3143:
Exceptions occur for imperial in the two smallest rectangular passive sizes. The metric codes still represent the dimensions in mm, even though the imperial size codes are no longer aligned. Problematically, some manufacturers are developing metric 0201 components with dimensions of 0.25 mm × 0.125 mm (0.0098 in × 0.0049 in), but the imperial 01005 name is already being used for the 0.4 mm × 0.2 mm (0.0157 in × 0.0079 in) package. These increasingly small sizes, especially 0201 and 01005, can sometimes be a challenge from a manufacturability or reliability perspective.
3098:
1498:
1092:
2486:
1710:
4402:
3106:
2058:
103:
1941:
3118:
4721:
2833:
30:
4394:
2172:
2874:
2749:
2322:
390:
is a rectangular package with contacts on all four edges. Leaded chip carriers have metal leads wrapped around the edge of the package, in the shape of a letter J. Leadless chip carriers have metal pads on the edges. Chip carrier packages may be made of ceramic or plastic and are usually secured to
811:
A small outline integrated circuit (SOIC) is a surface-mounted integrated circuit (IC) package which occupies an area about 30–50% less than an equivalent dual in-line package (DIP), with a typical thickness being 70% less. They are generally available in the same pin-outs as their counterpart DIP
1084:
According to IPC's standard J-STD-012, Implementation of Flip Chip and Chip Scale
Technology, in order to qualify as chip scale, the package must have an area no greater than 1.2 times that of the die and it must be a single-die, direct surface mountable package. Another criterion that is often
3142:
The codes given in the chart below usually tell the length and width of the components in tenths of millimeters or hundredths of inches. For example, a metric 2520 component is 2.5 mm by 2.0 mm which corresponds roughly to 0.10 inches by 0.08 inches (hence, imperial size is 1008).
4703:
Chip-on-wire (COW), a variation of COB, where a chip, typically a LED or RFID chip, is mounted directly on wire, thus making it a very thin and flexible wire. Such wire may then be covered with cotton, glass or other materials to make into smart textiles or electronic
1647:
144:
0.1 in (2.54 mm) pin spacing, rows 0.3 in (7.62 mm) or 0.6 in (15.24 mm) apart. Other row spacings are used much less frequently, like 0.4 in (10.2 mm) and 0.9 in (22.9 mm).
80:
connections in a conventional chip are thickened and extended to allow external connections to the circuit. Assemblies using "bare" chips have additional packaging or filling with epoxy to protect the devices from moisture.
4708:
There are often subtle variations in package details from manufacturer to manufacturer, and even though standard designations are used, designers need to confirm dimensions when laying out printed circuit boards.
56:
and to protect the devices from damage. A very large number of package types exist. Some package types have standardized dimensions and tolerances, and are registered with trade industry associations such as
2406:
5878:
4611:
1254:. In LEDs, transparent epoxy or a silicon caulk-like material that may contain a phosphor is poured into a mold containing the LED(s) and cured. The mold forms part of the package.
6205:
4441:
4642:(CCGA): A circuit package in which the input and output points are high-temperature solder cylinders or columns arranged in a grid pattern. The body of the component is ceramic.
2790:
2022:
5558:
7146:
2604:
5784:
5249:
4639:
5090:
Frye, R.C.; Gabara, T.J.; Tai, K.L.; Fischer, W.C.; Knauer, S.C. (1993). "Performance evaluation of MCM chip-to-chip interconnections using custom I/O buffer designs".
6419:
3113:
display using 1608/0603-type SMD LEDs. Top: A little over half of the 21×86 mm display. Center: Close-up of LEDs in ambient light. Bottom: LEDs in their own red light.
6383:
2922:
4845:
1265:
Variation of COB, where a chip is mounted directly to a flex circuit. Unlike COB, it may not use wires nor be covered with epoxy, using underfill instead.
99:(PCB) for mounting the components. The component has leads that are soldered to pads on the PCB to electrically and mechanically connect them to the PCB.
72:
Occasionally specially-processed integrated circuit dies are prepared for direct connections to a substrate without an intermediate header or carrier. In
4647:
4633:
3131:
Surface-mount components are usually smaller than their counterparts with leads, and are designed to be handled by machines rather than by humans. The
6455:
1185:
pitch) to rearrange the pins or contacts on the die so that they can be big enough and have sufficient spacing so that they can be handled just like a
5893:
6209:
6875:
6347:
7319:
5610:
5918:
5582:
5529:
5512:
1250:
Bare die supplied without a package. It is mounted directly to the PCB using bonding wires and covered with a blob of black Epoxy. Also used for
5702:
5632:
4636:(CGA): A circuit package in which the input and output points are high-temperature solder cylinders or columns arranged in a grid pattern.
4556:(LCC): contacts are recessed vertically to "wick-in" solder. Common in aviation electronics because of robustness to mechanical vibration.
7267:
7196:
7160:
6503:
6311:
7040:
7004:
6936:
6900:
6676:
6611:
6564:
6528:
6169:
6097:
6415:
5161:
4877:
1709:
959:
1431:
5565:
4605:
7495:
7489:
7483:
7471:
7459:
7453:
7441:
7345:
6133:
5969:
5398:
5135:
4445:
1627:
1615:
1603:
1597:
4990:
6979:
5770:
5399:"Packaging Technology | National Semiconductor – Package Drawings, Part Marking, Package Codes, LLP, micro SMD, Micro-Array"
7272:
7232:
5253:
76:
systems the IC is connected by solder bumps to a substrate. In beam-lead technology, the metallized pads that would be used for
5016:
4759:
4571:
4533:
1646:
5994:
5111:
2644:
963:
6408:
1293:
Variation of TAB, where a chip is mounted directly to a piece of glass - typically an LCD. Used by LCD and OLED driver ICs.
881:
7626:
7312:
6701:
6479:
6270:
4739:
3069:
1221:
5042:
4670:
chip, that is usually an integrated circuit, is supplied without a package (which is usually a lead frame overmolded with
1213:
Variation of WLCSP. Like a BGA package but with the interposer built directly atop the die and encapsulated alongside it.
7287:
6372:
4587:(BGA): A square or rectangular array of solder balls on one surface, ball spacing typically 1.27 mm (0.050 in)
893:
6766:
7553:
5734:
4852:
970:
829:
7277:
7261:
6813:
5282:
7740:
It is relatively common to find packages that contain other components than their designated ones, such as diodes or
7683:
7563:
6033:
5438:
3050:
A variety of techniques for interconnecting several chips within a single package have been proposed and researched:
2495:
1014:
7548:
4455:
4435:
2179:
950:
326:
5183:
7766:
7305:
5604:"Murata's world's Smallest Monolithic Ceramic Capacitor - 0201 <millimeter size> size (0.25 mm x 0.125 mm)"
5853:
5781:
5607:
5350:
5136:"National Semiconductor Launches New Generation of Ultra-Miniature, High Pin-Count Integrated Circuit Packages"
7357:
3820:
2838:
1208:
6444:
7709:
4461:
2370:
990:
66:
6194:
7592:
6864:
6336:
4498:
3833:; barrel shaped components, dimensions do not match those of rectangular references for identical codes.
2754:
1279:
469:
5603:
1530:
TO-XX: wide range of small pin count packages often used for discrete parts like transistors or diodes.
7771:
7597:
7558:
7543:
7528:
5933:
5424:
4451:
2449:
2063:
1514:
1002:
903:
678:
5806:
5588:
5470:
5384:
2485:
604:
17:
7273:
An illustrated listing of different package types, with links to typical dimensions/features of each
6058:
5717:
7724:
7388:
6665:
6086:
4769:
4734:
4618:): A square or rectangular array of solder balls on one surface, ball spacing typically 0.5 mm
4601:): A square or rectangular array of solder balls on one surface, ball spacing typically 0.8 mm
3967:
2327:
1524:
1178:
244:
1618:: Also called I2PAK: SMT package similar to the D2PAK but with longer leads for SMT or TH mounting
7729:
7568:
6499:
4405:
3086:
3080:
1624:: Also called D2PAK: SMT package similar to the TO-220 without the extended tab and mounting hole
208:
189:
Standard DIP with 0.1 in (2.54 mm) pin spacing, rows 0.3 in (7.62 mm) apart.
1606:: Also called IPAK: SMT package similar to the DPAK but with longer leads for SMT or TH mounting
1412:
7761:
7538:
7512:
6773:
6708:
6266:
5205:
4697:
4690:
4429:
3612:
2879:
1273:
577:
127:
53:
7207:
7171:
6492:
6300:
5545:
4476:
Very small outline package (VSOP): even smaller than QSOP; 0.4-, 0.5-, or 0.65-mm pin spacing.
65:. Other types are proprietary designations that may be made by only one or two manufacturers.
7719:
7688:
7328:
7097:
7076:
7051:
7015:
6947:
6911:
6575:
6539:
6234:
6158:
6122:
6022:
4774:
4754:
4553:
1808:
1172:
96:
49:
6600:
5326:"Understanding Flip-Chip and Chip-Scale Package Technologies and Their Applications - Maxim"
5169:
7704:
7587:
7533:
7380:
4764:
4492:
4423:
3132:
1946:
1124:
1085:
applied to qualify these packages as CSPs is their ball pitch should be no more than 1 mm.
173:
139:
90:
34:
5495:
5371:
4464:(SSOP): pin spacing of 0.65 mm, sometimes 0.635 mm or in some cases 0.8 mm.
8:
7646:
7369:
7139:
7125:
7118:
6307:
5656:
4968:
3097:
5958:
5402:
5139:
7673:
7663:
7203:
7167:
7104:
7083:
7047:
7011:
6943:
6907:
6672:
6607:
6571:
6535:
6245:
6165:
6129:
6093:
6059:"Designer's™ Data Sheet - Surface Mount Silicon Zener Diodes - Plastic SOD-123 Package"
6029:
5117:
4994:
4726:
3483:
3062:
1134:
1091:
1086:
45:
6972:
6737:
6636:
5162:"Conexant Systems, Inc. - Conexant First to Launch DVB-S2 Demodulator and FEC Decoder"
1600:: Plastic-encapsulated package with three leads and a hole for mounting on a heat sink
1585:: Plastic-encapsulated package with three leads and a hole for mounting on a heat sink
7741:
7602:
7236:
5889:
5107:
4871:
4749:
4479:
4156:(TO-263, SOT-404): Bigger than the DPAK; basically a surface mount equivalent of the
3500:
3074:
3055:
695:
555:
338:
5121:
5020:
4674:) and is attached, often with epoxy, directly to a circuit board. The chip is then
4438:(SOIC): dual-in-line, 8 or more pins, gull-wing lead form, pin spacing 1.27 mm.
1630:: Also called Super-247: SMT package similar to the TO-247 without the mounting hole
6809:
6744:
6643:
6001:
5099:
3636:
1591:: Through-hole plastic package with a (usually) metal heat sink tab and three leads
911:
5839:"TLJ Series - Tantalum Solid Electrolytic Chip Capacitors High CV Consumer Series"
5325:
7678:
7631:
7621:
5849:
4623:
4584:
3504:
1497:
1427:
1331:
1311:
1305:
1186:
314:
6712:
6259:
5530:"F Package -- 20-Lead Plastic TSSOP (4.4mm) -- (Reference LTC DWG # 05-08-1650)"
4401:
7636:
6379:
5513:"F Package -- 14-Lead Plastic TSSOP (4.4mm)-- (Reference LTC DWG # 05-08-1650)"
5046:
3135:
has standardized package shapes and sizes (the leading standardisation body is
684:
488:
69:
is the last assembly process before testing and shipping devices to customers.
4685:
Chip-on-flex (COF), a variation of COB, where a chip is mounted directly to a
391:
a printed circuit board by soldering, though sockets can be used for testing.
7755:
6777:
5103:
4663:
4659:
Although surface-mount, these devices require specific process for assembly.
4473:
Quarter-size small-outline package (QSOP): with pin spacing of 0.635 mm.
3101:
Example of component sizes, metric and imperial codes and comparison included
1797:
1245:
361:
5745:
3121:
SMD capacitors (on the left) with two through-hole capacitors (on the right)
3105:
6844:
Printed
Circuit Board Manufacturing, PCB Assembly & PCB Design - MADPCB
6802:
4686:
4675:
3126:
1310:
Ball grid array (BGA) uses the underside of the package to place pads with
387:
381:
364:
is a packaging technique that directly connects a die to a PCB, without an
77:
62:
5442:
5227:
4969:"Integrated Circuit, IC Package Types; SOIC. Surface Mount Device Package"
4150:
to house higher powered devices. Comes in three or five-terminal versions.
2057:
1278:
Variation of COF, where a flip chip is mounted directly to a flex circuit
7297:
1940:
1612:: (also called SOT428, DPAK): SMT package similar to the DPAK but smaller
102:
5300:
4823:
5817:
4744:
1792:
1200:
Variation of WLCSP, for power devices like MOSFETs. Made by
Panasonic.
1096:
369:
365:
200:
Non-standard DIP with smaller 0.07 in (1.78 mm) pin spacing.
106:
Three 14-pin (DIP14) plastic dual in-line packages containing IC chips.
3117:
7668:
7098:"SOT891 XSON6: plastic extremely thin small outline package; noleads"
6839:
5929:
5713:
4186:
Dimensions (excl. leads) (Length, typ. × width, typ. × height, max.)
3981:
Dimensions (excl. leads) (Length, typ. × width, typ. × height, max.)
3647:
3161:
73:
5995:"Surface Mount Aluminum Electrolytic Capacitors - Alchip-MVA Series"
5838:
5068:
4160:
through-hole package. Comes in 3, 5, 6, 7, 8 or 9-terminal versions.
