691:(Small Outline IC), a surface-mount package which is currently very popular, particularly in consumer electronics and personal computers, is essentially a shrunk version of the standard IC PDIP, the fundamental difference which makes it an SMT device being a second bend in the leads to flatten them parallel to the bottom plane of the plastic housing. The SOJ (Small Outline J-lead) and other SMT packages with "SOP" (for "Small Outline Package") in their names can be considered further relatives of the DIP, their original ancestor. SOIC packages tend to have half the pitch of DIP, and SOP are half that, a fourth of DIP. (0.1"/2.54 mm, 0.05"/1.27 mm, and 0.025"/0.635 mm, respectively)
49:
325:
428:(barely visible to the naked human eye) are welded between these die periphery contacts and bond pads on the die itself, connecting one lead to each bond pad, and making the final connection between the microcircuits and the external DIP leads. The bond wires are not usually taut but loop upward slightly to allow slack for thermal expansion and contraction of the materials; if a single bond wire breaks or detaches, the entire IC may become useless. The top of the package covers all of this delicate assemblage without crushing the bond wires, protecting it from contamination by foreign materials.
344:
356:
38:
208:
313:
301:
657:
27:
379:
152:
387:
244:(SOIC), though DIPs continued in extensive use through the 1990s, and still continue to be used substantially as the year 2011 passes. Because some modern chips are available only in surface-mount package types, a number of companies sell various prototyping adapters to allow those surface-mount devices (SMD) to be used like DIP devices with through-hole breadboards and soldered prototyping boards (such as
536:
1007:
403:, the SMT package that most resembles a typical DIP, appears essentially the same, notwithstanding size scale, except that after being bent down the leads are bent upward again by an equal angle to become parallel with the bottom plane of the package.) In ceramic (CERDIP) packages, an epoxy or grout is used to hermetically seal the two halves together, providing an
575:
451:(around the contained electronic components) with a hard translucent epoxy material from which the leads emerge. Others, such as DIP switches, are composed of two (or more) plastic housing parts snapped, welded, or glued together around a set of contacts and tiny mechanical parts, with the leads emerging through molded-in holes or notches in the plastic.
138:, possibly including a heat sink tab in place of the second row of pins, and types with four rows of pins, two rows, staggered, on each side of the package. DIP packages have been mostly displaced by surface-mount package types, which avoid the expense of drilling holes in a PCB and which allow higher density of interconnections.
436:
number of leads which a practical DIP package may have. Even for a very small die with many bond pads (e.g. a chip with 15 inverters, requiring 32 leads), a wider DIP would still be required to accommodate the radiating leads internally. This is one of the reasons that four-sided and multiple rowed packages, such as
423:
Inside the package, the lower half has the leads embedded, and at the center of the package is a rectangular space, chamber, or void into which the IC die is cemented. The leads of the package extend diagonally inside the package from their positions of emergence along the periphery to points along a
450:
Some other types of DIP devices are built very differently. Most of these have molded plastic housings and straight leads or leads that extend directly out of the bottom of the package. For some, LED displays particularly, the housing is usually a hollow plastic box with the bottom/back open, filled
126:
that supports the device die and provides connection pins. Some types of IC are made in ceramic DIP packages, where high temperature or high reliability is required, or where the device has an optical window to the interior of the package. Most DIP packages are secured to a PCB by inserting the pins
215:
The original dual-in-line package was invented by Bryant "Buck" Rogers in 1964 while working for
Fairchild Semiconductor. The first devices had 14 pins and looked much like they do today. The rectangular shape allowed integrated circuits to be packaged more densely than previous round packages. The
394:
The body (housing) of a DIP containing an IC chip is usually made from molded plastic or ceramic. The hermetic nature of a ceramic housing is preferred for extremely high reliability devices. However, the vast majority of DIPs are manufactured via a thermoset molding process in which an epoxy mold
596:, has the same dimensions as a DIL package, but the leads on each side are bent into an alternating zigzag configuration so as to fit four lines of solder pads (instead of two with a DIL). The QIL design increased the spacing between solder pads without increasing package size, for two reasons:
