
290:Gallery
262:rocket.
227:⁄
188:Details
130:, with
59:in situ
562:
515:
439:
404:27 May
128:diodes
102:) was
560:S2CID
437:S2CID
398:(PDF)
120:glass
526:2022
513:ISBN
406:2018
250:SLT.
126:and
552:doi
429:doi
174:MST
104:IBM
100:SLT
583::
558:.
546:.
449:^
435:.
423:.
161:.
566:.
554::
548:8
528:.
443:.
431::
425:8
408:.
229:2
225:1
172:(
98:(
Text is available under the Creative Commons Attribution-ShareAlike License. Additional terms may apply.
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