2832:
6871:
6343:
6065:
4720:
4696:
Chip-on-glass (COG), a variation of COB, where a chip, typically a
4679:
4678:
and protected from mechanical damage and contamination by an epoxy
4147:
3826:
3157:
3110:
29:
4650:(LLP): A package with metric pin distribution (0.5 mm pitch).
4630:, but mating is by spring pins within a socket rather than solder.
4560:
1517:: Metal electrode leadless face (usually for resistors and diodes)
6373:"3-Lead Small Outline Transistor Package [SOT-89] (RK-3)"
4667:
4393:
1579:
TO-100: Metal can package with ten radial leads, similar to TO-99
1492:
4626:(LGA): An array of bare lands only. Similar to in appearance to
7477:
7465:
7447:
7435:
7363:
7351:
6840:"D3PAK: Decawatt Package 3 (TO-268, Discrete Package) | MADPCB"
4594:): A square or rectangular array of solder balls on one surface
3908:
2171:
1800:, divide mm by 0.0254 (i.e., 2.54 mm / 0.0254 = 100 mil).
1621:
1609:
1588:
1582:
1142:
Package size is no more than 1.2× the size of the silicon chip
1100:
309:
A package with metric pin distribution (0.5–0.8 mm pitch)
38:
6235:"SOD923 Microlead ultra small surface-mounted plastic package"
7429:
7423:
7417:
7411:
7337:
6451:
4671:
4615:
4598:
4515:): 1.4 mm high, varying sized and pins on all four sides
4467:
4157:
4153:
3830:
3136:
2873:
1573:
1567:
1561:
1556:
1551:
1545:
1506:
1502:
1339:
A square or rectangular array of solder balls on one surface
58:
7264:
official list of all (over 500) standard electronic packages
1237:
Chip-size package (CSP) developed by
National Semiconductor
800:
IC packaged in transparent packaging used in optical sensor
7405:
7399:
7393:
7282:
6023:"SOD 80C Hermetically sealed glass surface-mounted package"
5667:
5095:
5092:
Sixth Annual IEEE International ASIC Conference and
Exhibit
4591:
4567:): with a 0.5 mm contact pitch, no leads (same as QFN)
4540:
4526:
4519:
4512:
1539:
1533:
653:
5727:
2321:
5951:
4627:
4564:
4547:
4505:
4146:
DPAK (TO-252, SOT-428): Discrete
Packaging. Developed by
3913:
Commonly used for rectifier, Schottky, and other diodes.
1251:
1182:
582:
Earliest version metal/ceramic packaging with flat leads
4522:), a square with pins on all four sides, 44 or more pins
4412:
2748:
7292:
6409:"Standards for the Dimensions of Semiconductor Devices"
5879:"Tantalum Surface Mount Capacitors - Standard Tantalum"
3814:
3752:
Dimensions (Length, typ. × width, typ. × height, max.)
3623:
Dimensions (Length, typ. × width, typ. × height, max.)
3494:
Dimensions (Length, typ. × width, typ. × height, max.)
1713:
A general through-hole pin chip, with major dimensions.
95:
Through-hole technology uses holes drilled through the
5911:
5763:
5345:
5343:
6295:
6293:
6291:
5697:
4020:
Center pin is connected to a large heat-transfer pad
886:
Thermally-enhanced thin shrink small-outline package
7293:
5695:
5693:
5691:
5689:
5687:
5685:
5683:
5681:
5679:
5677:
5089:
4716:
3956:
1871:
Length from pin tip to pin tip on the opposite side.
1650:
A general surface mount chip, with major dimensions.
1052:
Also referred as MSOP = micro small-outline package
6301:"Package Outline Dimensions - U-DFN1616-6 (Type F)"
6051:
5744:. electronic sensor + resistor GmbH. Archived from
5496:"TSSOP-8 Package Dimensions by Diodes Incorporated"
5340:
4963:
4961:
4959:
4957:
4955:
4953:
4951:
4949:
4947:
4945:
4943:
4941:
4939:
4937:
4935:
4933:
4931:
4929:
4927:
4925:
4923:
4921:
4919:
4917:
4915:
4913:
4911:
4909:
4907:
4172:
3926:leads) (Length, typ. × width, typ. × height, max.)
1853:
Pin pitch (distance between conductors to the PCB).
7111:
6288:
5799:
5649:
4905:
4903:
4901:
4899:
4897:
4895:
4893:
4891:
4889:
4887:
4824:"CPU Collection Museum - Chip Package Information"
4167:
6485:
5674:
5633:"White Paper 0201 and 01005 Adoption in Industry"
5595:
4991:"National Semiconductor CERPACK Package Products"
4432:was one of the earliest surface-mounted packages.
4408:package 28-pin chip, upside down to show contacts
3961:
3151:
1817:Height of package from pin tip to top of package.
914:uses the trademarked name μMAX for MSOP packages
7753:
4501:(PLCC): square, J-lead, pin spacing 1.27 mm
4482:(DFN): smaller footprint than leaded equivalent.
4037:Tapered body, one larger pad denotes terminal 1
1095:Example WL-CSP devices sitting on the face of a
874:Thermally-enhanced shrink small-outline package
6857:
6329:
6187:
5771:"SMD/BLOCK Type EMI Suppression Filters EMIFIL"
4884:
4700:(LCD) controller, is mounted directly on glass.
4693:process is also a chip-on-flex process as well.
1570:: Plastic-encapsulated package with three leads
1129:Bare silicon chip, an early chip-scale package
648:No-leads, with exposed die-pad for heatsinking
7225:
7132:
6965:
5425:"How Chip-On-Boards are Made - SparkFun Learn"
5017:"National Semiconductor CQGP Package Products"
1493:Transistor, diode, small-pin-count IC packages
353:Micro surface-mount device extended technology
7313:
6694:
6365:
5959:"Application Guide - Aluminum SMT Capacitors"
5320:
5318:
4536:): a QFP package with metric pin distribution
4508:): various sizes, with pins on all four sides
6759:
6437:
3741:
3109:Composite image of a 11×44 LED matrix lapel
1070:Very-very-thin small-outline no-lead package
1060:Very-very-thin small-outline no-lead package
718:Heat-sink very-thin quad flat-pack, no-leads
178:Like DIP but with staggered (zig-zag) pins.
7189:
7153:
6795:
6252:
5871:
4818:
4816:
4814:
4812:
4810:
4550:): smaller footprint than leaded equivalent
3701:10.3 mm × 10.3 mm × 10.5 mm
1576:: Metal can package with eight radial leads
7715:List of integrated circuit packaging types
7327:
7320:
7306:
7090:
7069:
7033:
6997:
6929:
6893:
6658:
6593:
6557:
6521:
6416:Electronic Industries Association of Japan
6227:
6151:
6115:
6079:
6015:
5987:
5464:
5462:
5460:
5458:
5456:
5454:
5452:
5315:
4808:
4806:
4804:
4802:
4800:
4798:
4796:
4794:
4792:
4790:
4054:One terminal is a large heat-transfer pad
3998:2.92 mm × 1.3 mm × 1.12 mm
3942:7.95 mm × 5.9 mm × 2.25 mm
3768:2.65 mm × 1.6 mm × 1.35 mm
1361:Thermally-enhanced plastic ball-grid array
6730:
6629:
6401:
6123:"SOD323 plastic, surface-mounted package"
6087:"SOD128 plastic, surface mounted package"
5657:"SMR Series Ultra-Compact Chip Resistors"
5184:"Press Releases - Motorola Mobility, Inc"
4269:1.6 mm × 1.6 mm × 0.55 mm
4031:2.9 mm × 1.3 mm × 1.22 mm
3950:5.2 mm × 2.6 mm × 2.15 mm
3934:5.4 mm × 3.6 mm × 2.65 mm
3800:1.0 mm × 0.6 mm × 0.65 mm
3792:1.2 mm × 0.8 mm × 0.65 mm
3784:1.7 mm × 1.25 mm × 1.1 mm
3717:13.5 mm × 13.5 mm × 14 mm
1177:A WL-CSP or WLCSP package is just a bare
806:
52:to allow easy handling and assembly onto
7235:. www.SiliconFarEast.com. Archived from
5735:"Thick Film Chip Resistor - SMDC Series"
5584:Proximity Communication - the Technology
5154:
4597:Low-profile fine-pitch ball grid array (
4574:): with exposed die-pads for heatsinking
4458:with smaller pin spacing of 0.5 mm.
4400:
4392:
4285:1.6 mm × 1.2 mm × 0.6 mm
4253:1.6 mm × 1.2 mm × 0.6 mm
4237:2 mm × 1.25 mm × 0.95 mm
4220:2 mm × 1.25 mm × 0.95 mm
4203:2.9 mm × 1.3 mm × 1.3 mm
4096:1.6 mm × 1.2 mm × 0.6 mm
4081:1.6 mm × 0.8 mm × 0.9 mm
4048:6.5 mm × 3.5 mm × 1.8 mm
4014:4.5 mm × 2.5 mm × 1.5 mm
3808:0.8 mm × 0.6 mm × 0.4 mm
3776:3.8 mm × 2.5 mm × 1.1 mm
3693:8.3 mm × 8.3 mm × 6.5 mm
3685:6.6 mm × 6.6 mm × 6.1 mm
3677:6.6 mm × 6.6 mm × 5.7 mm
3669:5.3 mm × 5.3 mm × 6.1 mm
3661:5.3 mm × 5.3 mm × 5.7 mm
3653:4.3 mm × 4.3 mm × 6.1 mm
3642:4.3 mm × 4.3 mm × 5.7 mm
3631:3.3 mm × 3.3 mm × 5.5 mm
3598:7.3 mm × 4.3 mm × 4.3 mm
3590:7.3 mm × 4.3 mm × 3.1 mm
3582:7.3 mm × 4.3 mm × 2.0 mm
3574:7.2 mm × 6.0 mm × 3.8 mm
3566:6.0 mm × 3.2 mm × 2.8 mm
3558:6.0 mm × 3.2 mm × 1.5 mm
3550:3.5 mm × 2.8 mm × 2.1 mm
3542:3.5 mm × 2.8 mm × 1.2 mm
3534:3.2 mm × 1.6 mm × 1.8 mm
3526:3.2 mm × 1.6 mm × 1.2 mm
3518:3.2 mm × 1.6 mm × 1.0 mm
3510:2.0 mm × 1.3 mm × 1.2 mm
3146:
3116:
3104:
3096:
1496:
1090:
864:Thermally-enhanced small-outline package
101:
84:
28:
7372:(SOD-123 / SOD-323 / SOD-523 / SOD-923)
6480:4-Lead Small Outline Transistor Package
6260:"Professional Thin Film MELF Resistors"
5831:
5559:"Fairchild's TinyLogic family overview"
5449:
5069:"LTCC Low Temperature Co-fired Ceramic"
4787:
4654:
4365:1 mm × 0.9 mm × 0.35 mm
4301:1.45 mm × 1 mm × 0.5 mm
4163:D3PAK (TO-268): Even larger than D2PAK.
4065:2 mm × 1.25 mm × 1.1 mm
3173:Approximate dimensions, length × width
1564:: Similar shape to the TO-3 but smaller
1314:in grid pattern as connections to PCB.
1049:Very-thin shrink small-outline package
14:
7754:
7268:Fairchild Index of Package Information
6978:. Central Semiconductor. 22 May 2015.
5919:"SMT Aluminum Electrolytic Capacitors"
5601:
4876:: CS1 maint: archived copy as title (
4760:List of electronics package dimensions
4333:1 mm × 0.8 mm × 0.5 mm
4128:1 mm × 0.6 mm × 0.5 mm
3606:
3477:
3068:3D-SICs, Monolithic 3D ICs, and other
3045:
1636:
1453:Low-profile fine-pitch ball-grid array
1079:
898:Mini small-outline integrated circuit
7301:
6985:from the original on 28 December 2015
6881:from the original on 28 December 2015
6819:from the original on 28 December 2015
6702:"D-PAK (TO-252AA) Outline Dimensions"
6682:from the original on 28 December 2015
6617:from the original on 28 December 2015
6509:from the original on 28 December 2015
6461:from the original on 28 December 2015
6425:from the original on 28 December 2015
6389:from the original on 28 December 2015
6353:from the original on 28 December 2015
6317:from the original on 28 December 2015
6276:from the original on 28 December 2015
6215:from the original on 28 December 2015
6175:from the original on 28 December 2015
6139:from the original on 19 November 2012
6103:from the original on 28 December 2015
5975:from the original on 28 December 2015
5859:from the original on 28 December 2015
5787:from the original on 28 December 2015
5613:from the original on 28 December 2015
5277:
5275:
5273:
5271:
5206:"Xilinx new CPLDs with two I/O banks"
4413:Packages with more than six terminals
4381:1 mm × 1 mm × 0.35 mm
3733:19 mm × 19 mm × 17 mm
3725:17 mm × 17 mm × 17 mm
3709:13 mm × 13 mm × 14 mm
3172:
3070:three-dimensional integrated circuits
1785:
1548:: Metal can package with radial leads
1542:: Metal can package with radial leads
1411:Mold array process - ball-grid array
1103:device is shown (top) for comparison.
945:The terminal pitch is 0.635 mm.
932:Plastic small-outline no-lead package
462:Dual lead-less chip carrier (ceramic)
5807:"POLYFUSE® Resettable Fuses SMD2920"
4740:Three-dimensional integrated circuit
4349:1 mm × 1 mm × 0.5 mm
4317:1 mm × 1 mm × 0.5 mm
3815:Metal electrode leadless face (MELF)
3092:
1790:All measurements below are given in
1222:Embedded wafer level ball grid array
1197:Power mount CSP (chip-scale package)
5602:Murata, Tsuneo (5 September 2012).
5471:"Packaging - Infineon Technologies"
5230:. Chelseatech.com. 15 November 2010
4608:): Ball spacing less than 1 mm
1847:Pin length from package to pin tip.