435:
The necessity of laying out all of the leads in a basically radial pattern in a single plane from the die perimeter to two rows on the periphery of the package is the main reason that DIP packages with higher lead counts must have wider spacing between the lead rows, and it effectively limits the
118:
is the total number of pins, and sometimes appended with the row-to-row package width "N" for narrow (0.3") or "W" for wide (0.6"). For example, a microcircuit package with two rows of seven vertical leads would be a DIP14 or DIP14N. The photograph at the upper right shows three DIP14 ICs. Common
431:
Usually, a company logo, alphanumeric codes and sometimes words are printed on top of the package to identify its manufacturer and type, when it was made (usually as a year and a week number), sometimes where it was made, and other proprietary information (perhaps revision numbers, manufacturing
628:
standards use an inter-lead spacing (lead pitch) of 0.1 inches (2.54 mm) (JEDEC MS-001BA). Row spacing varies depending on lead counts, with 0.3 in. (7.62 mm) (JEDEC MS-001) or 0.6 inch (15.24 mm) (JEDEC MS-011) the most common. Less common standardized row spacings include
419:
is not achieved because the plastic itself is usually somewhat porous to moisture and the process cannot ensure a good microscopic seal between the leads and the plastic at all points around the perimeter. However, contaminants are usually still kept out well enough that the device can operate
282:
or in sockets. Sockets allow easy replacement of a device and eliminates the risk of damage from overheating during soldering. Generally sockets were used for high-value or large ICs, which cost much more than the socket. Where devices would be frequently inserted and removed, such as in test
498:) wide DIP, normally when clarification is needed e.g. for DIP with 24 pins or more, which usually come in "wide" 0.600 in wide DIP package. An example of a typical proper full spec for a "narrow" DIP package would be 300 mil body width, 0.1 inches (2.54 mm) pin pitch.
119:
packages have as few as three and as many as 64 leads. Many analog and digital integrated circuit types are available in DIP packages, as are arrays of transistors, switches, light emitting diodes, and resistors. DIP plugs for ribbon cables can be used with standard IC sockets.
398:
The leads emerge from the longer sides of the package along the seam, parallel to the top and bottom planes of the package, and are bent downward approximately 90 degrees (or slightly less, leaving them angled slightly outward from the centerline of the package body). (The
460:
697:(PGA) packages may be considered to have evolved from the DIP. PGAs with the same 0.1 inches (2.54 mm) pin centers as most DIPs were popular for microprocessors from the early to mid-1980s through the 1990s. Owners of personal computers containing Intel
664:
As shown in the diagram, leads are numbered consecutively from Pin 1. When the identifying notch in the package is at the top, Pin 1 is the top left corner of the device. Sometimes Pin 1 is identified with an indent or paint dot mark.
640:(NC) leads to the internal chip, or are duplicated, e.g. two ground pins. For 0.6 inch spacing, typical lead counts are 24, 28, 32, and 40; less common are 36, 42, 48, 52, and 64 lead counts. Some microprocessors, such as the
127:
through holes in the board and soldering them in place. Where replacement of the parts is necessary, such as in test fixtures or where programmable devices must be removed for changes, a DIP socket is used. Some sockets include a
678:
In addition to providing for human visual identification of the orientation of the package, the notch allows automated chip-insertion machinery to confirm correct orientation of the chip by mechanical sensing.
635:
The number of leads is always even. For 0.3 inch spacing, typical lead counts are 8, 14, 16, 18, and 28; less common are 4, 6, 20, and 24 lead counts. To have an even number of leads some DIPs have unused
220:
machine and passed on to automated testing machines, with very little human labor required. DIP packages were still large with respect to the integrated circuits within them. By the end of the 20th century,
629:
0.4 inch (10.16 mm) (JEDEC MS-010) and 0.9 inch (22.86 mm), as well as a row spacing of 0.3 inch, 0.6 inch or 0.75 inch with a 0.07 inch (1.778 mm) lead pitch.
263:, DIPs remained popular for many years due to their easy handling with external programming circuitry (i.e., the DIP devices could be simply plugged into a socket on the programming device.) However, with
252:). (SMT can pose quite a problem, at least an inconvenience, for prototyping in general; most of the characteristics of SMT that are advantages for mass production are difficulties for prototyping.)
