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36:
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Mechanical stress issues can be overcome by bonding the devices to the board through a process called "underfilling", which injects an epoxy mixture under the device after it is soldered to the PCB, effectively gluing the BGA device to the PCB. There are several types of underfill materials in use
429:
During development it is not practical to solder BGAs into place, and sockets are used instead, but tend to be unreliable. There are two common types of socket: the more reliable type has spring pins that push up under the balls, although it does not allow using BGAs with the balls removed as the
399:) and re-installed on the circuit board. Pre-configured solder balls matching the array pattern can be used to reball BGAs when only one or a few need to be reworked. For higher volume and repeated lab work, a stencil-configured vacuum-head pick-up and placement of loose spheres can be used.
180:. The whole bottom surface of the device can be used, instead of just the perimeter. The traces connecting the package's leads to the wires or balls which connect the die to package are also on average shorter than with a perimeter-only type, leading to better performance at high speeds.
445:
Expensive equipment is required to reliably solder BGA packages; hand-soldering BGA packages is very difficult and unreliable, usable only for the smallest packages in the smallest quantities. However, as more ICs have become available only in leadless (e.g.
350:" problems as well as their decreased reliability versus lead-based solder BGAs in extreme operating conditions such as high temperature, high thermal shock and high gravitational force environments, in part due to lower ductility of RoHS-compliant solders.
299:, a property which causes unwanted distortion of signals in high-speed electronic circuits. BGAs, with their very short distance between the package and the PCB, have low lead inductances, giving them superior electrical performance to pinned devices.
720:
Mobile
Celeron. Micro-FCBGA has 479 balls that are 0.78 mm in diameter. The processor is affixed to the motherboard by soldering the balls to the motherboard. This is thinner than a pin grid array socket arrangement, but is not removable.
361:
Another solution to non-compliant connections is to put a "compliant layer" in the package that allows the balls to physically move in relation to the package. This technique has become standard for packaging DRAMs in BGA packages.
334:
Thermal expansion issues can be overcome by matching the mechanical and thermal characteristics of the PCB to those of the package. Typically, plastic BGA devices more closely match PCB thermal characteristics than ceramic devices.
271:) packages were being produced with more and more pins, and with decreasing spacing between the pins, but this was causing difficulties for the soldering process. As package pins got closer together, the danger of accidentally
242:
causes the molten solder to hold the package in alignment with the circuit board, at the correct separation distance, while the solder cools and solidifies, forming soldered connections between the device and the PCB.
690:
methods for mounting chip dies to a carrier is sort of a BGA design derivate with the functional equivalent of the balls there being called bumps or micro bumps. This is realized at an already microscopic size level.
748:. While OEMs generally source their components from the manufacturer, or the manufacturer's distributor, the hobbyist will typically obtain BGAs on the aftermarket through electronic component brokers or
385:
machines, special microscopes, and endoscopes to look underneath the soldered package have been developed to overcome this problem. If a BGA is found to be badly soldered, it can be removed in a
1101:
287:
between the package and the PCB. This allows heat generated by the integrated circuit inside the package to flow more easily to the PCB, preventing the chip from overheating.
267:
The BGA is a solution to the problem of producing a miniature package for an integrated circuit with many hundreds of pins. Pin grid arrays and dual-in-line surface mount (
421:, and after drying, the module is pried off and the broken joins are inspected. If a solder location contains the dye, then it indicates that the connection was imperfect.
490:
appears dark blue. Here the die has been mounted to a printed circuit board substrate below it (dark yellow, also called an interposer) using flip chip and underfill.
413:
A cheaper and easier inspection method, albeit destructive, is becoming increasingly popular because it does not require special equipment. Commonly referred to as
894:
1070:"More than just digital quilting: The "maker" movement could change how science is taught and boost innovation. It may even herald a new industrial revolution"
1044:
694:
To make it easier to use ball grid array devices, most BGA packages only have balls in the outer rings of the package, leaving the innermost square empty.
1098:
1133:
728:
package) are arranged as the 6 outer rings of a 1.27 mm pitch (20 balls per inch pitch) 26x26 square grid, with the inner 14x14 region empty.
846:
494:
365:
Other techniques for increasing the board-level reliability of packages include use of low-expansion PCBs for ceramic BGA (CBGA) packages,
1027:
867:
1528:
749:
183:
Soldering of BGA devices requires precise control and is usually done by automated processes such as in computer-controlled automatic
331:
between PCB substrate and BGA (thermal stress) or flexing and vibration (mechanical stress) can cause the solder joints to fracture.