1807:Clearance between package body and
1721:Clearance between IC body and board
24:
6738:"Mechanical Case Outline - DPAK-5"
6337:"Package Outline Drawing - P3.064"
6039:from the original on 23 April 2012
5892:. 6 September 2011. Archived from
5268:
2483:
1708:
1645:
1299:
942:Quarter-size small-outline package
787:Ultra-thin quad flat-pack, no-lead
482:
434:Contacts are recessed vertically.
25:
7783:
7255:
6837:
6711:. 5 December 2012. Archived from
6637:"Mechanical Case Outline SOT-723"
4468:Thin shrink small-outline package
4111:1.2 mm × 0.8 mm × 0.55
3957:Three- and four-terminal packages
3923:
2503:Thin shrink small-outline package
2189:Small-outline integrated circuit
1658:Clearance between IC body and PCB
1445:Ball spacing less than 1 mm
1019:Thin shrink small-outline package
777:Very-very-thin quad flat, no-lead
710:QFP with metric pin distribution
683:Also called as micro lead frame (
6865:"P6.064 Package Outline Drawing"
4719:
4436:Small-outline integrated circuit
2872:
2831:
2820:
2747:
2436:
2320:
2170:
2056:
1939:
1641:
1527:(also SOT-23, SOT-223, SOT-323).
1280:without the use of bonding wires
1181:with a redistribution layer (or
1153:Package is same size as silicon
955:Small-outline integrated circuit
549:
331:Low-temperature co-fired ceramic
238:
6831:
6473:
5625:
5606:(Press release). Kyoto, Japan:
5575:
5564:. 22 March 2013. Archived from
5551:
5539:
5522:
5505:
5488:
5431:
5417:
5391:
5377:
5365:
5293:
5242:
5220:
5198:
5176:
4612:Thin fine-pitch ball grid array
4511:Low-profile quad flat-package (
4486:
4444:(SOJ): The same as SOIC except
4442:Small-outline package, J-leaded
4417:
4168:Five- and six-terminal packages
2484:
1862:Width of the package body only.
1704:
1391:Thin fine-pitch ball-grid array
1029:Thin very-small-outline package
975:Small-outline J-leaded package
375:
296:Ceramic Quad Grid Array Package
266:Ceramic column-grid array (CGA)
7354:(DO-7 / DO-26 / DO-35 / DO-41)
7278:Intersil packaging information
6445:"Package Information - SOT-89"
6206:Comchip Technology Corporation
5782:Murata Manufacturing Co., Ltd.
5608:Murata Manufacturing Co., Ltd.
5468:
5401:. National.com. Archived from
5385:"Panasonic Industrial Devices"
5208:. Eetasia.com. 8 December 2004
5138:. National.com. Archived from
5128:
5083:
5061:
5045:. National.com. Archived from
5035:
5019:. National.com. Archived from
5009:
4993:. National.com. Archived from
4983:
4838:
4578:
4173:Small-outline transistor (SOT)
3962:Small-outline transistor (SOT)
3152:Rectangular passive components
1173:Wafer-level chip-scale package
983:Small-outline no-lead package
635:Exposed thin quad flat-package
421:Ceramic lead-less chip carrier
13:
1:
6776:. 8 July 2015. Archived from
5890:KEMET Electronics Corporation
5328:. Maxim-ic.com. 18 April 2007
4780:
4397:Various SMD chips, desoldered
3821:Metal electrode leadless face
3233:0.016 in × 0.008 in
3216:0.012 in × 0.006 in
3200:0.010 in × 0.005 in
2846:Low-profile quad flat package
2798:Ceramic leadless chip-carrier
2030:Lead-frame chip-scale package
1209:Fan-out wafer-level packaging
922:Plastic small-outline package
844:Ceramic small-outline package
668:Low-profile quad flat-package
7744:in transistor packages, etc.
7710:Integrated circuit packaging
7288:Solder Pad Layout Dimensions
7119:"SOT953 Package information"
5250:"Chip-Package SIDEBRAZE DIP"
4590:Fine-pitch ball grid array (
4543:), a thinner version of LQFP
4462:Shrink small-outline package
3760:3.5 mm × ⌀ 1.5 mm
3595:EIA 7343-43 (KEMET X, AVX E)
3587:EIA 7343-31 (KEMET D, AVX D)
3579:EIA 7343-20 (KEMET V, AVX Y)
3571:EIA 7260-38 (KEMET E, AVX V)
3563:EIA 6032-28 (KEMET C, AVX C)
3555:EIA 6032-15 (KEMET U, AVX W)
3547:EIA 3528-21 (KEMET B, AVX B)
3539:EIA 3528-12 (KEMET T, AVX T)
3531:EIA 3216-18 (KEMET A, AVX A)
3523:EIA 3216-12 (KEMET S, AVX S)
3515:EIA 3216-10 (KEMET I, AVX K)
3469:0.29 in × 0.20 in
3435:0.25 in × 0.125 in
3384:0.18 in × 0.125 in
3368:0.18 in × 0.06 in
3351:0.125 in × 0.10 in
3334:0.125 in × 0.06 in
3197:0.25 mm × 0.125 mm
2683:
2378:Shrink small-outline package
1829:Length of package body only.
1423:Micro (μ) chip-scale package
995:Shrink small-outline package
767:Very-thin quad flat, no-lead
306:Lead-less lead-frame package
67:Integrated circuit packaging
7:
7147:Central Semiconductor Corp.
6803:"Phase-leg Rectifier Diode"
5703:"Thick Film Chip Resistors"
5469:AG, Infineon Technologies.
4712:
4499:Plastic leaded chip carrier
3890:5.8 mm × ⌀ 2.2 mm
3876:3.6 mm × ⌀ 1.4 mm
3862:2.2 mm × ⌀ 1.1 mm
3452:0.27 in × 0.25 in
3418:0.20 in × 0.10 in
3401:0.18 in × 0.25 in
3318:0.10 in × 0.08 in
3301:0.08 in × 0.05 in
3284:0.06 in × 0.03 in
3267:0.04 in × 0.02 in
3250:0.02 in × 0.01 in
2762:Plastic leaded chip-carrier
2612:Micro small-outline package
2071:Mini small-outline package
1875:
1347:Low-profile ball-grid array
1073:Slightly smaller than WSON
1039:Very-small-outline package
854:Dual small-outline package
474:Plastic leaded chip carrier
452:Leaded ceramic-chip carrier
10:
7788:
6767:"D2PAK Outline Dimensions"
5351:"Chip Scale Review Online"
5301:"CSP - Chip Scale Package"
4490:
4452:Thin small-outline package
4421:
3965:
3906:
3818:
3690:Panasonic E/F, Chemi-Con H
3610:
3481:
3298:2.0 mm × 1.25 mm
3213:0.3 mm × 0.15 mm
3124:
2457:Thin small-outline package
1484:Ultra-fine ball-grid array
1336:Fine-pitch ball-grid array
1303:
1282:. Used by LCD driver ICs.
1007:Thin small-outline package
908:Mini small-outline package
797:Optical dual flat, no-lead
679:Quad flat no-leads package
553:
486:
379:
242:
88:
7738:
7697:
7645:
7614:
7577:
7521:
7505:
7379:
7335:
7197:"SOT1202 Package outline"
7161:"SOT1115 Package outline"
4640:Ceramic column grid array
4570:Power quad flat no-lead (
4559:Micro leadframe package (
3902:
3845:
3841:
3838:
3742:Small-outline diode (SOD)
3466:7.4 mm × 5.1 mm
3449:6.9 mm × 6.3 mm
3432:6.3 mm × 3.2 mm
3415:5.0 mm × 2.5 mm
3398:4.5 mm × 6.4 mm
3381:4.5 mm × 3.2 mm
3365:4.5 mm × 1.6 mm
3348:3.2 mm × 2.5 mm
3331:3.2 mm × 1.6 mm
3315:2.5 mm × 2.0 mm
3281:1.6 mm × 0.8 mm
3264:1.0 mm × 0.5 mm
3247:0.6 mm × 0.3 mm
3230:0.4 mm × 0.2 mm
3175:
3169:
2536:
2502:
2494:
2482:
2188:
2185:
2176:
2169:
2070:
2067:
2062:
2055:
1953:
1950:
1945:
1938:
1520:SOD: Small-outline diode.
658:Plastic quad flat-package
7725:Surface-mount technology
7140:"SOT963 Package details"
7077:"SOT886 Package outline"
7041:"SOT666 Package outline"
7005:"SOT665 Package outline"
6973:"SOT563 Package Details"
6937:"SOT363 Package outline"
6901:"SOT353 Package outline"
6666:"SOT883 Package outline"
6601:"SOT663 Package outline"
6565:"SOT416 Package outline"
6529:"SOT323 Package outline"
6493:"SOT-233 Molded Package"
6159:"SOD523 Package outline"
5104:10.1109/ASIC.1993.410760
5043:"National's LLP Package"
4770:Small-outline transistor
4735:Surface-mount technology
4525:Ceramic quad flat-pack (
4518:Plastic quad flat-pack (
4140:
3968:Small-outline transistor
3846:Typical resistor rating
3730:Panasonic K, Chemi-Con M
3722:Panasonic J, Chemi-Con L
3698:Panasonic G, Chemi-Con J
2335:Small-outline transistor
1536:: Panel-mount with leads
1525:Small-outline transistor
1352:laminate ball-grid array
747:Very-thin quad flat-pack
520:Flip-chip pin-grid array
245:Surface-mount technology
163:Glass-sealed ceramic DIP
48:are put into protective
7730:Through-hole technology
6500:Fairchild Semiconductor
5283:"Packaging Terminology"
4604:Micro ball grid array (
4532:Metric quad flat-pack (
3087:Proximity communication
3081:wafer-scale integration
1401:Plastic ball-grid array
1381:Organic ball-grid array
1371:Ceramic ball-grid array
1169:WCSP or WL-CSP or WLCSP
757:Thin quad flat, no-lead
614:Bumpered quad flat-pack
209:Zig-zag in-line package
33:A standard-sized 8-pin
7767:Semiconductor packages
7360:(MELF / SOD-80 / LL34)
7329:Semiconductor packages
7206:. 2010. Archived from
7170:. 2010. Archived from
7050:. 2008. Archived from
7014:. 2008. Archived from
6946:. 2008. Archived from
6910:. 2008. Archived from
6774:Vishay Intertechnology
6709:Vishay Intertechnology
6574:. 2010. Archived from
6538:. 2008. Archived from
6267:Vishay Intertechnology
5587:, 2004, archived from
4698:liquid crystal display
4691:Tape-automated bonding
4409:
4398:
3613:Electrolytic capacitor
3122:
3114:
3102:
2956:
2930:Thin quad flat no-lead
2887:Thin quad flat-package
2491:
2414:Thin dual flat no-lead
1714:
1651:
1510:
1274:Tape-automated bonding
1150:True chip-size package
1104:
807:Small outline packages
600:Ceramic quad flat-pack
541:Ceramic pin-grid array
510:Organic pin-grid array
431:Lead-less chip carrier
128:Single in-line package
107:
54:printed circuit boards
42:
7720:Printed circuit board
6382:. 12 September 2013.
5353:. Chipscalereview.com
4775:Wafer-level packaging
4755:List of chip carriers
4554:Leadless chip carrier
4539:Thin quad flat-pack (
4454:(TSOP): thinner than
4404:
4396:
3859:MicroMELF (MMU), 0102
3147:Two-terminal packages
3120:
3108:
3100:
2489:
1712:
1649:
1500:
1473:Super ball-grid array
1442:Micro ball-grid array
1161:True die-size package
1094:
834:Small-outline package
707:Metric quad flat-pack
105:
97:printed circuit board
85:Through-hole packages
32:
7705:Electronic packaging
6502:. 26 February 2008.
5968:. Cornell Dubilier.
5303:. Siliconfareast.com
5098:. pp. 464–467.
4765:Redistribution layer
4655:Non-packaged devices
4493:Quad in-line package
4424:Dual in-line package
4189:Number of terminals
3984:Number of terminals
3873:MiniMELF (MMA), 0204
3133:electronics industry
1954:Dual inline package
1739:Total carrier length
1676:Total carrier length
1463:Thin ball-grid array
1226:Variation of WLCSP.
1125:Beam lead technology
645:Power quad flat-pack
174:Quad in-line package
140:Dual in-line package
91:dual in-line package
35:dual in-line package
7213:on 28 December 2015
7177:on 28 December 2015
7126:Diodes Incorporated
7057:on 28 December 2015
7021:on 28 December 2015
6953:on 28 December 2015
6917:on 28 December 2015
6783:on 28 December 2015
6718:on 28 December 2015
6581:on 28 December 2015
6545:on 28 December 2015
6308:Diodes Incorporated
6195:"Comchip CDSP400-G"
5899:on 26 December 2011
5751:on 28 December 2015
5723:on 9 February 2014.
5548:maximintegrated.com
5256:on 20 November 2008
5142:on 18 February 2012
5049:on 13 February 2011
4997:on 18 February 2012
4664:Chip-on-board (COB)
4546:Quad flat no-lead (
4504:Quad flat package (
4192:Leaded or leadless
3607:Aluminum capacitors
3478:Tantalum capacitors
3046:Multi-chip packages
1796:. To convert mm to
1637:Dimension reference
1430:(A Maxim trademark
1080:Chip-scale packages
737:Thin quad flat-pack
533:Also known as PPGA
442:Leaded chip carrier
46:Integrated circuits
37:(DIP) containing a
7742:voltage regulators
7233:"IC Package Types"
7204:NXP Semiconductors
7168:NXP Semiconductors
7105:NXP Semiconductors
7084:NXP Semiconductors
7048:NXP Semiconductors
7012:NXP Semiconductors
6944:NXP Semiconductors
6908:NXP Semiconductors
6673:NXP Semiconductors
6608:NXP Semiconductors
6572:NXP Semiconductors
6536:NXP Semiconductors
6246:NXP Semiconductors
6166:NXP Semiconductors
6130:NXP Semiconductors
6094:NXP Semiconductors
6030:NXP Semiconductors
5668:Rohm Semiconductor
5571:on 8 January 2015.