1011:
290:
DIPs are also used with breadboards, a temporary mounting arrangement for education, design development or device testing. Some hobbyists, for one-off construction or permanent prototyping, use
216:
package was well-suited to automated assembly equipment; a PCB could be populated with scores or hundreds of ICs, then all the components on the circuit board could be soldered at one time on a
270:
Through the 1990s, devices with fewer than 20 leads were manufactured in a DIP format in addition to the newer formats. Since about 2000, newer devices are often unavailable in the DIP format.
395:
compound is heated and transferred under pressure to encapsulate the device. Typical cure cycles for the resins are less than 2 minutes and a single cycle may produce hundreds of devices.
324:
199:
blocks on to which discrete components could be soldered were used where groups of components needed to be easily removed, for configuration changes, optional features or calibration.
343:
668:
For example, for a 14-lead DIP, with the notch at the top, the left leads are numbered from 1 to 7 (top to bottom) and the right row of leads are numbered 8 to 14 (bottom to top).
513:(OTP) versions. Windowed and windowless packages were also used for microcontrollers, and other devices, containing EPROM memory. Windowed CERDIP-packaged EPROMs were used for the
559:
chips and multiple resistors with a common pin. As compared to DIPs with a typical maximum pin count of 64, SIPs have a typical maximum pin count of 24 with lower package costs.
520:
Molded plastic DIPs are much lower in cost than ceramic packages; one 1979 study showed that a plastic 14 pin DIP cost around US$ 0.063 and a ceramic package cost US$ 0.82.
232:
DIPs were the mainstream of the microelectronics industry in the 1970s and 1980s. Their use has declined in the first decade of the 21st century due to the emerging new
632:
The former Soviet Union and
Eastern bloc countries used similar packages, but with a metric pin-to-pin spacing of 2.5 mm rather than 0.1 inches (2.54 mm).
355:
100:); eventually microprocessors and similar complex devices required more leads than could be put on a DIP package, leading to development of higher-density
1075:
300:
312:
1102:
968:
294:
wiring with DIPs, and their appearance when physically inverted as part of this method inspires the informal term "dead bug style" for the method.
740:
517:
ROM of many early IBM PC clones with an adhesive label covering the window to prevent inadvertent erasure through exposure to ambient light.
1606:
1556:
291:
415:
inside. Plastic DIP (PDIP) packages are usually sealed by fusing or cementing the plastic halves around the leads, but a high degree of
1497:
92:
R&D in 1964, when the restricted number of leads available on circular transistor-style packages became a limitation in the use of
1278:
1272:
1266:
1254:
1242:
1236:
1224:
1128:
716:. The similarity is such that a PGA socket may be physically compatible with some DIP devices, though the converse is rarely true.
505:
were sold in ceramic DIPs manufactured with a circular window of clear quartz over the chip die to allow the part to be erased by
20:
810:
675:, relays, or devices that replace leads with a heat sink fin). The remaining leads are numbered as if all positions had leads.
225:
packages allowed further reduction in the size and weight of systems. DIP chips are still popular for circuit prototyping on a
1016:
1409:
1095:
447:
CPU) has long leads inside the package between pins and the die, making such a package unsuitable for high speed devices.
604:. This may seem odd today, given the far closer solder pad spacing in use now, but in the 1970s, the heyday of the QIL,
1336:
1523:
It is relatively common to find packages that contain other components than their designated ones, such as diodes or
1466:
1346:
1051:
990:
933:
890:
869:
849:
104:. Furthermore, square and rectangular packages made it easier to route printed-circuit traces beneath the packages.
