297:
254:
312:
281:
266:
43:
529:. The exposed pad is an extra pad underneath or on top of the QFP that may act as a ground connection and/or as a heat sink for the package. The pad is typically 10 or more mm, and with the pad soldered down onto the ground plane, heat is passed into the PCB. This exposed pad also gives a solid ground connection. These type of QFP packages often have a
362:) provides the same benefits as the metric QFP, but is thinner. Regular QFP are 2.0 to 3.8 mm thick depending on size. TQFP packages range from 32 pins with a 0.8 mm lead pitch, in a package 5 mm by 5 mm by 1 mm thick, to 256 pins, 28 mm square, 1.4 mm thick and a lead pitch of 0.4 mm.
549:
Hereby the leadframe is attached between two ceramic layers of the package. The leadframe is attached using glass. This package is a variant of the CERDIP package. CERQUAD packages are the "low cost" alternative for CQFP packages, and are mainly used for terrestrial applications. Main ceramic package
571:
Due to the large body size of CQFP packages, parasitics are important for this package. Power supply decoupling is improved by having the decoupling capacitors mounted on top of this package. E.g. TI offers 256-pin CQFP packages where decoupling capacitors can be soldered on top of the package E.g.
325:
The basic form is a flat rectangular (often square) body with leads on four sides but with numerous variation in the design. These differ usually only in lead number, pitch, dimensions, and materials used (usually to improve thermal characteristics). A clear variation is
558:
Hereby the leads are soldered on top of the package. The package is a multilayer package, and is offered as HTCC (high temperature co-fired ceramic). The number of bonding decks can be one, two or three. Package is finished with a nickel plus a
563:
gold layer, except where the leads are soldered and decoupling capacitors are soldered on top of the package. These packages are hermetic. Two methods are used in order to make the hermetic sealing: eutectic gold-tin alloy (melting point
242:(BGA) packages, by allowing connections to be made over the area of the package and not just around the edges, allowed for higher pin counts with similar package sizes, and reduced the problems with close lead spacing.
214:(PLCC) which is similar but has pins with larger pitch, 1.27 mm (or 1/20 inch), curved up underneath a thicker body to simplify socketing (soldering is also possible). It is commonly used for
568:°C) or seam welding. Seam welding gives rise to significantly less temperature rise in the internal of the package (e.g., the die attach). This package is the main package used for Space projects.
140:
173:
with "gull wing" leads extending from each of the four sides. Socketing such packages is rare and through-hole mounting is not possible. Versions ranging from 32 to 304 pins with a
365:
TQFPs help solve issues such as increasing board density, die shrink programs, thin end-product profile and portability. Lead counts range from 32 to 176. Body sizes range from
575:
The main ceramic package manufacturers are
Kyocera (Japan), NTK (Japan), Test-Expert (Russia), etc. and offer the full pincount range. Maximum pin count is 352 pins.
226:
The quad flat-pack has connections only around the periphery of the package. To increase the number of pins, the spacing was decreased from 50 mil (as found on
347:) is a package with no component leads extending from the IC. Pads are spaced along the sides of the IC with an exposed die that can be used as ground.
296:
793:
373:. Copper lead-frames are used in TQFPs. Lead pitches available for TQFPs are 0.4 mm, 0.5 mm, 0.65 mm, 0.8 mm, and 1.0 mm.
280:
526:
311:
1188:
969:
963:
957:
945:
933:
927:
915:
819:
396:
package format with component leads extending from each of the four sides. Pins are numbered counter-clockwise from the index dot.
253:
265:
107:
79:
751:
635:
1100:
786:
381:, is a type of QFP, as is the thinner TQFP package. PQFP packages can vary in thickness from 2.0 mm to 3.8 mm. A
86:
1027:
230:) to 20 and later 12 (1.27 mm, 0.51 mm and 0.30 mm respectively). However, this close lead spacing made
177:
ranging from 0.4 to 1.0 mm are common. Other special variants include low-profile QFP (LQFP) and thin QFP (TQFP).
60:
1214:
It is relatively common to find packages that contain other components than their designated ones, such as diodes or
1157:
1037:
667:
126:
1022:
93:
334:) with extensions at the four corners to protect the leads against mechanical damage before the unit is soldered.
779:
64:
234:
more likely and put higher demands on the soldering process and alignment of parts during assembly. The later
75:
831:
761:
1183:
700:
170:
1066:
211:
734:
1071:
1032:
1017:
1002:
343:
572:
Test-expert 256-pin CQFP packages where decoupling capacitors can be soldered on top of the package.