932:
1309:
1303:
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1159:
712:
For example, the "micro-FCBGA" (flip chip ball grid array) is Intel's current BGA mounting method for mobile processors that use a
816:
226:
stuck to it. These solder spheres can be placed manually or by automated equipment, and are held in place with a tacky flux. The
354:
with differing properties relative to workability and thermal transfer. An additional advantage of underfill is that it limits
222:(PCB) on which it is placed. In a BGA the pins are replaced by pads on the bottom of the package, each initially with a tiny
100:
964:
72:
1440:
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797:
323:
A disadvantage of BGAs is that the solder balls cannot flex in the way that longer leads can, so they are not mechanically
1367:
1011:
907:
79:
1554:
It is relatively common to find packages that contain other components than their designated ones, such as diodes or
1497:
1377:
119:
1048:
1362:
785:
451:
395:
and a vacuum device for lifting the package. The BGA can be replaced with a new one, or it can be refurbished (or
268:
53:
1119:
737:
86:
230:
on a PCB with copper pads in a pattern that matches the solder balls. The assembly is then heated, either in a
57:
709:
and some later
Celeron mobile processors. BGA2 is also known as FCBGA-479. It replaced its predecessor, BGA1.
402:
Due to the cost of visual X-ray BGA inspection, electrical testing is very often used instead. Very common is
1171:
283:
A further advantage of BGA packages over packages with discrete leads (i.e. packages with legs) is the lower
68:
1523:
246:
In more advanced technologies, solder balls may be used on both the PCB and the package. Also, in stacked
1406:
343:
17:
437:, with spring pinchers that grab the balls. This does not work well, especially if the balls are small.
1411:
1372:
1357:
1342:
447:
842:
895:
Solid State
Technology: BGA underfills - Increasing board-level solder joint reliability, 12/01/2001
136:
A grid array of solder balls on a printed circuit board after removal of an integrated circuit chip.
1538:
1202:
487:
1543:
1382:
227:
46:
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The 479 balls of the Micro-FCBGA package (a package almost identical to the 478-pin socketable
382:
1024:
871:
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1502:
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219:
93:
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761:
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342:
lead-free solder alloy assemblies has presented some further challenges to BGAs including "
204:
173:
1023:
Intel. "Mobile Intel
Celeron Processor (0.13 μ) in Micro-FCBGA and Micro-FCPGA Packages".
843:"Reducing Head in Pillow Defects - Head in pillow defects: causes and potential solutions"
8:
1460:
1183:
998:
1487:
1477:
820:
417:, the process includes immersing the entire PCB or just the BGA attached module into a
284:
251:
218:
which, in operation, conduct electrical signals between the integrated circuit and the
200:
165:
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1416:
328:
247:
177:
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Once the package is soldered into place, it is difficult to find soldering faults.
214:(PGA), which is a package with one face covered (or partly covered) with pins in a
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403:
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911:
868:"TEERM - TEERM Active Project - NASA-DOD Lead-Free Electronics (Project 2)"
791:
499:
392:
215:
161:
905:"CT Services - Overview." Jesse Garant & Associates. August 17, 2010.
140:
1111:
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706:
503:
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231:
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999:
Design
Requirements - Fine Pitch Ball Grid Array Package (FBGA) DR-4.27D
987:
698:
434:
366:
296:
1482:
713:
687:
483:
327:. As with all surface mount devices, bending due to a difference in
35:
455:
454:
methods have been developed using inexpensive heat sources such as
172:. A BGA can provide more interconnection pins than can be put on a
132:
702:
474:
307:
1291:
1279:
1261:
1249:
1177:
1165:
965:"BGA Soldering & Repairing / How to Solder Ball Grid Array"
581:
669:
and ultra fine ball grid array based on pitch ball grid array.
1243:
1237:
1231:
1225:
1151:
908:"Industrial Computed Tomography Scanning Services – JG&A"
572:
378:
311:
168:. BGA packages are used to permanently mount devices such as
295:
The shorter an electrical conductor, the lower its unwanted
1219:
1213:
1207:
779:
407:
391:, which is a jig fitted with infrared lamp (or hot air), a
740:(OEMs). There is also a market among electronic hobbyists
561:
technology. It has thinner contacts and is mainly used in
424:
195:
27:
Surface-mount packaging that uses an array of solder balls
533:
lastic substrate material to which the array is attached.
418:
369:
between the package and PCB, and re-packaging a device.
705:
mobile processors. BGA2 is Intel's package for their
681:: very very thin profile fine pitch ball grid array
60:. Unsourced material may be challenged and removed.
254:) solder balls are used to connect two packages.