1331:
688:
400:
241:
1549:
1088:
1022:
159:
incorporating four DIP ICs, a DIP LED bargraph display (upper left), and a DIP 7-segment LED display (lower left)
122:
DIP packages are usually made from an opaque molded epoxy plastic pressed around a tin-, silver-, or gold-plated
30:
954:
88:(PCB) or inserted in a socket. The dual-inline format was invented by Don Forbes, Rex Rice and Bryant Rogers at
211:
Breadboard prototype: Ultrasonic microphone preamp build with SMD-parts soldered to DIP and SIP breakout boards
424:
rectangular perimeter surrounding the die, tapering as they go to become fine contacts at the die. Ultra-fine
1140:
1492:
901:
1588:
1375:
237:
1542:
1380:
1341:
1326:
1311:
563:
615:
track between 2 solder pads. This was very handy on the then standard single sided single layer PCBs.
349:
0.3" wide DIP socket for narrow DIP28 IC, also known as DIP28N, commonly used on older
Arduino boards
135:
48:
267:(ISP) technology now state of the art, this advantage of DIPs is rapidly losing importance as well.
1507:
1171:
761:
648:, used lead counts as high as 64; this is typically the maximum number of leads for a DIP package.
555:) has one row of connecting pins. It is not as popular as the DIP, but has been used for packaging
412:
233:
222:
80:
with a rectangular housing and two parallel rows of electrical connecting pins. The package may be
44:
ICs in 0.6" wide ceramic DIP40W, DIP32W, DIP28W, DIP24W packages, also known as CDIP (Ceramic DIP)
1512:
1351:
766:
279:
89:
81:
562:
One variant of the single in-line package uses part of the lead frame for a heat sink tab. This
1667:
1321:
1295:
735:
702:
509:. Often, the same chips were also sold in less expensive windowless PDIP or CERDIP packages as
185:
DIP connector plugs for ribbon cables are common in computers and other electronic equipment.
1502:
1471:
1111:
495:
264:
85:
77:
33:
logic ICs in 0.3" wide 14-pin plastic DIP packages (DIP14N), also known as PDIP (Plastic DIP)
96:. Increasingly complex circuits required more signal and power supply leads (as observed in
1672:
1487:
1370:
1163:
709:
587:
365:
330:
284:
172:
128:
8:
1429:
1152:
260:
708:
processors may be most familiar with these PGA packages, which were often inserted into
192:(RTC) modules which contained an IC chip and a non-replaceable 10-year lithium battery.
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1446:
164:
93:
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1385:
1057:
1047:
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929:
886:
865:
845:
817:
506:
175:
1026:
789:" in the context of switches. Another phrase used is D.N.C. (for "Do not connect").
134:
Variations of the DIP package include those with only a single row of pins, e.g. a
61:
785:
The abbreviation N.C. (for "Not connected" or "No connect") is also used to mean "
1461:
1414:
1404:
786:
705:
672:
189:
471:
Several DIP variants for ICs exist, mostly distinguished by packaging material:
463:
Several PDIPs and CERDIPs. The large CERDIP in the foreground is an NEC 8080AF (
1598:
1419:
751:
694:
641:
488:– A denser version of the PDIP with a 0.07 in (1.778 mm) lead pitch.
444:
437:
217:
207:
97:
37:
1661:
1061:
637:
605:
306:
0.3" wide DIP sockets with dual-wipe contacts for 16-, 14-, and 8-pin DIP ICs
1575:
725:
101:
969:
Integrated circuit, hybrid, and multichip module package design guidelines
1080:
713:
656:
529:
416:
26:
566:
is useful for such applications as audio power amplifiers, for example.
1566:
730:
645:
464:
420:
reliably for decades with reasonable care in a controlled environment.
245:
226:
196:
168:
156:
123:
53:
1451:
946:
913:
601:
510:
425:
318:
0.3" wide 16-pin DIP socket with machined round contacts for DIP16 IC
249:
151:
1534:
378:
1646:
1641:
1636:
1631:
1626:
1621:
1616:
1611:
745:
408:
390:
Dual in-line (DIP) integrated circuit metal tape base with contacts
535:
361:
494:– Sometimes used to refer to a "narrow" 0.300 in. (or 300
386:
167:(ICs). Other devices in DIP packages include resistor networks,
1260:
1248:
1230:
1218:
1146:
1134:
612:
608:
of neighbouring solder pads on DIL chips was an issue at times,
539:
Package sample for single in-line package (SIP or SIL) devices
1212:
1206:
1200:
1194:
1120:
698:
625:
502:
334:
256:
179:
41:
926:
Microelectronics
Packaging Handbook: Semiconductor packaging
924:
Rao R. Tummala, Eugene J. Rymaszewski, Alan G. Klopfenstein
1188:
1182:
1176:
579:
514:
229:
because of how easily they can be inserted and used there.