1198:
862:
287:
164:
1203:
1042:
53:
31:
1235:
1012:
986:
100:
627:
1193:
1162:
802:
227:
204:
619:
1178:
1061:
1007:
854:
595:
192:
17:
8:
1120:
843:
272:
683:
1147:
1137:
393:
167:
27:
Surface mount integrated circuit package with "gull wing" pins extending from all sides
400:
between pins can vary; common spacings are 0.4, 0.5, 0.65 and 0.80 mm intervals.
1215:
1076:
663:
631:
620:
533:
suffix (e.g. a LQFP-EP 64), or they have an odd number of leads, (e.g. a TQFP-101).
215:
1152:
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239:
1110:
717:
589:
303:
235:
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429:
390:
231:
185:
756:
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196:
771:
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318:
200:
1142:
550:
manufacturers are
Kyocera, NTK,... and offer the full pincount range
397:
348:
174:
144:
42:
139:
762:
PQFP packaging information from
Integrated Silicon Solution, Inc.
951:
939:
921:
909:
837:
825:
181:
903:
897:
891:
885:
811:
541:
Ceramic QFP packages come in two variants, CERQUAD and CQFP:
189:
30:"QFP" redirects here. For the digital logic technology, see
879:
873:
867:
622:
Integrated circuit packaging, assembly and interconnections
188:
during the early nineties, even though it has been used in
148:
592:- an alternative integrated circuit pin arrangement design
765:
286:
304-pin plastic quad flat package (QFP) with exposed
67:. Unsourced material may be challenged and removed.
1227:
654:Cohn, Charles; Harper, Charles A., eds. (2005).
180:The QFP component package type became common in
787:
735:"Корпус микросхемы МК 4244.256-3 (тип CQFP)"
302:100-pin bumpered quad flat package (BQFP) –
259:144-pin low profile quad flat package (LQFP)
195:since the seventies. It is often mixed with
1189:List of integrated circuit packaging types
801:
794:
780:
653:
339:heatsink very thin quad flat-pack no-leads
317:80-pin ceramic quad flat package (TQFP) –
752:HVQFN Documentation at NXP Semiconductors
613:
611:
127:Learn how and when to remove this message
656:Failure-free integrated circuit packages
649:
647:
138:
846:(SOD-123 / SOD-323 / SOD-523 / SOD-923)
271:80-pin thin quad flat package (TQFP) –
14:
1228:
608:
536:
775:
644:
617:
65:adding citations to reliable sources
36:
727:
693:
684:"AMIS-492x0 Fieldbus MAU Datasheet"
676:
544:
479:near chip-scale quad flat package.
447:plastic enhanced quad flat package
218:and other programmable components.
24:
25:
1247:
745:
710:
553:
519:thin dual flat no-lead package.
428:bumpered quad flat package with
310:
295:
279:
264:
252:
41:
147:in a 44-pin QFP (special case:
52:needs additional citations for
828:(DO-7 / DO-26 / DO-35 / DO-41)
718:"Ceramic Quad Flatpack (CQFP)"
463:low profile quad flat package
404:Other quad flat package types
221:
13:
1:
601:
503:very small quad flat package
455:fine pitch quad flat package
383:low-profile quad flat package
337:Heat sink quad flat package,
1218:in transistor packages, etc.
1184:Integrated circuit packaging
511:very thin quad flat package
210:A package related to QFP is
7:
578:
420:bumpered quad flat package
245:
212:plastic leaded chip carrier
10:
1252:
618:Greig, William J. (2007).
525:Some QFP packages have an
439:ceramic quad flat package
328:bumpered quad flat package
29:
1212:
1171:
1119:
1088:
1051:
995:
979:
853:
809:
471:metric quad flat package
203:, components on the same
1199:Surface-mount technology
487:small quad flat package
1204:Through-hole technology
495:thin quad flat package
351:between pins can vary.
32:Quantum flux parametron
834:(MELF / SOD-80 / LL34)
803:Semiconductor packages
379:plastic quad flat pack
228:small outline packages
152:
1194:Printed circuit board
626:. Springer. pp.
205:printed circuit board
142:
1179:Electronic packaging
596:Dual in-line package
193:consumer electronics
61:improve this article
701:"AAT3620 Datasheet"
537:Ceramic QFP package
405:
356:thin quad flat pack
319:ST6 microcontroller
273:PIC microcontroller
76:"Quad flat package"
1216:voltage regulators
662:. pp. 22–28.