1567:
809:
716:binding technology. It was introduced with the
697:Intel used a package designated BGA1 for their
1127:
988:Sparkfun tutorials: Reflow skillet, July 2006
938:. cascade-eng.com. 2013-11-22. Archived from
653:: thermally enhanced plastic ball grid array
890:
888:
617:: multi-chip module plastic ball grid array
372:
1529:List of integrated circuit packaging types
1141:
1134:
1120:
120:Learn how and when to remove this message
885:
605:: low-profile fine-pitch ball grid array
502:BGA package; this package has an Nvidia
493:
473:
306:
194:
144:Cross-cut section of BGA mounted circuit
139:
131:
1186:(SOD-123 / SOD-323 / SOD-523 / SOD-923)
794:: chip packaging and package types list
425:Difficulties during circuit development
290:
14:
1568:
545:: very thin chip array ball grid array
1115:
840:
318:
798:Embedded wafer level ball grid array
440:
58:adding citations to reliable sources
29:
962:
24:
1012:"The Secrets of PC Memory: Part 2"
933:"Dye and Pry of BGA Solder Joints"
817:"Soldering 101 - A Basic Overview"
593:: flip chip molded ball grid array
278:
25:
1587:
1083:
744:such as the increasingly popular
675:: very fine pitch ball grid array
557:: fine ball grid array based on
539:: thin chip array ball grid array
870:. Teerm.nasa.gov. Archived from
786:Small-outline integrated circuit
738:original equipment manufacturers
659:or thin and fine ball grid array
329:coefficient of thermal expansion
302:
275:adjacent pins with solder grew.
34:
1062:
1037:
1017:
1004:
849:from the original on 2013-12-03
450:) or BGA packages, various DIY
262:
45:needs additional citations for
1168:(DO-7 / DO-26 / DO-35 / DO-41)
992:
981:
956:
925:
899:
860:
834:
736:Primary end-users of BGAs are
731:
486:BGA2 package (FCBGA-479); the
430:spring pins may be too short.
210:The BGA is descended from the
190:
13:
1:
803:
599:: low-profile ball grid array
406:testing using an IEEE 1149.1
257:
1558:in transistor packages, etc.
1524:Integrated circuit packaging
515:: chip array ball grid array
433:The less reliable type is a
7:
963:Das, Santosh (2019-08-22).
755:
469:
10:
1592:
1108:from J-Devices Corporation
623:: New Fine Ball Grid Array
584:. Not to be confused with
569:fine pitch ball grid array
551:: die-size ball grid array
448:quad-flat no-leads package
1552:
1511:
1459:
1428:
1391:
1335:
1319:
1193:
1149:
1045:"FCBGA-479 (Micro-FCBGA)"
629:: plastic ball grid array
346:" soldering phenomenon, "
1539:Surface-mount technology
1099:PBGA Package Information
1090:PBGA Package Information
373:Difficulty of inspection
1544:Through-hole technology
635:: super ball grid array
611:: micro ball grid array
338:The predominant use of
1174:(MELF / SOD-80 / LL34)
1143:Semiconductor packages
507:
491:
383:industrial CT scanning
315:
207:
145:
137:
1534:Printed circuit board
1001:, jedec.org, MAR 2017
841:Alpha (2010-03-15) .
686:Effectively also the
497:
477:
310:
238:, melting the balls.
220:printed circuit board
198:
143:
135:
1519:Electronic packaging
762:Dual in-line package
742:do it yourself (DIY)
291:Low-inductance leads
54:improve this article
969:Electronics and You
780:Thin quad flat pack
166:integrated circuits
1556:voltage regulators
1104:2019-01-02 at the
1030:2014-03-18 at the
508:
492:
319:Lack of compliance
316:
285:thermal resistance
252:package on package
248:multi-chip modules
208:
146:
138:
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1312:(Super-247) (SMT)
1306:(Super-220) (SMT)
1180:(SMA / SMB / SMC)
464:electric skillets
441:Cost of equipment
130:
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69:"Ball grid array"
16:(Redirected from
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1094:Amkor Technology
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819:. Archived from
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641:: tape array BGA
563:system-on-a-chip
228:device is placed
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458:, and domestic
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279:Heat conduction
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240:Surface tension
236:infrared heater
203:assembled on a
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170:microprocessors
156:) is a type of
150:ball grid array
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1076:. Dec 3, 2011.