459:
756:
556:
404:
574:
333:(ZIF) socket for 0.6" wide DIP28W IC, commonly used on
980:
443:
A large DIP package (such as the DIP64 used for the
19:"PDIP" redirects here. The term may also refer to
651:
188:Dallas Semiconductor manufactured integrated DIP
1659:
611:QIL also increased the possibility of running a
155:An operating prototyped circuit on a solderless
178:and bar graph displays, and electromechanical
1550:
1096:
1076:DIP packages documentation, photos and videos
741:List of integrated circuit package dimensions
476:Ceramic dual in-line package (CERDIP or CDIP)
671:Leads are skipped on some DIP devices (e.g.
624:Commonly found DIP packages that conform to
440:, were introduced (around the early 1980s).
382:Side view of a dual in-line package (DIP) IC
492:Skinny dual in-line package (SDIP or SPDIP)
486:Shrink plastic dual in-line package (SPDIP)
1557:
1543:
1498:List of integrated circuit packaging types
1110:
1103:
1089:
985:(3rd ed.). McGraw-Hill. p. 42.
748:(a larger 19-pin DIP, introduced in 1967)
619:
368:8-bit microcontroller in DIP28N IC socket
981:Kang, Sung-Mo; Leblebici, Yusuf (2002).
902:Computer Museum retrieved April 16, 2008
860:Jackson, Kenneth.A.; Schröter, Wolfgang
655:
573:
534:
458:
385:
377:
206:
150:
56:with 0.3" wide 16-pin (DIP16N) footprint
47:
36:
25:
1155:(SOD-123 / SOD-323 / SOD-523 / SOD-923)
974:
21:Indonesian Democratic Party of Struggle
1660:
1564:
1538:
1084:
1041:
957:from the original on August 18, 2021.
883:Electronic Inventions and Discoveries
842:Electronic Inventions and Discoveries
779:
862:Handbook of Semiconductor Technology
432:plant codes, or stepping ID codes.)
16:Type of electronic component package
481:Plastic dual in-line package (PDIP)
146:
13:
1035:
914:http://www.microchip.com/packaging
660:Pin numbering is counter-clockwise
283:equipment or EPROM programmers, a
107:A DIP is usually referred to as a
14:
1684:
1069:
523:
1010: This article incorporates
1005:
983:CMOS digital integrated circuits
354:
342:
323:
311:
299:
242:small-outline integrated circuit
1023:General Services Administration
582:-based microcontroller in a QIP
569:
373:
141:
1137:(DO-7 / DO-26 / DO-35 / DO-41)
961:
947:"Single-in-Line Package (SIP)"
939:
918:
906:
895:
875:
864:, John Wiley & Sons, 2000
854:
834:
803:
682:
652:Orientation and lead numbering
278:DIPs can be mounted either by
255:For programmable devices like
1:
796:
411:tight seal to protect the IC
1527:in transistor packages, etc.
1493:Integrated circuit packaging
592:The QIP, sometimes called a
467:-compatible) microprocessor.
78:electronic component package
7:
844:(2nd ed)., Pergamon Press,
719:
454:
273:
238:plastic leaded chip carrier
163:DIPs are commonly used for
10:
1689:
585:
564:multi-leaded power package
527:
18:
1597:
1573:
1521:
1480:
1428:
1397:
1360:
1304:
1288:
1162:
1118:
912:For instance, Microchip:
600:It allowed more reliable
1508:Surface-mount technology
772:
762:Surface-mount technology
528:Not to be confused with
234:surface-mount technology
1513:Through-hole technology
885:2nd ed. Pergamon Press
767:Zig-zag in-line package
236:(SMT) packages such as
202:
1143:(MELF / SOD-80 / LL34)
1112:Semiconductor packages
1018:Federal Standard 1037C
1012:public domain material
736:Flatpack (electronics)
673:segmented LED displays
661:
620:Lead count and spacing
583:
545:single in-line package
540:
468:
391:
383:
287:socket would be used.