5445:on 23 August 2010.
5172:on 18 August 2011.
5023:on 21 October 2007
4971:. Interfacebus.com
4727:Electronics portal
4529:): similar to PQFP
4410:
4399:
3628:Cornell-Dubilier A
3484:Tantalum capacitor
3123:
3115:
3103:
3063:package on package
2492:
1786:Package dimensions
1781:Lead-to-lead width
1715:
1652:
1511:
1139:Chip-scale package
1105:
1087:Chip-scale package
108:
43:
7772:Electronics lists
7749:
7748:
7498:(Super-247) (SMT)
7492:(Super-220) (SMT)
7366:(SMA / SMB / SMC)
6418:. 15 April 1996.
6269:. 22 April 2014.
5287:Texas Instruments
5113:978-0-7803-1375-0
4858:on 15 August 2011
4750:IPC (electronics)
4648:Lead-less package
4634:Column grid array
4480:Dual flat no-lead
4391:
4390:
4138:
4137:
3954:
3953:
3900:
3899:
3812:
3811:
3737:
3736:
3602:
3601:
3475:
3474:
3178:power rating (W)
3176:Typical resistor
3093:By terminal count
3075:Multi-chip module
3056:system in package
3043:
3042:
2954:
2953:
2681:
2680:
1823:Thickness of pin.
1490:
1489:
1297:
1296:
1077:
1076:
804:
803:
696:Quad flat package
590:Ceramic flat-pack
556:Quad flat package
547:
546:
480:
479:
411:Bump chip carrier
359:
358:
343:Multi-chip module
276:Column-grid array
236:
235:
16:(Redirected from
7779:
7322:
7315:
7308:
7299:
7298:
7249:
7248:
7246:
7244:
7229:
7223:
7222:
7220:
7218:
7212:
7201:
7193:
7187:
7186:
7184:
7182:
7176:
7165:
7157:
7151:
7150:
7144:
7136:
7130:
7129:
7123:
7115:
7109:
7108:
7102:
7094:
7088:
7087:
7081:
7073:
7067:
7066:
7064:
7062:
7056:
7045:
7037:
7031:
7030:
7028:
7026:
7020:
7009:
7001:
6995:
6994:
6992:
6990:
6984:
6977:
6969:
6963:
6962:
6960:
6958:
6952:
6941:
6933:
6927:
6926:
6924:
6922:
6916:
6905:
6897:
6891:
6890:
6888:
6886:
6880:
6869:
6861:
6855:
6854:
6852:
6850:
6835:
6829:
6828:
6826:
6824:
6818:
6810:IXYS Corporation
6807:
6799:
6793:
6792:
6790:
6788:
6782:
6771:
6763:
6757:
6756:
6754:
6752:
6745:ON Semiconductor
6742:
6734:
6728:
6727:
6725:
6723:
6717:
6706:
6698:
6692:
6691:
6689:
6687:
6681:
6670:
6662:
6656:
6655:
6653:
6651:
6646:. 10 August 2009
6644:ON Semiconductor
6641:
6633:
6627:
6626:
6624:
6622:
6616:
6605:
6597:
6591:
6590:
6588:
6586:
6580:
6569:
6561:
6555:
6554:
6552:
6550:
6544:
6533:
6525:
6519:
6518:
6516:
6514:
6508:
6497:
6489:
6483:
6477:
6471:
6470:
6468:
6466:
6460:
6449:
6441:
6435:
6434:
6432:
6430:
6424:
6413:
6405:
6399:
6398:
6396:
6394:
6388:
6377:
6369:
6363:
6362:
6360:
6358:
6352:
6341:
6333:
6327:
6326:
6324:
6322:
6316:
6305:
6297:
6286:
6285:
6283:
6281:
6275:
6264:
6256:
6250:
6249:
6239:
6231:
6225:
6224:
6222:
6220:
6214:
6199:
6191:
6185:
6184:
6182:
6180:
6174:
6163:
6155:
6149:
6148:
6146:
6144:
6138:
6127:
6119:
6113:
6112:
6110:
6108:
6102:
6091:
6083:
6077:
6076:
6074:
6072:
6063:
6055:
6049:
6048:
6046:
6044:
6038:
6027:
6019:
6013:
6012:
6010:
6008:
6002:Nippon Chemi-Con
5999:
5991:
5985:
5984:
5982:
5980:
5974:
5963:
5955:
5949:
5948:
5946:
5944:
5938:
5932:. Archived from
5923:
5915:
5909:
5908:
5906:
5904:
5898:
5883:
5875:
5869:
5868:
5866:
5864:
5858:
5843:
5835:
5829:
5828:
5826:
5824:
5811:
5803:
5797:
5796:
5794:
5792:
5775:
5767:
5761:
5760:
5758:
5756:
5750:
5739:
5731:
5725:
5724:
5722:
5716:. Archived from
5707:
5699:
5672:
5671:
5661:
5653:
5647:
5646:
5644:
5642:
5637:
5629:
5623:
5622:
5620:
5618:
5599:
5593:
5592:
5579:
5573:
5572:
5570:
5563:
5555:
5549:
5543:
5537:
5536:
5534:
5526:
5520:
5519:
5517:
5509:
5503:
5502:
5500:
5492:
5486:
5485:
5483:
5481:
5475:www.infineon.com
5466:
5447:
5446:
5441:. Archived from
5439:"TO-226 Package"
5435:
5429:
5428:
5421:
5415:
5414:
5412:
5410:
5405:on 1 August 2010
5395:
5389:
5388:
5381:
5375:
5372:Application note
5369:
5363:
5362:
5360:
5358:
5347:
5338:
5337:
5335:
5333:
5322:
5313:
5312:
5310:
5308:
5297:
5291:
5290:
5279:
5266:
5265:
5263:
5261:
5252:. Archived from
5246:
5240:
5239:
5237:
5235:
5224:
5218:
5217:
5215:
5213:
5202:
5196:
5195:
5193:
5191:
5180:
5174:
5173:
5168:. Archived from
5158:
5152:
5151:
5149:
5147:
5132:
5126:
5125:
5087:
5081:
5080:
5078:
5076:
5065:
5059:
5058:
5056:
5054:
5039:
5033:
5032:
5030:
5028:
5013:
5007:
5006:
5004:
5002:
4987:
4981:
4980:
4978:
4976:
4965:
4882:
4881:
4875:
4867:
4865:
4863:
4857:
4851:. Archived from
4850:
4842:
4836:
4835:
4833:
4831:
4820:
4729:
4724:
4723:
4177:
4176:
3972:
3971:
3925:
3916:
3915:
3887:MELF (MMB), 0207
3836:
3835:
3746:
3745:
3617:
3616:
3488:
3487:
3167:
3166:
3024:
3017:
3010:
2998:
2991:
2984:
2961:
2960:
2876:
2835:
2751:
2688:
2687:
2488:
2324:
2174:
2060:
2008:
1977:
1943:
1880:
1879:
1476:Above 500 balls
1317:
1316:
1107:
1106:
815:
814:
560:
559:
493:
492:
394:
393:
249:
248:
110:
109:
21:
7787:
7786:
7782:
7781:
7780:
7778:
7777:
7776:
7752:
7751:
7750:
7745:
7734:
7693:
7641:
7610:
7573:
7517:
7501:
7375:
7331:
7326:
7258:
7253:
7252:
7242:
7240:
7239:on 26 July 2013
7231:
7230:
7226:
7216:
7214:
7210:
7199:
7195:
7194:
7190:
7180:
7178:
7174:
7163:
7159:
7158:
7154:
7142:
7138:
7137:
7133:
7121:
7117:
7116:
7112:
7100:
7096:
7095:
7091:
7079:
7075:
7074:
7070:
7060:
7058:
7054:
7043:
7039:
7038:
7034:
7024:
7022:
7018:
7007:
7003:
7002:
6998:
6988:
6986:
6982:
6975:
6971:
6970:
6966:
6956:
6954:
6950:
6939:
6935:
6934:
6930:
6920:
6918:
6914:
6903:
6899:
6898:
6894:
6884:
6882:
6878:
6867:
6863:
6862:
6858:
6848:
6846:
6836:
6832:
6822:
6820:
6816:
6805:
6801:
6800:
6796:
6786:
6784:
6780:
6769:
6765:
6764:
6760:
6750:
6748:
6740:
6736:
6735:
6731:
6721:
6719:
6715:
6704:
6700:
6699:
6695:
6685:
6683:
6679:
6668:
6664:
6663:
6659:
6649:
6647:
6639:
6635:
6634:
6630:
6620:
6618:
6614:
6603:
6599:
6598:
6594:
6584:
6582:
6578:
6567:
6563:
6562:
6558:
6548:
6546:
6542:
6531:
6527:
6526:
6522:
6512:
6510:
6506:
6495:
6491:
6490:
6486:
6478:
6474:
6464:
6462:
6458:
6447:
6443:
6442:
6438:
6428:
6426:
6422:
6411:
6407:
6406:
6402:
6392:
6390:
6386:
6375:
6371:
6370:
6366:
6356:
6354:
6350:
6339:
6335:
6334:
6330:
6320:
6318:
6314:
6303:
6299:
6298:
6289:
6279:
6277:
6273:
6262:
6258:
6257:
6253:
6237:
6233:
6232:
6228:
6218:
6216:
6212:
6197:
6193:
6192:
6188:
6178:
6176:
6172:
6161:
6157:
6156:
6152:
6142:
6140:
6136:
6125:
6121:
6120:
6116:
6106:
6104:
6100:
6089:
6085:
6084:
6080:
6070:
6068:
6061:
6057:
6056:
6052:
6042:
6040:
6036:
6025:
6021:
6020:
6016:
6006:
6004:
5997:
5993:
5992:
5988:
5978:
5976:
5972:
5961:
5957:
5956:
5952:
5942:
5940:
5939:on 1 March 2012
5936:
5921:
5917:
5916:
5912:
5902:
5900:
5896:
5881:
5877:
5876:
5872:
5862:
5860:
5856:
5850:AVX Corporation
5841:
5837:
5836:
5832:
5822:
5820:
5809:
5805:
5804:
5800:
5790:
5788:
5773:
5769:
5768:
5764:
5754:
5752:
5748:
5737:
5733:
5732:
5728:
5720:
5705:
5701:
5700:
5675:
5659:
5655:
5654:
5650:
5640:
5638:
5635:
5631:
5630:
5626:
5616:
5614:
5600:
5596:
5591:on 18 July 2009
5581:
5580:
5576:
5568:
5561:
5557:
5556:
5552:
5546:Package outline
5544:
5540:
5532:
5528:
5527:
5523:
5515:
5511:
5510:
5506:
5498:
5494:
5493:
5489:
5479:
5477:
5467:
5450:
5437:
5436:
5432:
5423:
5422:
5418:
5408:
5406:
5397:
5396:
5392:
5383:
5382:
5378:
5370:
5366:
5356:
5354:
5349:
5348:
5341:
5331:
5329:
5324:
5323:
5316:
5306:
5304:
5299:
5298:
5294:
5281:
5280:
5269:
5259:
5257:
5248:
5247:
5243:
5233:
5231:
5226:
5225:
5221:
5211:
5209:
5204:
5203:
5199:
5189:
5187:
5182:
5181:
5177:
5166:ir.conexant.com
5160:
5159:
5155:
5145:
5143:
5134:
5133:
5129:
5114:
5088:
5084:
5074:
5072:
5067:
5066:
5062:
5052:
5050:
5041:
5040:
5036:
5026:
5024:
5015:
5014:
5010:
5000:
4998:
4989:
4988:
4984:
4974:
4972:
4967:
4966:
4885:
4869:
4868:
4861:
4859:
4855:
4848:
4846:"Archived copy"
4844:
4843:
4839:
4829:
4827:
4826:. The CPU Shack
4822:
4821:
4788:
4783:
4725:
4718:
4715:
4657:
4624:Land grid array
4585:Ball grid array
4581:
4495:
4489:
4426:
4420:
4415:
4175:
4170:
4143:
4117:Has flat leads
3995:TO-236-3, SC-59
3970:
3964:
3959:
3911:
3905:
3843:
3823:
3817:
3789:SOD-523 (SC-79)
3781:SOD-323 (SC-76)
3744:
3615:
3609:
3486:
3480:
3177:
3154:
3149:
3129:
3095:
3048:
3022:
3015:
3008:
2996:
2989:
2982:
2959:
2742:
2733:
2715:
2709:
2686:
2182:
2178:
2006:
1975:
1934:
1925:
1910:
1904:
1878:
1868:
1859:
1844:
1835:
1788:
1778:
1769:
1754:
1745:
1707:
1691:
1682:
1644:
1639:
1501:A drawing of a
1495:
1312:balls of solder
1308:
1306:Ball grid array
1302:
1300:Ball grid array
1082:
809:
558:
552:
491:
485:
483:Pin grid arrays
384:
378:
319:Land grid array
286:Ceramic package
247:
241:
93:
87:
23:
22:
15:
12:
11:
5:
7785:
7775:
7774:
7769:
7764:
7747:
7746:
7739:
7736:
7735:
7733:
7732:
7727:
7722:
7717:
7712:
7707:
7701:
7699:
7698:Related topics
7695:
7694:
7692:
7691:
7686:
7681:
7676:
7671:
7666:
7661:
7658:
7655:
7651:
7649:
7643:
7642:
7640:
7639:
7634:
7629:
7624:
7618:
7616:
7612:
7611:
7609:
7608:
7605:
7600:
7595:
7590:
7585:
7581:
7579:
7575:
7574:
7572:
7571:
7566:
7564:TSSOP / HTSSOP
7561:
7556:
7551:
7546:
7541:
7536:
7531:
7525:
7523:
7519:
7518:
7516:
7515:
7509:
7507:
7503:
7502:
7500:
7499:
7493:
7487:
7481:
7475:
7469:
7463:
7457:
7451:
7445:
7439:
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7427:
7421:
7415:
7409:
7403:
7397:
7391:
7385:
7383:
7377:
7376:
7374:
7373:
7367:
7361:
7355:
7349:
7342:
7340:
7333:
7332:
7325:
7324:
7317:
7310:
7302:
7296:
7295:
7290:
7285:
7280:
7275:
7270:
7265:
7257:
7256:External links
7254:
7251:
7250:
7224:
7188:
7152:
7131:
7110:
7089:
7068:
7032:
6996:
6964:
6928:
6892:
6856:
6830:
6794:
6758:
6729:
6693:
6657:
6628:
6592:
6556:
6520:
6484:
6472:
6436:
6400:
6380:Analog Devices
6364:
6328:
6287:
6251:
6226:
6186:
6150:
6114:
6078:
6050:
6014:
5986:
5950:
5910:
5870:
5830:
5798:
5762:
5726:
5673:
5648:
5624:
5594:
5574:
5550:
5538:
5521:
5504:
5487:
5448:
5430:
5416:
5390:
5376:
5364:
5339:
5314:
5292:
5267:
5241:
5219:
5197:
5186:. Motorola.com
5175:
5153:
5127:
5112:
5082:
5071:. Minicaps.com
5060:
5034:
5008:
4982:
4883:
4837:
4785:
4784:
4782:
4779:
4778:
4777:
4772:
4767:
4762:
4757:
4752:
4747:
4742:
4737:
4731:
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4714:
4711:
4706:
4705:
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4694:
4683:
4656:
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4631:
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4619:
4609:
4602:
4595:
4580:
4577:
4576:
4575:
4568:
4557:
4551:
4544:
4537:
4530:
4523:
4516:
4509:
4502:
4491:Main article:
4488:
4485:
4484:
4483:
4477:
4474:
4471:
4465:
4459:
4449:
4439:
4433:
4422:Main article:
4419:
4416:
4414:
4411:
4389:
4388:
4385:
4382:
4379:
4377:
4373:
4372:
4369:
4366:
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4299:
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4289:
4286:
4283:
4281:
4277:
4276:
4273:
4270:
4267:
4265:
4261:
4260:
4257:
4254:
4251:
4249:
4245:
4244:
4241:
4238:
4235:
4234:SC-88, SC-70-6
4232:
4228:
4227:
4224:
4221:
4218:
4215:
4211:
4210:
4207:
4204:
4201:
4198:
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4190:
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4174:
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4165:
4164:
4161:
4151:
4142:
4139:
4136:
4135:
4132:
4129:
4126:
4123:
4119:
4118:
4115:
4112:
4109:
4107:
4103:
4102:
4100:
4097:
4094:
4092:
4088:
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4085:
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4079:
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4060:
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4039:
4038:
4035:
4032:
4029:
4026:
4022:
4021:
4018:
4015:
4012:
4009:
4005:
4004:
4002:
3999:
3996:
3993:
3989:
3988:
3985:
3982:
3979:
3976:
3966:Main article:
3963:
3960:
3958:
3955:
3952:
3951:
3948:
3947:DO-214AC (SMA)
3944:
3943:
3940:
3939:DO-214AB (SMC)
3936:
3935:
3932:
3931:DO-214AA (SMB)
3928:
3927:
3920:
3907:Main article:
3904:
3901:
3898:
3897:
3894:
3891:
3888:
3884:
3883:
3880:
3877:
3874:
3870:
3869:
3866:
3863:
3860:
3856:
3855:
3852:
3848:
3847:
3844:
3840:
3819:Main article:
3816:
3813:
3810:
3809:
3806:
3802:
3801:
3798:
3794:
3793:
3790:
3786:
3785:
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3655:
3654:
3651:
3644:
3643:
3640:
3633:
3632:
3629:
3625:
3624:
3621:
3611:Main article:
3608:
3605:
3600:
3599:
3596:
3592:
3591:
3588:
3584:
3583:
3580:
3576:
3575:
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3528:
3527:
3524:
3520:
3519:
3516:
3512:
3511:
3508:
3496:
3495:
3492:
3482:Main article:
3479:
3476:
3473:
3472:
3470:
3467:
3464:
3461:
3457:
3456:
3453:
3450:
3447:
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3405:
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3329:
3326:
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3321:
3319:
3316:
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3310:
3306:
3305:
3302:
3299:
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3293:
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3288:
3285:
3282:
3279:
3276:
3272:
3271:
3268:
3265:
3262:
3259:
3255:
3254:
3251:
3248:
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3242:
3238:
3237:
3234:
3231:
3228:
3225:
3221:
3220:
3217:
3214:
3211:
3208:
3204:
3203:
3201:
3198:
3195:
3192:
3188:
3187:
3184:
3180:
3179:
3174:
3171:
3153:
3150:
3148:
3145:
3125:Main article:
3094:
3091:
3090:
3089:
3084:
3077:
3072:
3066:
3059:
3047:
3044:
3041:
3040:
3037:
3034:
3031:
3027:
3026:
3019:
3012:
3005:
3001:
3000:
2993:
2986:
2979:
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2851:
2849:
2847:
2844:
2841:
2836:
2828:
2827:
2824:
2822:
2819:
2816:
2813:
2811:
2808:
2805:
2802:
2799:
2796:
2793:
2788:
2785:
2784:
2782:
2780:
2778:
2775:
2773:
2771:
2769:
2767:
2765:
2763:
2760:
2757:
2752:
2744:
2743:
2740:
2737:
2734:
2731:
2728:
2725:
2722:
2719:
2716:
2713:
2710:
2707:
2704:
2701:
2698:
2695:
2692:
2685:
2682:
2679:
2678:
2676:
2674:
2672:
2669:
2667:
2664:
2661:
2658:
2655:
2653:
2650:
2647:
2642:
2639:
2638:
2636:
2634:
2632:
2629:
2627:
2624:
2621:
2619:
2616:
2613:
2610:
2607:
2602:
2599:
2598:
2595:
2592:
2590:
2587:
2584:
2581:
2578:
2575:
2572:
2568:
2567:
2564:
2561:
2559:
2556:
2553:
2550:
2547:
2544:
2541:
2538:
2534:
2533:
2530:
2527:
2525:
2522:
2519:
2516:
2513:
2510:
2507:
2504:
2501:
2498:
2493:
2480:
2479:
2477:
2475:
2473:
2470:
2468:
2466:
2464:
2462:
2460:
2458:
2455:
2452:
2447:
2444:
2443:
2440:
2438:
2435:
2432:
2430:
2427:
2424:
2421:
2418:
2415:
2412:
2409:
2404:
2401:
2400:
2398:
2396:
2394:
2391:
2389:
2387:
2385:
2383:
2381:
2379:
2376:
2373:
2368:
2365:
2364:
2361:
2359:
2356:
2353:
2351:
2348:
2345:
2342:
2339:
2336:
2333:
2330:
2325:
2317:
2316:
2313:
2310:
2307:
2304:
2301:
2298:
2295:
2292:
2289:
2285:
2284:
2281:
2278:
2275:
2272:
2269:
2266:
2263:
2260:
2257:
2253:
2252:
2249:
2246:
2243:
2240:
2237:
2234:
2231:
2228:
2225:
2221:
2220:
2217:
2214:
2211:
2208:
2205:
2202:
2199:
2196:
2193:
2190:
2187:
2184:
2175:
2167:
2166:
2163:
2160:
2157:
2154:
2151:
2148:
2145:
2142:
2139:
2135:
2134:
2131:
2128:
2125:
2122:
2119:
2116:
2113:
2110:
2107:
2103:
2102:
2099:
2096:
2093:
2090:
2087:
2084:
2081:
2078:
2075:
2072:
2069:
2066:
2061:
2053:
2052:
2050:
2048:
2046:
2043:
2041:
2039:
2037:
2035:
2033:
2031:
2028:
2025:
2020:
2017:
2016:
2014:
2012:
2010:
2003:
2001:
1999:
1996:
1994:
1992:
1988:
1987:
1984:
1982:
1979:
1972:
1970:
1967:
1964:
1961:
1958:
1955:
1952:
1949:
1944:
1936:
1935:
1932:
1929:
1926:
1923:
1920:
1917:
1914:
1911:
1908:
1905:
1902:
1899:
1896:
1893:
1890:
1887:
1884:
1877:
1874:
1873:
1872:
1869:
1866:
1863:
1860:
1857:
1854:
1851:
1848:
1845:
1842:
1839:
1836:
1833:
1830:
1827:
1824:
1821:
1818:
1815:
1812:
1805:
1787:
1784:
1783:
1782:
1779:
1776:
1773:
1770:
1767:
1764:
1761:
1758:
1755:
1752:
1749:
1746:
1743:
1740:
1737:
1734:
1733:Lead thickness
1731:
1728:
1725:
1722:
1719:
1706:
1703:
1702:
1701:
1698:
1695:
1692:
1689:
1686:
1683:
1680:
1677:
1674:
1671:
1670:Lead thickness
1668:
1665:
1662:
1659:
1656:
1643:
1640:
1638:
1635:
1634:
1633:
1632:
1631:
1625:
1619:
1613:
1607:
1601:
1595:
1592:
1586:
1580:
1577:
1571:
1565:
1559:
1554:
1549:
1543:
1537:
1528:
1521:
1518:
1494:
1491:
1488:
1487:
1485:
1482:
1478:
1477:
1474:
1471:
1467:
1466:
1464:
1461:
1457:
1456:
1454:
1451:
1447:
1446:
1443:
1440:
1436:
1435:
1424:
1421:
1417:
1416:
1414:
1409:
1405:
1404:
1402:
1399:
1395:
1394:
1392:
1389:
1385:
1384:
1382:
1379:
1375:
1374:
1372:
1369:
1365:
1364:
1362:
1359:
1355:
1354:
1350:Also known as
1348:
1345:
1341:
1340:
1337:
1334:
1328:
1327:
1324:
1321:
1304:Main article:
1301:
1298:
1295:
1294:
1291:
1288:
1284:
1283:
1276:
1271:
1267:
1266:
1263:
1260:
1256:
1255:
1248:
1243:
1239:
1238:
1235:
1232:
1228:
1227:
1224:
1219:
1215:
1214:
1211:
1206:
1202:
1201:
1198:
1195:
1191:
1190:
1175:
1170:
1166:
1165:
1162:
1159:
1155:
1154:
1151:
1148:
1144:
1143:
1140:
1137:
1131:
1130:
1127:
1122:
1118:
1117:
1114:
1111:
1081:
1078:
1075:
1074:
1071:
1068:
1064:
1063:
1061:
1058:
1054:
1053:
1050:
1047:
1043:
1042:
1040:
1037:
1033:
1032:
1030:
1027:
1023:
1022:
1020:
1017:
1011:
1010:
1008:
1005:
999:
998:
996:
993:
987:
986:
984:
981:
977:
976:
973:
967:
966:
958:Also known as
956:
953:
947:
946:
943:
940:
936:
935:
933:
930:
926:
925:
923:
920:
916:
915:
909:
906:
900:
899:
896:
890:
889:
887:
884:
878:
877:
875:
872:
868:
867:
865:
862:
858:
857:
855:
852:
848:
847:
845:
842:
838:
837:
835:
832:
826:
825:
822:
819:
808:
805:
802:
801:
798:
795:
791:
790:
788:
785:
781:
780:
778:
775:
771:
770:
768:
765:
761:
760:
758:
755:
751:
750:
748:
745:
741:
740:
738:
735:
731:
730:
728:
726:
722:
721:
719:
716:
712:
711:
708:
705:
701:
700:
698:
693:
689:
688:
681:
676:
672:
671:
669:
666:
662:
661:
659:
656:
650:
649:
646:
643:
639:
638:
636:
633:
629:
628:
625:
624:Dual flat-pack
622:
618:
617:
615:
612:
608:
607:
601:
598:
594:
593:
591:
588:
584:
583:
580:
575:
571:
570:
567:
564:
554:Main article:
551:
548:
545:
544:
542:
539:
535:
534:
531:
530:Pin-grid array
528:
524:
523:
521:
518:
514:
513:
511:
508:
504:
503:
500:
497:
489:Pin grid array
487:Main article:
484:
481:
478:
477:
475:
472:
466:
465:
463:
460:
456:
455:
453:
450:
446:
445:
443:
440:
436:
435:
432:
429:
425:
424:
422:
419:
415:
414:
412:
409:
405:
404:
401:
398:
380:Main article:
377:
374:
357:
356:
354:
351:
347:
346:
344:
341:
335:
334:
332:
329:
323:
322:
320:
317:
311:
310:
307:
304:
300:
299:
297:
294:
290:
289:
287:
284:
280:
279:
277:
274:
270:
269:
267:
264:
260:
259:
256:
253:
240:
237:
234:
233:
231:
228:
224:
223:
221:
218:
214:
213:
211:
206:
202:
201:
198:
195:
191:
190:
187:
184:
180:
179:
176:
171:
167:
166:
164:
161:
157:
156:
154:
151:
147:
146:
142:
137:
133:
132:
130:
125:
121:
120:
117:
114:
89:Main article:
86:
83:
9:
6:
4:
3:
2:
7784:
7773:
7770:
7768:
7765:
7763:
7762:Chip carriers
7760:
7759:
7757:
7743:
7737:
7731:
7728:
7726:
7723:
7721:
7718:
7716:
7713:
7711:
7708:
7706:
7703:
7702:
7700:
7696:
7690:
7687:
7685:
7682:
7680:
7677:
7675:
7672:
7670:
7667:
7665:
7662:
7659:
7656:
7653:
7652:
7650:
7648:
7644:
7638:
7635:
7633:
7630:
7628:
7625:
7623:
7620:
7619:
7617:
7613:
7606:
7604:
7601:
7599:
7596:
7594:
7591:
7589:
7586:
7583:
7582:
7580:
7576:
7570:
7567:
7565:
7562:
7560:
7557:
7555:
7552:
7550:
7547:
7545:
7542:
7540:
7537:
7535:
7532:
7530:
7527:
7526:
7524:
7520:
7514:
7511:
7510:
7508:
7504:
7497:
7494:
7491:
7488:
7486:(D3PAK) (SMT)
7485:
7482:
7480:(D2PAK) (SMT)
7479:
7476:
7474:(I2PAK) (SMT)
7473:
7470:
7467:
7464:
7461:
7458:
7455:
7452:
7449:
7446:
7443:
7440:
7437:
7434:
7431:
7428:
7425:
7422:
7419:
7416:
7413:
7410:
7407:
7404:
7401:
7398:
7395:
7392:
7390:
7387:
7386:
7384:
7382:
7378:
7371:
7368:
7365:
7362:
7359:
7356:
7353:
7350:
7347:
7344:
7343:
7341:
7339:
7334:
7330:
7323:
7318:
7316:
7311:
7309:
7304:
7303:
7300:
7294:
7291:
7289:
7286:
7284:
7283:ICpackage.org
7281:
7279:
7276:
7274:
7271:
7269:
7266:
7263:
7260:
7259:
7238:
7234:
7228:
7209:
7205:
7198:
7192:
7173:
7169:
7162:
7156:
7148:
7141:
7135:
7127:
7120:
7114:
7106:
7099:
7093:
7085:
7078:
7072:
7053:
7049:
7042:
7036:
7017:
7013:
7006:
7000:
6981:
6974:
6968:
6949:
6945:
6938:
6932:
6913:
6909:
6902:
6896:
6877:
6873:
6866:
6860:
6845:
6841:
6834:
6815:
6811:
6804:
6798:
6779:
6775:
6768:
6762:
6747:. 15 May 2014
6746:
6739:
6733:
6714:
6710:
6703:
6697:
6678:
6674:
6667:
6661:
6645:
6638:
6632:
6613:
6609:
6602:
6596:
6577:
6573:
6566:
6560:
6541:
6537:
6530:
6524:
6505:
6501:
6494:
6488:
6481:
6476:
6457:
6453:
6446:
6440:
6421:
6417:
6410:
6404:
6385:
6381:
6374:
6368:
6349:
6345:
6338:
6332:
6313:
6309:
6302:
6296:
6294:
6292:
6272:
6268:
6261:
6255:
6247:
6243:
6236:
6230:
6211:
6207:
6203:
6196:
6190:
6171:
6167:
6160:
6154:
6135:
6131:
6124:
6118:
6099:
6095:
6088:
6082:
6067:
6060:
6054:
6035:
6031:
6024:
6018:
6003:
5996:
5990:
5971:
5967:
5960:
5954:
5935:
5931:
5927:
5920:
5914:
5895:
5891:
5887:
5880:
5874:
5855:
5851:
5847:
5840:
5834:
5819:
5815:
5808:
5802:
5786:
5783:
5779:
5772:
5766:
5747:
5743:
5736:
5730:
5719:
5715:
5711:
5704:
5698:
5696:
5694:
5692:
5690:
5688:
5686:
5684:
5682:
5680:
5678:
5669:
5665:
5658:
5652:
5634:
5628:
5612:
5609:
5605:
5598:
5590:
5586:
5585:
5578:
5567:
5560:
5554:
5547:
5542:
5531:
5525:
5514:
5508:
5497:
5491:
5476:
5472:
5465:
5463:
5461:
5459:
5457:
5455:
5453:
5444:
5440:
5434:
5426:
5420:
5404:
5400:
5394:
5386:
5380:
5373:
5368:
5352:
5346:
5344:
5327:
5321:
5319:
5302:
5296:
5288:
5284:
5278:
5276:
5274:
5272:
5255:
5251:
5245:
5229:
5223:
5207:
5201:
5185:
5179:
5171:
5167:
5163:
5157:
5141:
5137:
5131:
5123:
5119:
5115:
5109:
5105:
5101:
5097:
5093:
5086:
5070:
5064:
5048:
5044:
5038:
5022:
5018:
5012:
4996:
4992:
4986:
4970:
4964:
4962:
4960:
4958:
4956:
4954:
4952:
4950:
4948:
4946:
4944:
4942:
4940:
4938:
4936:
4934:
4932:
4930:
4928:
4926:
4924:
4922:
4920:
4918:
4916:
4914:
4912:
4910:
4908:
4906:
4904:
4902:
4900:
4898:
4896:
4894:
4892:
4890:
4888:
4879:
4873:
4854:
4847:
4841:
4825:
4819:
4817:
4815:
4813:
4811:
4809:
4807:
4805:
4803:
4801:
4799:
4797:
4795:
4793:
4791:
4786:
4776:
4773:
4771:
4768:
4766:
4763:
4761:
4758:
4756:
4753:
4751:
4748:
4746:
4743:
4741:
4738:
4736:
4733:
4732:
4728:
4722:
4717:
4710:
4702:
4699:
4695:
4692:
4688:
4684:
4681:
4677:
4673:
4669:
4665:
4662:
4661:
4660:
4649:
4646:
4641:
4638:
4637:
4635:
4632:
4629:
4625:
4622:
4617:
4613:
4610:
4607:
4603:
4600:
4596:
4593:
4589:
4588:
4586:
4583:
4582:
4573:
4569:
4566:
4562:
4558:
4555:
4552:
4549:
4545:
4542:
4538:
4535:
4531:
4528:
4524:
4521:
4517:
4514:
4510:
4507:
4503:
4500:
4497:
4496:
4494:
4481:
4478:
4475:
4472:
4469:
4466:
4463:
4460:
4457:
4453:
4450:
4447:
4443:
4440:
4437:
4434:
4431:
4428:
4427:
4425:
4407:
4403:
4395:
4386:
4383:
4380:
4378:
4375:
4374:
4370:
4367:
4364:
4362:
4359:
4358:
4354:
4351:
4348:
4346:
4343:
4342:
4338:
4335:
4332:
4330:
4327:
4326:
4322:
4319:
4316:
4314:
4311:
4310:
4306:
4303:
4300:
4298:
4295:
4294:
4290:
4287:
4284:
4282:
4279:
4278:
4274:
4271:
4268:
4266:
4263:
4262:
4258:
4255:
4252:
4250:
4247:
4246:
4242:
4239:
4236:
4233:
4230:
4229:
4225:
4222:
4219:
4216:
4213:
4212:
4208:
4205:
4202:
4200:SOT-26, SC-74
4199:
4196:
4195:
4191:
4188:
4185:
4182:
4179:
4178:
4162:
4159:
4155:
4152:
4149:
4145:
4144:
4134:Is lead-less
4133:
4130:
4127:
4124:
4121:
4120:
4116:
4113:
4110:
4108:
4105:
4104:
4101:
4098:
4095:
4093:
4090:
4089:
4086:
4083:
4080:
4077:
4074:
4073:
4070:
4067:
4064:
4061:
4058:
4057:
4053:
4050:
4047:
4044:
4041:
4040:
4036:
4033:
4030:
4027:
4024:
4023:
4019:
4016:
4013:
4011:TO-243, SC-62
4010:
4007:
4006:
4003:
4000:
3997:
3994:
3991:
3990:
3986:
3983:
3980:
3977:
3974:
3973:
3969:
3949:
3946:
3945:
3941:
3938:
3937:
3933:
3930:
3929:
3921:
3918:
3917:
3914:
3910:
3895:
3892:
3889:
3886:
3885:
3881:
3878:
3875:
3872:
3871:
3867:
3864:
3861:
3858:
3857:
3853:
3850:
3849:
3837:
3834:
3832:
3828:
3822:
3807:
3804:
3803:
3799:
3796:
3795:
3791:
3788:
3787:
3783:
3780:
3779:
3775:
3772:
3771:
3767:
3764:
3763:
3759:
3756:
3755:
3751:
3748:
3747:
3739:
3732:
3729:
3728:
3724:
3721:
3720:
3716:
3713:
3712:
3708:
3705:
3704:
3700:
3697:
3696:
3692:
3689:
3688:
3684:
3681:
3680:
3676:
3673:
3672:
3668:
3665:
3664:
3660:
3657:
3656:
3652:
3649:
3646:
3645:
3641:
3638:
3635:
3634:
3630:
3627:
3626:
3622:
3619:
3618:
3614:
3604:
3597:
3594:
3593:
3589:
3586:
3585:
3581:
3578:
3577:
3573:
3570:
3569:
3565:
3562:
3561:
3557:
3554:
3553:
3549:
3546:
3545:
3541:
3538:
3537:
3533:
3530:
3529:
3525:
3522:
3521:
3517:
3514:
3513:
3509:
3506:
3502:
3499:EIA 2012-12 (
3498:
3497:
3493:
3490:
3489:
3485:
3471:
3468:
3465:
3462:
3459:
3458:
3454:
3451:
3448:
3445:
3442:
3441:
3437:
3434:
3431:
3428:
3425:
3424:
3420:
3417:
3414:
3411:
3408:
3407:
3403:
3400:
3397:
3394:
3391:
3390:
3386:
3383:
3380:
3377:
3374:
3373:
3370:
3367:
3364:
3361:
3358:
3357:
3353:
3350:
3347:
3344:
3341:
3340:
3336:
3333:
3330:
3327:
3324:
3323:
3320:
3317:
3314:
3311:
3308:
3307:
3303:
3300:
3297:
3294:
3291:
3290:
3286:
3283:
3280:
3277:
3274:
3273:
3269:
3266:
3263:
3260:
3257:
3256:
3252:
3249:
3246:
3243:
3240:
3239:
3235:
3232:
3229:
3226:
3223:
3222:
3218:
3215:
3212:
3209:
3206:
3205:
3202:
3199:
3196:
3193:
3190:
3189:
3185:
3182:
3181:
3168:
3165:
3163:
3159:
3144:
3140:
3138:
3134:
3128:
3119:
3112:
3107:
3099:
3088:
3085:
3082:
3078:
3076:
3073:
3071:
3067:
3064:
3060:
3057:
3053:
3052:
3051:
3038:
3035:
3032:
3029:
3028:
3020:
3013:
3006:
3003:
3002:
2994:
2987:
2980:
2977:
2976:
2972:
2969:
2966:
2963:
2962:
2950:
2948:
2946:
2944:
2942:
2940:
2938:
2936:
2934:
2932:
2929:
2926:
2924:
2921:
2919:
2918:
2914:
2911:
2908:
2905:
2903:
2900:
2898:
2895:
2892:
2889:
2886:
2883:
2881:
2878:
2875:
2871:
2870:
2867:
2865:
2863:
2860:
2858:
2856:
2854:
2852:
2850:
2848:
2845:
2842:
2840:
2837:
2834:
2830:
2829:
2825:
2823:
2817:
2814:
2812:
2809:
2806:
2803:
2800:
2797:
2794:
2792:
2789:
2787:
2786:
2783:
2781:
2779:
2776:
2774:
2772:
2770:
2768:
2766:
2764:
2761:
2758:
2756:
2753:
2750:
2746:
2745:
2738:
2735:
2729:
2726:
2723:
2720:
2717:
2711:
2705:
2702:
2699:
2696:
2693:
2690:
2689:
2677:
2675:
2673:
2670:
2668:
2665:
2662:
2659:
2656:
2654:
2651:
2648:
2646:
2643:
2641:
2640:
2637:
2635:
2633:
2630:
2628:
2625:
2622:
2620:
2617:
2614:
2611:
2608:
2606:
2603:
2601:
2600:
2596:
2593:
2591:
2588:
2585:
2582:
2579:
2576:
2573:
2570:
2569:
2565:
2562:
2560:
2557:
2554:
2551:
2548:
2545:
2542:
2539:
2535:
2531:
2528:
2526:
2523:
2520:
2517:
2514:
2511:
2508:
2505:
2499:
2497:
2490:TSSOP Package
2487:
2481:
2478:
2476:
2474:
2471:
2469:
2467:
2465:
2463:
2461:
2459:
2456:
2453:
2451:
2448:
2446:
2445:
2441:
2439:
2433:
2431:
2428:
2425:
2422:
2419:
2416:
2413:
2410:
2408:
2405:
2403:
2402:
2399:
2397:
2395:
2392:
2390:
2388:
2386:
2384:
2382:
2380:
2377:
2374:
2372:
2369:
2367:
2366:
2362:
2360:
2357:
2354:
2352:
2349:
2346:
2343:
2340:
2337:
2334:
2331:
2329:
2326:
2323:
2319:
2318:
2314:
2311:
2308:
2305:
2302:
2299:
2296:
2293:
2290:
2287:
2286:
2282:
2279:
2276:
2273:
2270:
2267:
2264:
2261:
2258:
2255:
2254:
2250:
2247:
2244:
2241:
2238:
2235:
2232:
2229:
2226:
2223:
2222:
2218:
2215:
2212:
2209:
2206:
2203:
2200:
2197:
2194:
2191:
2181:
2173:
2168:
2164:
2161:
2158:
2155:
2152:
2149:
2146:
2143:
2140:
2137:
2136:
2132:
2129:
2126:
2123:
2120:
2117:
2114:
2111:
2108:
2105:
2104:
2100:
2097:
2094:
2091:
2088:
2085:
2082:
2079:
2076:
2073:
2065:
2059:
2054:
2051:
2049:
2047:
2044:
2042:
2040:
2038:
2036:
2034:
2032:
2029:
2026:
2024:
2021:
2019:
2018:
2015:
2013:
2011:
2004:
2002:
2000:
1997:
1995:
1993:
1990:
1989:
1985:
1983:
1980:
1973:
1971:
1968:
1965:
1962:
1959:
1956:
1948:
1942:
1937:
1930:
1927:
1921:
1918:
1915:
1912:
1906:
1900:
1897:
1894:
1891:
1888:
1885:
1882:
1881:
1870:
1864:
1861:
1855:
1852:
1849:
1846:
1840:
1837:
1831:
1828:
1825:
1822:
1819:
1816:
1813:
1810:
1806:
1803:
1802:
1801:
1799:
1795:
1794:
1780:
1774:
1772:IC body width
1771:
1765:
1762:
1759:
1756:
1750:
1747:
1741:
1738:
1735:
1732:
1729:
1726:
1723:
1720:
1717:
1716:
1711:
1699:
1696:
1693:
1687:
1684:
1678:
1675:
1672:
1669:
1666:
1663:
1660:
1657:
1654:
1653:
1648:
1642:Surface-mount
1629:
1626:
1623:
1620:
1617:
1614:
1611:
1608:
1605:
1602:
1599:
1596:
1593:
1590:
1587:
1584:
1581:
1578:
1575:
1572:
1569:
1566:
1563:
1560:
1558:
1555:
1553:
1550:
1547:
1544:
1541:
1538:
1535:
1532:
1531:
1529:
1526:
1522:
1519:
1516:
1513:
1512:
1508:
1504:
1499:
1486:
1483:
1480:
1479:
1475:
1472:
1469:
1468:
1465:
1462:
1459:
1458:
1455:
1452:
1449:
1448:
1444:
1441:
1438:
1437:
1433:
1429:
1426:Similar to a
1425:
1422:
1419:
1418:
1415:
1413:
1410:
1407:
1406:
1403:
1400:
1397:
1396:
1393:
1390:
1387:
1386:
1383:
1380:
1377:
1376:
1373:
1370:
1367:
1366:
1363:
1360:
1357:
1356:
1353:
1349:
1346:
1343:
1342:
1338:
1335:
1333:
1330:
1329:
1325:
1322:
1319:
1318:
1315:
1313:
1307:
1292:
1290:Chip-on-glass
1289:
1286:
1285:
1281:
1277:
1275:
1272:
1269:
1268:
1264:
1261:
1258:
1257:
1253:
1249:
1247:
1246:Chip on board
1244:
1241:
1240:
1236:
1233:
1230:
1229:
1225:
1223:
1220:
1217:
1216:
1212:
1210:
1207:
1205:Fan-out WLCSP
1204:
1203:
1199:
1196:
1193:
1192:
1188:
1184:
1180:
1176:
1174:
1171:
1168:
1167:
1164:Same as TCSP
1163:
1160:
1157:
1156:
1152:
1149:
1146:
1145:
1141:
1138:
1136:
1133:
1132:
1128:
1126:
1123:
1120:
1119:
1115:
1112:
1109:
1108:
1102:
1098:
1093:
1089:
1088:
1072:
1069:
1066:
1065:
1062:
1059:
1056:
1055:
1051:
1048:
1045:
1044:
1041:
1038:
1035:
1034:
1031:
1028:
1025:
1024:
1021:
1018:
1016:
1013:
1012:
1009:
1006:
1004:
1001:
1000:
997:
994:
992:
989:
988:
985:
982:
979:
978:
974:
972:
969:
968:
965:
961:
957:
954:
952:
949:
948:
944:
941:
938:
937:
934:
931:
928:
927:
924:
921:
918:
917:
913:
910:
907:
905:
902:
901:
897:
895:
892:
891:
888:
885:
883:
880:
879:
876:
873:
870:
869:
866:
863:
860:
859:
856:
853:
850:
849:
846:
843:
840:
839:
836:
833:
831:
828:
827:
823:
820:
817:
816:
813:
799:
796:
793:
792:
789:
786:
783:
782:
779:
776:
773:
772:
769:
766:
763:
762:
759:
756:
753:
752:
749:
746:
743:
742:
739:
736:
733:
732:
729:
727:
724:
723:
720:
717:
714:
713:
709:
706:
703:
702:
699:
697:
694:
691:
690:
686:
682:
680:
677:
674:
673:
670:
667:
664:
663:
660:
657:
655:
652:
651:
647:
644:
641:
640:
637:
634:
631:
630:
626:
623:
620:
619:
616:
613:
610:
609:
606:
602:
599:
596:
595:
592:
589:
586:
585:
581:
579:
576:
573:
572:
568:
565:
562:
561:
557:
550:Flat packages
543:
540:
537:
536:
532:
529:
526:
525:
522:
519:
516:
515:
512:
509:
506:
505:
501:
498:
495:
494:
490:
476:
473:
471:
468:
467:
464:
461:
458:
457:
454:
451:
448:
447:
444:
441:
438:
437:
433:
430:
427:
426:
423:
420:
417:
416:
413:
410:
407:
406:
402:
399:
396:
395:
392:
389:
383:
373:
371:
367:
363:
362:Chip on board
355:
352:
349:
348:
345:
342:
340:
337:
336:
333:
330:
328:
325:
324:
321:
318:
316:
313:
312:
308:
305:
302:
301:
298:
295:
292:
291:
288:
285:
282:
281:
278:
275:
272:
271:
268:
265:
262:
261:
257:
254:
251:
250:
246:
239:Surface mount
232:
229:
226:
225:
222:
219:
216:
215:
212:
210:
207:
204:
203:
199:
196:
193:
192:
188:
185:
182:
181:
177:
175:
172:
169:
168:
165:
162:
159:
158:
155:
152:
149:
148:
143:
141:
138:
135:
134:
131:
129:
126:
123:
122:
118:
115:
112:
111:
104:
100:
98:
92:
82:
79:
75:
70:
68:
64:
60:
55:
51:
47:
40:
36:
31:
27:
19:
7714:
7689:WL-CSP / WLP
7559:TSOP / HTSOP
7468:(DPAK) (SMT)
7462:(IPAK) (SMT)
7456:(TH / Panel)
7450:(TH / Panel)
7444:(TH / Panel)
7438:(TH / Panel)
7426:(TH / Panel)
7396:(TH / Panel)
7241:. Retrieved
7237:the original
7227:
7215:. Retrieved
7208:the original
7191:
7179:. Retrieved
7172:the original
7155:
7134:
7113:
7092:
7071:
7059:. Retrieved
7052:the original
7035:
7023:. Retrieved
7016:the original
6999:
6987:. Retrieved
6967:
6955:. Retrieved
6948:the original
6931:
6919:. Retrieved
6912:the original
6895:
6883:. Retrieved
6859:
6847:. Retrieved
6843:
6833:
6821:. Retrieved
6797:
6785:. Retrieved
6778:the original
6761:
6749:. Retrieved
6732:
6720:. Retrieved
6713:the original
6696:
6684:. Retrieved
6660:
6648:. Retrieved
6631:
6619:. Retrieved
6595:
6583:. Retrieved
6576:the original
6559:
6547:. Retrieved
6540:the original
6523:
6511:. Retrieved
6487:
6475:
6463:. Retrieved
6439:
6427:. Retrieved
6403:
6391:. Retrieved
6367:
6355:. Retrieved
6331:
6319:. Retrieved
6278:. Retrieved
6254:
6241:
6229:
6217:. Retrieved
6201:
6189:
6177:. Retrieved
6153:
6141:. Retrieved
6117:
6105:. Retrieved
6081:
6069:. Retrieved
6053:
6041:. Retrieved
6017:
6005:. Retrieved
5989:
5977:. Retrieved
5965:
5953:
5941:. Retrieved
5934:the original
5925:
5913:
5901:. Retrieved
5894:the original
5885:
5873:
5861:. Retrieved
5845:
5833:
5821:. Retrieved
5813:
5801:
5789:. Retrieved
5777:
5765:
5753:. Retrieved
5746:the original
5741:
5729:
5718:the original
5709:
5663:
5651:
5639:. Retrieved
5627:
5615:. Retrieved
5597:
5589:the original
5583:
5577:
5566:the original
5553:
5541:
5524:
5507:
5490:
5478:. Retrieved
5474:
5443:the original
5433:
5419:
5407:. Retrieved
5403:the original
5393:
5379:
5367:
5355:. Retrieved
5330:. Retrieved
5305:. Retrieved
5295:
5286:
5258:. Retrieved
5254:the original
5244:
5232:. Retrieved
5222:
5210:. Retrieved
5200:
5188:. Retrieved
5178:
5170:the original
5165:
5156:
5144:. Retrieved
5140:the original
5130:
5091:
5085:
5073:. Retrieved
5063:
5051:. Retrieved
5047:the original
5037:
5025:. Retrieved
5021:the original
5011:
4999:. Retrieved
4995:the original
4985:
4973:. Retrieved
4860:. Retrieved
4853:the original
4840:
4828:. Retrieved
4707:
4687:flex circuit
4658:
4487:Quad-in-line
4418:Dual-in-line
3922:Dimensions (
3912:
3854:Voltage (V)
3824:
3738:
3674:Chemi-Con F
3658:Chemi-Con E
3603:
3155:
3141:
3130:
3127:Chip carrier
3049:
1791:
1789:
1727:Total height
1705:Through-hole
1664:Total height
1351:
1309:
1262:Chip-on-flex
1083:
810:
388:chip carrier
385:
382:chip carrier
376:Chip carrier
360:
94:
78:wire bonding
71:
63:Pro Electron
44:
26:
7607:QUIP / QUIL
7262:JEDEC JEP95
7243:28 December
7217:28 December
7181:28 December
7061:28 December
7025:28 December
6989:28 December
6957:28 December
6921:28 December
6885:28 December
6823:28 December
6787:28 December
6751:28 December
6722:28 December
6686:28 December
6650:28 December
6621:28 December
6585:28 December
6549:28 December
6513:28 December
6465:28 December
6429:28 December
6393:28 December
6357:28 December
6321:28 December
6280:28 December
6219:28 December
6179:28 December
6143:28 December
6107:28 December
6071:28 December
6043:28 December
6007:28 December
5979:28 December
5943:28 December
5903:28 December
5863:28 December
5823:28 December
5791:28 December
5755:28 December
5617:28 December
5409:15 December
5357:15 December
5332:15 December
5307:15 December
5234:15 December
5212:15 December
5190:15 December
5146:15 December
5075:15 December
5053:15 December
5027:15 December
5001:15 December
4975:15 December
4830:15 December
4676:wire bonded
4579:Grid arrays
3842:Dimensions
3714:Panasonic H
3706:Chemi-Con K
3682:Panasonic D
3666:Panasonic C
2652:US8 package
2297:10.00–10.65
1757:Lead length
1694:Lead length
960:SOIC NARROW
603:Similar to
350:MICRO SMDXT
230:Plastic DIP
153:Ceramic DIP
7756:Categories
7615:Grid array
7554:SOP / SSOP
7506:Single row
7389:SOT / TSOT
6482:analog.com
5818:Littelfuse
5641:7 February
5260:24 October
5228:"Packages"
4862:3 February
4781:References
4745:Interposer
4680:"glob-top"
3270:0.062–0.1
3162:capacitors
2915:0.30–0.45
2597:0.19-0.30
2566:0.19-0.30
2555:0.05-0.15
2363:0.22–0.38
2315:0.38–0.40
2283:0.39–0.46
2251:0.39–0.46
2219:0.39–0.46
2165:0.17–0.27
2133:0.17–0.27
2101:0.17–0.27
1986:1.14–1.73
1838:Pin width.
1748:Lead width
1685:Lead width
1097:U.S. penny
370:lead frame
366:interposer
243:See also:
220:Molded DIP
197:Shrink DIP
186:Skinny DIP
7669:Flip Chip
7588:QIP / QIL
7549:SO / SOIC
7539:Flat Pack
7534:DIP / DIL
7513:SIP / SIL
7381:3...5-pin
6242:Datasheet
6202:Datasheet
5966:Resources
5930:Panasonic
5926:Datasheet
5846:Datasheet
5814:Datasheet
5742:Datasheet
5714:Panasonic
5710:Datasheet
5664:Datasheet
4704:textiles.
4666:, a bare
4387:Leadless
4376:SOT-1202
4371:Leadless
4360:SOT-1115
4323:Leadless
4307:Leadless
4197:SOT-23-6
3992:SOT-23-3
3851:Power (W)
3827:resistors
3648:Panasonic
3637:Chemi-Con
3186:Imperial
3158:resistors
2912:0.09–0.20
2901:0.35–0.50
2684:Quad rows
2594:0.09-0.2
2586:.05-0.15
2571:20-TSSOP
2563:0.09-0.2
2540:14-TSSOP
2532:0.19–0.3
2442:0.19–0.3
2312:0.23–0.32
2303:0.10–0.30
2291:10.1–10.5
2280:0.19–0.25
2271:0.10–0.25
2248:0.19–0.25
2239:0.10–0.25
2227:8.55–8.75
2216:0.19–0.25
2207:0.10–0.25
2005:2.54 (0.1
1974:2.54 (0.1
1323:Full name
1231:MICRO SMD
1189:package.
1113:Full name
964:SOIC WIDE
894:mini-SOIC
821:Full name
725:SIDEBRAZE
578:Flat-pack
566:Full name
499:Full name
400:Full name
255:Full name
116:Full name
74:flip chip
18:Pin pitch
7578:Quad row
7522:Dual row
6980:Archived
6876:Archived
6874:. 2010.