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480:Mobile Celeron
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255:
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217:
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206:
205:Memory module
202:
197:
188:
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181:
179:
175:
171:
167:
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160:packaging (a
159:
158:surface-mount
155:
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121:
113:
102:
99:
95:
92:
88:
85:
81:
78:
74:
71: –
70:
66:
65:Find sources:
59:
55:
49:
48:
43:This article
41:
37:
32:
31:
19:
1503:WL-CSP / WLP
1435:
1373:TSOP / HTSOP
1282:(DPAK) (SMT)
1276:(IPAK) (SMT)
1270:(TH / Panel)
1264:(TH / Panel)
1258:(TH / Panel)
1252:(TH / Panel)
1240:(TH / Panel)
1210:(TH / Panel)
1073:
1064:
1053:. Retrieved
1049:the original
1039:
1019:
1006:
994:
983:
972:. Retrieved
968:
958:
947:. Retrieved
940:the original
927:
916:. Retrieved
912:the original
901:
876:. Retrieved
872:the original
862:
851:. Retrieved
836:
825:. Retrieved
821:the original
811:
792:Chip carrier
750:distributors
735:
723:
717:
711:
696:
693:
685:
678:
672:
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568:
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548:
542:
536:
530:
526:
522:
518:
512:
444:
432:
428:
412:
401:
396:
393:thermocouple
386:
376:
364:
360:
352:
337:
333:
322:
294:
282:
266:
263:High density
245:
216:grid pattern
209:
185:reflow ovens
182:
178:flat package
174:dual in-line
162:chip carrier
153:
149:
147:
116:
107:
97:
90:
83:
76:
64:
52:Please help
47:verification
44:
1421:QUIP / QUIL
732:Procurement
726:micro-FCPGA
707:Pentium III
525:denote the
504:GeForce 256
415:dye and pry
367:interposers
356:tin whisker
232:reflow oven
224:solder ball
191:Description
164:) used for
18:Micro-FCBGA
1429:Grid array
1368:SOP / SSOP
1320:Single row
1203:SOT / TSOT
1055:2011-12-20
974:2021-09-07
949:2014-03-22
918:2010-11-24
878:2014-03-21
853:2018-06-18
827:2010-12-29
804:References
718:Coppermine
701:and early
699:Pentium II
647:: thin BGA
529:eramic or
435:ZIF socket
381:machines,
297:inductance
258:Advantages
80:newspapers
1483:Flip Chip
1402:QIP / QIL
1363:SO / SOIC
1353:Flat Pack
1348:DIP / DIL
1327:SIP / SIL
1195:3...5-pin
1025:Datasheet
714:flip chip
688:flip chip
565:designs;
500:wire bond
498:Inside a
484:flip-chip
456:heat guns
325:compliant
234:or by an
1570:Category
1392:Quad row
1336:Dual row
1102:Archived
1028:Archived
847:Archived
756:See also
615:MCM-PBGA
470:Variants
397:reballed
358:growth.
273:bridging
1162:(DO-27)
1150:Single
1034:. 2002.
1014:. 2007.
703:Celeron
94:scholar
1310:TO-274
1304:TO-273
1298:TO-268
1292:TO-263
1286:TO-262
1280:TO-252
1274:TO-251
1268:TO-247
1262:TO-220
1256:TO-202
1250:TO-126
1178:DO-214
1172:DO-213
1166:DO-204
1160:DO-201
788:(SOIC)
782:(TQFP)
651:TEPBGA
591:FCmBGA
582:Altera
478:Intel
452:reflow
410:port.
314:of BGA
96:
89:
82:
75:
67:
1461:Wafer
1244:TO-92
1238:TO-66
1232:TO-39
1226:TO-18
1152:diode
1092:from
943:(PDF)
936:(PDF)
845:. 3.
776:(LGA)
770:(PGA)
764:(DIP)
679:WFBGA
673:VFBGA
663:UFBGA
657:TFBGA
639:TABGA
621:nFBGA
603:LFBGA
573:JEDEC
549:DSBGA
543:CVBGA
537:CTBGA
513:CABGA
482:in a
379:X-ray
312:X-ray
101:JSTOR
87:books
1498:UICC
1441:eWLB
1407:PLCC
1358:MSOP
1246:(TH)
1234:(TH)
1228:(TH)
1222:(TH)
1220:TO-8
1216:(TH)
1214:TO-5
1208:TO-3
667:UBGA
665:and
645:TBGA
627:PBGA
609:MBGA
597:LBGA
555:FBGA
523:PBGA
521:and
519:CBGA
462:and
408:JTAG
269:SOIC
199:BGA
73:news
1488:PoP
1478:CSP
1474:COG
1471:COF
1468:COB
1451:PGA
1446:LGA
1436:BGA
1417:QFP
1412:QFN
1398:LCC
1383:ZIP
1343:DFN
1184:SOD
580:by
506:GPU
488:die
419:dye
250:, (
201:ICs
176:or
154:BGA
56:by
1572::
1493:QP
1072:.
967:.
887:^
752:.
466:.
187:.
148:A
1135:e
1128:t
1121:v
1058:.
977:.
952:.
921:.
881:.
856:.
830:.
571:(
531:p
527:c
152:(
123:)
117:(
112:)
108:(
98:·
91:·
84:·
77:·
50:.
20:)
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