280:through-hole soldering
212:
160:
57:
45:
34:
1503:Printed circuit board
659:
577:
538:
511:one-time programmable
462:
389:
381:
265:In-System Programming
210:
154:
86:printed circuit board
51:
40:
29:
1488:Electronic packaging
588:Quad in-line package
331:Zero insertion force
285:zero insertion force
129:zero insertion force
82:through-hole mounted
66:dual in-line package
165:integrated circuits
94:integrated circuits
1525:voltage regulators
1044:Packaging Databook
967:Pecht, M. (1994).
811:"see for instance"
662:
584:
541:
469:
392:
384:
364:UNO R2 board with
213:
161:
58:
46:
35:
1655:
1654:
1532:
1531:
1281:(Super-247) (SMT)
1275:(Super-220) (SMT)
1149:(SMA / SMB / SMC)
928:, Springer, 1997
507:ultraviolet light
131:(ZIF) mechanism.
1680:
1559:
1552:
1545:
1536:
1535:
1105:
1098:
1091:
1082:
1081:
1065:
1031:
1030:
1025:. Archived from
1009:
1008:
997:
996:
978:
972:
965:
959:
958:
943:
937:
922:
916:
910:
904:
899:
893:
879:
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858:
852:
838:
832:
831:
829:
828:
822:
816:. Archived from
815:
807:
790:
783:
358:
346:
327:
315:
303:
147:Types of devices
62:microelectronics
1688:
1687:
1683:
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1476:
1424:
1393:
1356:
1300:
1284:
1158:
1114:
1109:
1072:
1054:
1046:. Mcgraw-Hill.
1038:
1036:Further reading
1015:
1006:
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993:
979:
975:
966:
962:
945:
944:
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923:
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896:
881:Dummer, G.W.A.
880:
876:
859:
855:
840:Dummer, G.W.A.
839:
835:
826:
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820:
813:
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793:
787:Normally closed
784:
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457:
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205:
190:real-time clock
149:
144:
24:
17:
12:
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5:
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1481:Related topics
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1347:TSSOP / HTSSOP
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1070:External links
1068:
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1042:Intel (1996).
1037:
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1029:on 2022-01-22.
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752:Pin grid array
749:
743:
738:
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728:
721:
718:
695:Pin grid array
684:
681:
653:
650:
642:Motorola 68000
621:
618:
617:
616:
609:
586:Main article:
571:
568:
525:
524:Single in-line
522:
500:
499:
489:
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445:Motorola 68000
375:
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337:IC programmers
329:
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292:point-to-point
275:
272:
218:wave soldering
204:
201:
148:
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140:
136:resistor array
52:Eight-contact
15:
9:
6:
4:
3:
2:
1685:
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1669:
1668:Chip carriers
1666:
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1263:(D2PAK) (SMT)
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1257:(I2PAK) (SMT)
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1024:
1020:
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1013:
1003:
1002:
994:
992:0-07-246053-9
988:
984:
977:
971:. Wiley-IEEE.