6872:Intersil
6814:Archived
6812:. 2002.
6677:Archived
6675:. 2008.
6612:Archived
6610:. 2008.
6504:Archived
6456:Archived
6420:Archived
6384:Archived
6348:Archived
6344:Intersil
6312:Archived
6271:Archived
6210:Archived
6170:Archived
6168:. 2008.
6134:Archived
6132:. 2019.
6098:Archived
6096:. 2017.
6066:Motorola
6034:Archived
5970:Archived
5854:Archived
5785:Archived
5611:Archived
5480:15 March
5122:61288567
4872:cite web
4713:See also
4470:(TSSOP).
4446:J-leaded
4430:Flatpack
4344:SOT-963
4328:SOT-953
4312:SOT-891
4296:SOT-886
4280:SOT-666
4264:SOT-665
4248:SOT-563
4231:SOT-363
4214:SOT-353
4180:Package
4148:Motorola
4122:SOT-883
4106:SOT-723
4091:SOT-663
4075:SOT-416
4059:SOT-323
4042:SOT-223
4025:SOT-143
3975:Package
3879:0.25–0.4
3839:Package
3170:Package
3111:name tag
3030:52-VELGA
2577:4.3-4.5
2574:6.4-6.6
2546:4.3-4.5
2543:4.9-5.1
2529:0.09–0.2
2338:SOT-23-6
1981:3.05–3.6
1963:6.2–6.48
1876:Dual row
1505:IC in a
627:No lead
50:packages
7348:(DO-27)
7336:Single
7128:. 2017.
7107:. 2016.
7086:. 2017.
6849:8 April
6838:admin.
5886:Catalog
5778:Catalog
5374:nxp.com
4668:silicon
4355:Leaded
4339:Leaded
4291:Leaded
4275:Leaded
4259:Leaded
4243:Leaded
4226:Leaded
4209:Leaded
4183:Aliases
4008:SOT-89
3987:Remark
3978:Aliases
3919:Package
3893:0.4–1.0
3865:0.2–0.3
3825:Mostly
3805:SOD-923
3797:SOD-723
3773:SOD-128
3765:SOD-123
3757:SOD-80C
3749:Package
3620:Package
3491:Package
3156:Mostly
3004:52-ULGA
2978:52-ULGA
2964:Package
2890:TQFP-44
2801:48-CLCC
2703:Package
2512:4.3-4.5
2509:2.9-3.1
2506:8-TSSOP
2429:0.7–0.8
2288:16-SOIC
2265:5.8–6.2
2256:16-SOIC
2233:5.8–6.2
2224:14-SOIC
2201:5.8–6.2
2195:4.8–5.0
2138:16-MSOP
2106:10-MSOP
1960:9.2–9.8
1895:Package
1509:package
1432:example
1408:MAP-BGA
1326:Remark
1320:Acronym
1116:Remark
1110:Acronym
824:Remark
818:Acronym
569:Remark
563:Acronym
502:Remark
496:Acronym
403:Remark
397:Acronym
283:CERPACK
258:Remark
252:Acronym
119:Remark
113:Acronym
7496:TO-274
7490:TO-273
7484:TO-268
7478:TO-263
7472:TO-262
7466:TO-252
7460:TO-251
7454:TO-247
7448:TO-220
7442:TO-202
7436:TO-126
7364:DO-214
7358:DO-213
7352:DO-204
7346:DO-201
5120:
5110:
4217:SC-88A
4125:SC-101
4045:TO-261
4028:TO-253
3909:DO-214
3903:DO-214
3831:diodes
3304:0.125
3236:0.031
3210:009005
3194:008004
3183:Metric
3023:
3016:
3009:
2997:
2990:
2983:
2826:0.508
2694:Family
2615:μSOP-8
2417:8-TDFN
2259:9.9–10
2192:8-SOIC
2074:8-MSOP
2007:
1991:32-DIP
1976:
1886:Family
1628:TO-274
1622:TO-263
1616:TO-262
1610:TO-252
1604:TO-251
1598:TO-247
1594:TO-226
1589:TO-220
1583:TO-126
1358:TEPBGA
1101:SOT-23
1046:VSSOP
882:HTSSOP
871:HSSOP
160:CERDIP
39:555 IC
7647:Wafer
7430:TO-92
7424:TO-66
7418:TO-39
7412:TO-18
7338:diode
7211:(PDF)
7200:(PDF)
7175:(PDF)
7164:(PDF)
7149:2010.
7143:(PDF)
7122:(PDF)
7101:(PDF)
7080:(PDF)
7055:(PDF)
7044:(PDF)
7019:(PDF)
7008:(PDF)
6983:(PDF)
6976:(PDF)
6951:(PDF)
6940:(PDF)
6915:(PDF)
6904:(PDF)
6879:(PDF)
6868:(PDF)
6817:(PDF)
6806:(PDF)
6781:(PDF)
6770:(PDF)
6741:(PDF)
6716:(PDF)
6705:(PDF)
6680:(PDF)
6669:(PDF)
6640:(PDF)
6615:(PDF)
6604:(PDF)
6579:(PDF)
6568:(PDF)
6543:(PDF)
6532:(PDF)
6507:(PDF)
6496:(PDF)
6459:(PDF)
6452:RICOH
6448:(PDF)
6423:(PDF)
6412:(PDF)
6387:(PDF)
6376:(PDF)
6351:(PDF)
6340:(PDF)
6315:(PDF)
6304:(PDF)
6274:(PDF)
6263:(PDF)
6238:(PDF)
6213:(PDF)
6198:(PDF)
6173:(PDF)
6162:(PDF)
6137:(PDF)
6126:(PDF)
6101:(PDF)
6090:(PDF)
6062:(PDF)
6037:(PDF)
6026:(PDF)
5998:(PDF)
5973:(PDF)
5962:(PDF)
5937:(PDF)
5922:(PDF)
5897:(PDF)
5882:(PDF)
5857:(PDF)
5842:(PDF)
5810:(PDF)
5774:(PDF)
5749:(PDF)
5738:(PDF)
5721:(PDF)
5706:(PDF)
5660:(PDF)
5636:(PDF)
5569:(PDF)
5562:(PDF)
5533:(PDF)
5516:(PDF)
5499:(PDF)
5118:S2CID
4856:(PDF)
4849:(PDF)
4672:epoxy
4616:TFBGA
4599:LFBGA
4158:TO220
4154:D2PAK
4141:Other
4078:SC-75
4062:SC-70
3924:incl.
3501:KEMET
3421:0.75
3404:0.75
3387:0.75
3337:0.25
3253:0.05
3227:01005
3219:0.02
3207:03015
3137:JEDEC
3079:WSI (
3061:PoP (
3054:SiP (
2896:12.00
2893:10.00
2818:1.016
2815:14.22
2807:14.22
2804:14.22
2691:Image
2589:0.65
2558:0.65
2496:TSSOP
2023:LFCSP
1998:15.24
1957:8-DIP
1883:Image
1763:Pitch
1700:Pitch
1574:TO-99
1568:TO-92
1562:TO-66
1557:TO-46
1552:TO-39
1546:TO-18
1523:SOT:
1507:TO-18
1503:ZN414
1481:UFBGA
1450:LFBGA
1388:TFBGA
1036:VSOP
1026:TVSOP
1015:TSSOP
912:Maxim
861:HSOP
851:DSOP
812:ICs.
715:HVQFN
632:ETQFP
517:FCPGA
183:SKDIP
59:JEDEC
7684:UICC
7627:eWLB
7593:PLCC
7544:MSOP
7432:(TH)
7420:(TH)
7414:(TH)
7408:(TH)
7406:TO-8
7402:(TH)
7400:TO-5
7394:TO-3
7245:2015
7219:2015
7183:2015
7063:2015
7027:2015
6991:2015
6959:2015
6923:2015
6887:2015
6851:2022
6825:2015
6789:2015
6753:2015
6724:2015
6688:2015
6652:2015
6623:2015
6587:2015
6551:2015
6515:2015
6467:2015
6431:2015
6395:2015
6359:2015
6323:2015
6282:2015
6221:2015
6181:2015
6145:2015
6109:2015
6073:2015
6045:2015
6009:2015
5981:2015
5945:2015
5905:2015
5865:2015
5825:2015
5793:2015
5757:2015
5643:2018
5619:2015
5482:2024
5411:2011
5359:2011
5334:2011
5309:2011
5262:2009
5236:2011
5214:2011
5192:2011
5148:2011
5108:ISBN
5096:IEEE
5077:2011
5055:2011
5029:2011
5003:2011
4977:2011
4878:link
4864:2011
4832:2011
4606:μBGA
4592:FBGA
4572:PQFN
4541:TQFP
4534:MQFP
4527:CQFP
4520:PQFP
4513:LQFP
4456:SOIC
3896:300
3882:200
3868:150
3829:and
3463:2920
3460:7451
3446:2725
3443:6863
3429:2512
3426:6332
3412:2010
3409:5025
3395:1825
3392:4564
3378:1812
3375:4532
3362:1806
3359:4516
3354:0.5
3345:1210
3342:3225
3328:1206
3325:3216
3312:1008
3309:2520
3295:0805
3292:2012
3287:0.1
3278:0603
3275:1608
3261:0402
3258:1005
3244:0201
3241:0603
3224:0402
3191:0201
3160:and
3021:0.10
2995:0.65
2923:TQFN
2909:1.00
2906:0.80
2880:TQFP
2861:0.50
2839:LQFP
2810:2.21
2791:CLCC
2777:1.27
2755:PLCC
2700:Name
2631:0.65
2605:μSOP
2583:1.1
2580:6.4
2552:1.1
2549:6.4
2524:0.65
2521:0.15
2450:TSOP
2434:0.65
2407:TDFN
2393:0.65
2371:SSOP
2355:0.95
2350:1.45
2306:1.27
2300:2.65
2277:1.05
2274:1.27
2268:1.72
2245:1.05
2242:1.27
2236:1.72
2213:1.05
2210:1.27
2204:1.72
2183:SOP
2180:SOIC
2162:0.18
2159:0.95
2153:0.10
2141:4.04
2130:0.18
2127:0.95
2121:0.10
2098:0.18
2095:0.95
2092:0.65
2089:0.10
2064:MSOP
1966:7.62
1892:Name
1798:mils
1540:TO-5
1534:TO-3
1515:MELF
1470:SBGA
1460:TBGA
1439:μBGA
1420:UCSP
1398:PBGA
1378:OBGA
1368:CBGA
1344:LBGA
1332:FBGA
1252:LEDs
1218:eWLB
1194:PMCP
1158:TDSP
1147:TCSP
1099:. A
1067:USON
1057:WSON
1003:TSOP
991:SSOP
980:SON
962:and
951:SOIC
939:QSOP
929:PSON
919:PSOP
904:MSOP
841:CSOP
794:ODFN
784:UQFN
774:WQFN
764:VQFN
754:TQFN
744:VQFP
734:TQFP
704:MQFP
665:LQFP
654:PQFP
642:PQFN
611:BQFP
605:PQFP
597:CQFP
538:CPGA
507:OPGA
470:PLCC
459:DLCC
449:LCCC
418:CLCC
327:LTCC
293:CQGP
263:CCGA
227:PDIP
217:MDIP
194:SDIP
150:CDIP
61:and
7674:PoP
7664:CSP
7660:COG
7657:COF
7654:COB
7637:PGA
7632:LGA
7622:BGA
7603:QFP
7598:QFN
7584:LCC
7569:ZIP
7529:DFN
7370:SOD
5100:doi
4628:QFN
4565:MLF
4561:MLP
4548:QFN
4506:QFP
4406:MLP
3505:AVX
3503:R,
3139:).
3025:mm
2999:mm
2957:LGA
2697:Pin
2671:0.5
2663:3.1
2660:2.3
2645:US8
2626:1.1
2623:4.9
2518:1.2
2515:6.4
2472:0.5
2358:0.6
2347:2.8
2344:1.6
2341:2.9
2328:SOT
2309:1.4
2294:7.5
2262:3.9
2230:3.9
2198:3.9
2156:0.5
2150:1.1
2147:4.9
2124:0.5
2118:1.1
2115:4.9
2086:1.1
2083:4.9
2045:0.5
2009:in)
1978:in)
1969:7.7
1947:DIP
1889:Pin
1809:PCB
1428:BGA
1287:COG
1270:TAB
1259:COF
1242:COB
1187:BGA
1183:I/O
1179:die
1135:CSP
1121:BL
971:SOJ
830:SOP
692:QFP
687:).
685:MLF
675:QFN
621:DFN
587:CFP
527:PGA
439:LCC
428:LCC
408:BCC
368:or
339:MCM
315:LGA
303:LLP
273:CGA
205:ZIP
170:QIP
136:DIP
124:SIP
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7679:QP
7202:.
7166:.
7145:.
7124:.
7103:.
7082:.
7046:.
7010:.
6942:.
6906:.
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6808:.
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6743:.
6707:.
6671:.
6642:.
6606:.
6570:.
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6306:.
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6265:.
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4886:^
4874:}}
4870:{{
4789:^
4689:.
4563:,
4384:6
4368:6
4352:6
4336:5
4320:6
4304:6
4288:6
4272:5
4256:6
4240:6
4223:5
4206:6
4131:3
4114:3
4099:3
4084:3
4068:3
4051:4
4034:4
4017:4
4001:3
3639:D
3507:R)
3455:3
3438:1
3164:.
3039:?
3018:mm
3014:18
3011:mm
3007:14
2992:mm
2988:17
2985:mm
2981:12
2973:z
2666:.7
2537:Y
2186:Y
2177:SO
2068:Y
1951:Y
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2732:L
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2721:C
2718:H
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2712:W
2708:B
2706:W
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2649:Y
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1661:H
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