164:, an area where the environment is controlled to eliminate all dust, since even a single speck can ruin a microcircuit, which has nanoscale features much smaller than dust particles. The clean room must also be damped against vibration to enable nanometer-scale alignment of machines and must be kept within narrow bands of temperature and humidity. Vibration control may be achieved by using deep piles in the cleanroom's foundation that anchor the cleanroom to the bedrock, careful selection of the construction site, and/or using vibration dampers. Controlling temperature and humidity is critical for minimizing
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252:, is sponsoring the "300 mm Prime" initiative. An important goal of this initiative is to enable fabs to produce greater quantities of smaller chips as a response to shorter lifecycles seen in consumer electronics. The logic is that such a fab can produce smaller lots more easily and can efficiently switch its production to supply chips for a variety of new electronic devices. Another important goal is to reduce the waiting time between processing steps.
231:, so each process step is being performed on more and more chips at once. The goal is to spread production costs (chemicals, fab time) over a larger number of saleable chips. It is impossible (or at least impracticable) to retrofit machinery to handle larger wafers. This is not to say that foundries using smaller wafers are necessarily obsolete; older foundries can be cheaper to operate, have higher yields for simple chips and still be productive.
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168:. Corona discharge sources can also be used to reduce static electricity. Often, a fab will be constructed in the following manner (from top to bottom): the roof, which may contain air handling equipment that draws, purifies and cools outside air, an air plenum for distributing the air to several floor-mounted
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Typically an advance in chip-making technology requires a completely new fab to be built. In the past, the equipment to outfit a fab was not very expensive and there were a huge number of smaller fabs producing chips in small quantities. However, the cost of the most up-to-date equipment has since
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machines. All these devices are extremely precise and thus extremely expensive. Prices for most common pieces of equipment for the processing of 300 mm wafers range from $ 700,000 to upwards of $ 4,000,000 each with a few pieces of equipment reaching as high as $ 340,000,000 each (e.g.
224:. However, for companies with more limited product lines, it is often best to either rent out the fab, or close it entirely. This is due to the tendency of the cost of upgrading an existing fab to produce devices requiring newer technology to exceed the cost of a completely new fab.
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Another side effect of the cost has been the challenge to make use of older fabs. For many companies these older fabs are useful for producing designs for unique markets, such as
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Additionally, there is a large push to completely automate the production of semiconductor chips from beginning to end. This is often referred to as the "
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The industry was aiming to move from the state-of-the-art wafer size 300 mm (12 in) to 450 mm by 2018. In March 2014,
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The clean room is where all fabrication takes place and contains the machinery for integrated circuit production such as
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manufacturing facility in Taiwan. The same company estimations suggest that their future fab might cost $ 20 billion. A
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Fabs require many expensive devices to function. Estimates put the cost of building a new fab at over one billion
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expected 450 mm deployment by 2020. But in 2016, corresponding joint research efforts were stopped.
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Mutschler, Ann
Steffora (2008). "Pure-play foundries comprise 84% of market, IC Insights says".
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The
International Sematech Manufacturing Initiative (ISMI), an extension of the US consortium
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149:(IDMs). Companies that farmed out manufacturing of their designs to foundries were termed
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Please help update this article to reflect recent events or newly available information.
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Parts of this article (those related to the current state of the art) need to be
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emerged in the 1990s: Foundries that produced their own designs were known as
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Fab 1 in
Dresden, Germany. The large rectangles house large cleanrooms.
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Chips and change : how crisis reshapes the semiconductor industry
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grown to the point where a new fab can cost several billion dollars.
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scanners). A typical fab will have several hundred equipment items.
535:(McGraw–Hill Handbooks) by Hwaiyu Geng (hardcover – April 27, 2005)
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Handbook of
Semiconductor Manufacturing Technology, Second Edition
350:"TSMC says 3nm plant could cost it more than $ 20bn - TheINQUIRER"
529:(Essential Guide Series) by Jim Turley (paperback – Dec 29, 2002)
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by Gary S. May and Costas J. Spanos (hardcover – May 22, 2006)
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by
Michael Quirk and Julian Serda (paperback – Nov 19, 2000)
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by Robert
Doering and Yoshio Nishi (Hardcover – Jul 9, 2007)
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for the business aspects of foundries and fabless companies
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with values as high as $ 3–4 billion not being uncommon.
441:"Intel says 450 mm will deploy later in decade"
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Photo of the interior of a clean room of a 300mm fab
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International
Technology Roadmap for Semiconductors
27:Factory where integrated circuits are manufactured
467:"With 450mm on Ice, 300mm Shoulders Heavier Load"
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330:Begins Construction on Gigafab In Central Taiwan
356:. Archived from the original on 12 October 2017
227:There has been a trend to produce ever larger
309:(1st ed.). Cambridge, Mass.: MIT Press.
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543:https://www.einnosys.com/fab-automation/
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268:List of semiconductor fabrication plants
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515:Semiconductor Manufacturing Technology
527:The Essential Guide to Semiconductors
533:Semiconductor Manufacturing Handbook
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303:Brown, Clair; Linden, Greg (2011).
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540:Semiconductor fabrication software
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553:"Chip Makers Watch Their Waste",
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503:References
451:2014-05-31
273:Rock's law
162:clean room
472:3 January
445:Archived
421:Archived
370:cite web
360:26 April
333:Archived
256:See also
250:SEMATECH
177:steppers
204:History
185:etching
116:foundry
102:In the
93:run by
45:updated
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229:wafers
220:, and
193:dicing
189:doping
290:Notes
236:Intel
139:wafer
135:Fab15
474:2021
376:link
362:2018
311:ISBN
191:and
131:TSMC
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18:Fabs
198:EUV
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