970:
964:
956:
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942:
935:
934:0-412-08441-4
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891:0-08-022730-9
888:
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871:
870:3-527-29835-5
867:
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850:0-08-022730-9
847:
843:
837:
823:on 2020-09-30
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638:not connected
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125:
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105:
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102:chip carriers
99:
95:
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83:
79:
75:
71:
67:
63:
55:
50:
43:
39:
32:
28:
22:
1583:
1472:WL-CSP / WLP
1342:TSOP / HTSOP
1316:
1251:(DPAK) (SMT)
1245:(IPAK) (SMT)
1239:(TH / Panel)
1233:(TH / Panel)
1227:(TH / Panel)
1221:(TH / Panel)
1209:(TH / Panel)
1179:(TH / Panel)
1043:
1027:the original
1017:
982:
976:
963:
950:
941:
925:
920:
908:
897:
882:
877:
861:
856:
841:
836:
825:. Retrieved
818:the original
805:
781:
726:Chip carrier
714:motherboards
693:
686:
677:
670:
667:
663:
634:
631:
623:
593:
591:
570:Quad in-line
561:
552:
548:
544:
542:
519:
501:
491:
485:
480:
475:
470:
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442:
434:
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422:
397:
393:
374:Construction
289:
277:
269:
254:
231:
214:
194:
187:
184:
169:DIP switches
162:
142:Applications
133:
121:
115:
110:
108:
106:
73:
69:
65:
59:
1673:CPU sockets
1567:CPU sockets
1390:QUIP / QUIL
712:sockets on
683:Descendants
594:QIL package
578:A Rockwell
553:SIL package
530:SIPP memory
417:hermeticity
240:(PLCC) and
98:Rent's rule
31:4000-series
1662:Categories
1607:486 Socket
1398:Grid array
1337:SOP / SSOP
1289:Single row
1172:SOT / TSOT
827:2010-01-02
797:References
731:DIP switch
646:Zilog Z180
465:Intel 8080
426:bond wires
366:ATmega328P
246:stripboard
227:breadboard
157:breadboard
124:lead frame
54:DIP switch
1452:Flip Chip
1371:QIP / QIL
1332:SO / SOIC
1322:Flat Pack
1317:DIP / DIL
1296:SIP / SIL
1164:3...5-pin
1062:906673879
872:page 610
602:soldering
250:perfboard
176:segmented
90:Fairchild
1647:Socket 8
1642:Socket 7
1637:Socket 6
1632:Socket 5
1627:Socket 4
1622:Socket 3
1617:Socket 2
1612:Socket 1
1576:packages
1361:Quad row
1305:Dual row
955:Archived
936:page 395
746:NORBIT 2
720:See also
701:through
606:bridging
455:Variants
409:moisture
274:Mounting
114:, where
76:) is an
1131:(DO-27)
1119:Single
951:EE Semi
706:Pentium
362:Arduino
1574:Other
1565:Early
1279:TO-274
1273:TO-273
1267:TO-268
1261:TO-263
1255:TO-262
1249:TO-252
1243:TO-251
1237:TO-247
1231:TO-220
1225:TO-202
1219:TO-126
1147:DO-214
1141:DO-213
1135:DO-204
1129:DO-201
1060:
1050:
989:
932:
889:
868:
848:
613:copper
503:EPROMs
257:EPROMs
197:header
180:relays
1430:Wafer
1213:TO-92
1207:TO-66
1201:TO-39
1195:TO-18
1121:diode
1014:from
821:(PDF)
814:(PDF)
773:Notes
699:80286
626:JEDEC
335:EPROM
84:to a
42:EPROM
1599:PGAs
1589:PLCC
1467:UICC
1410:eWLB
1376:PLCC
1327:MSOP
1215:(TH)
1203:(TH)
1197:(TH)
1191:(TH)
1189:TO-8
1185:(TH)
1183:TO-5
1177:TO-3
1058:OCLC
1048:ISBN
987:ISBN
930:ISBN
887:ISBN
866:ISBN
846:ISBN
689:SOIC
687:The
644:and
580:6502
515:BIOS
438:PGAs
407:and
401:SOIC
261:GALs
259:and
248:and
203:Uses
195:DIP
64:, a
1584:DIP
1457:PoP
1447:CSP
1443:COG
1440:COF
1437:COB
1420:PGA
1415:LGA
1405:BGA
1386:QFP
1381:QFN
1367:LCC
1352:ZIP
1312:DFN
1153:SOD
757:QFP
710:ZIF
557:RAM
551:or
549:SIP
496:mil
413:die
405:air
173:LED
109:DIP
74:DIL
72:or
70:DIP
60:In
1664::
1462:QP
1056:.
1021:.
953:.
949:.
703:P5
543:A
182:.
171:,
1558:e
1551:t
1544:v
1104:e
1097:t
1090:v
1064:.
995:.
830:.
547:(
532:.
116:n
111:n
68:(
23:.
Text is available under the Creative Commons Attribution-ShareAlike License. Additional terms may apply.