403:
394:integrated circuit
216:NOR flash memories
168:integrated circuit
153:
1223:
1222:
972:(Super-247) (SMT)
966:(Super-220) (SMT)
840:(SMA / SMB / SMC)
637:978-0-387-28153-7
523:
522:
157:quad flat package
137:
136:
129:
111:
16:(Redirected from
1243:
796:
789:
782:
773:
772:
757:More about HQVFN
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545:CERQUAD packages
406:
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256:
199:, and sometimes
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240:ball grid array
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165:surface-mounted
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1172:Related topics
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1038:TSSOP / HTSSOP
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746:External links
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590:Pin grid array
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304:Cyrix Cx486SLC
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236:pin grid array
232:solder bridges
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135:
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26:
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2:
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1236:Chip carriers
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960:(D3PAK) (SMT)
959:
956:
954:(D2PAK) (SMT)
953:
950:
948:(I2PAK) (SMT)
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669:0-07-143484-4
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554:CQFP packages
551:
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430:heat spreader
427:
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391:surface mount
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186:United States
183:
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117:December 2011
109:
106:
102:
99:
95:
92:
88:
85:
81:
78: –
77:
73:
72:Find sources:
66:
62:
56:
55:
50:This article
48:
44:
39:
38:
33:
19:
1163:WL-CSP / WLP
1033:TSOP / HTSOP
942:(DPAK) (SMT)
936:(IPAK) (SMT)
930:(TH / Panel)
924:(TH / Panel)
918:(TH / Panel)
912:(TH / Panel)
900:(TH / Panel)
870:(TH / Panel)
729:
712:
695:
678:
655:
621:
585:Chip carrier
574:
570:
560:
557:
548:
540:
530:
524:
412:description
386:
382:
378:
374:
364:
359:
355:
353:
342:
338:
336:
331:
327:
324:
225:
209:
197:hole mounted
179:
160:
156:
154:
123:
114:
104:
97:
90:
83:
71:
59:Please help
54:verification
51:
1081:QUIP / QUIL
660:McGraw-Hill
527:exposed pad
367:5 mm × 5 mm
288:thermal pad
222:Limitations
1089:Grid array
1028:SOP / SSOP
980:Single row
863:SOT / TSOT
602:References
371:20 × 20 mm
238:(PGA) and
87:newspapers
1143:Flip Chip
1062:QIP / QIL
1023:SO / SOIC
1013:Flat Pack
1008:DIP / DIL
987:SIP / SIL
855:3...5-pin
145:Zilog Z80
1230:Category
1052:Quad row
996:Dual row
579:See also
246:Variants
201:socketed
190:Japanese
822:(DO-27)
810:Single
409:Package
398:Spacing
389:) is a
349:Spacing
207:(PCB).
171:package
163:) is a
101:scholar
970:TO-274
964:TO-273
958:TO-268
952:TO-263
946:TO-262
940:TO-252
934:TO-251
928:TO-247
922:TO-220
916:TO-202
910:TO-126
838:DO-214
832:DO-213
826:DO-204
820:DO-201
666:
634:
566:
182:Europe
103:
96:
89:
82:
74:
1121:Wafer
904:TO-92
898:TO-66
892:TO-39
886:TO-18
812:diode
721:(PDF)
704:(PDF)
687:(PDF)
630:-26.
561:thick
508:VTQFP
425:BQFPH
377:, or
344:HVQFN
175:pitch
108:JSTOR
94:books
1158:UICC
1101:eWLB
1067:PLCC
1018:MSOP
906:(TH)
894:(TH)
888:(TH)
882:(TH)
880:TO-8
876:(TH)
874:TO-5
868:TO-3
664:ISBN
632:ISBN
516:TDFN
500:VQFP
492:TQFP
484:SQFP
476:NQFP
468:MQFP
460:LQFP
452:FQFP
444:EQFP
436:CQFP
417:BQFP
387:LQFP
375:PQFP
360:TQFP
332:BQFP
290:(TP)
184:and
149:LQFP
80:news
18:TQFP
1148:PoP
1138:CSP
1134:COG
1131:COF
1128:COB
1111:PGA
1106:LGA
1096:BGA
1077:QFP
1072:QFN
1058:LCC
1043:ZIP
1003:DFN
844:SOD
766:PDF
564:280
531:-EP
369:to
161:QFP
63:by
1232::
1153:QP
658:.
646:^
628:35
610:^
354:A
155:A
143:A
795:e
788:t
781:v
768:)
764:(
737:.
723:.
706:.
689:.
672:.
640:.
385:(
358:(
341:(
330:(
159:(
151:)
130:)
124:(
119:)
115:(
105:·
98:·
91:·
84:·
57:.
34:.
20:)
Text is available under the Creative Commons Attribution-ShareAlike License. Additional terms may apply.
