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On the basis of the IDT Centaur acquisition, VIA appears to have come into possession of at least three patents, which cover key aspects of processor technology used by Intel. On the basis of the negotiating leverage these patents offered, in 2003 VIA arrived at an agreement with Intel that allowed
387:
Because the embedded system marketplace prefers low-power, low-cost CPU designs, VIA began targeting this segment more aggressively because the C3 fit those traits rather well. Centaur
Technology concentrated on adding features attractive to the embedded marketplace. An example built into the first
344:
The VIA C3 processor continued an emphasis on minimizing power consumption with the next die shrink to a mixed 130/150 nm process. "Ezra" (C5C) and "Ezra-T" (C5N) were only new revisions of the "Samuel 2" core with some minor modifications to the bus protocol of "Ezra-T" to match compatibility
365:. The number of pipeline stages was increased from 12 to 16, to allow for continued increases in clock speed. Additionally, it implemented the cmov instruction, making it a 686-class processor. The Linux kernel refers to this core as the C3-2. It also removes
407:. At the time VIA also boosted the FSB to 200 MHz and introduced new chipsets such as the CN400 to support it. The new 200 MHz FSB chips are only available in BGA packages, as they are not compatible with existing Socket 370 motherboards.
360:
The "Nehemiah" (C5XL) was a major core revision. At the time, VIA's marketing efforts did not fully reflect the changes that had taken place. The company addressed numerous design shortcomings of the older cores, including the half-speed
500:
advocates, who stated a smaller set of instructions, better optimized, would deliver faster overall CPU performance. As it makes heavy use of memory operands, both as source and destination, the C3 design itself cannot qualify as RISC
485:
The pipeline is arranged to provide one-clock execution of the heavily used register–memory and memory–register forms of x86 instructions. Several frequently used instructions require fewer pipeline clocks than on other x86
536:
for a ten-year patent cross license, enabling VIA to continue to design and manufacture x86 compatible CPUs. VIA was also granted a three-year period of grace in which it could continue to use Intel socket infrastructure.
481:
are deliberately not implemented, because they impact the ability to increase the clock rate, require a lot of extra die space and power, and have little impact on performance in several common application
345:
with Intel's
Pentium III "Tualatin" cores. VIA enjoyed the lowest power usage in the x86 CPU market for several years. Performance, however, fell behind due to the lack of improvements to the design.
392:. (These generators are falsely stated to be “quantum-based” in VIA's marketing literature. Detailed analysis of the generator makes it clear that the source of randomness is thermal, not quantum.)
434:, both in absolute terms and on a clock-for-clock basis, VIA's chips were much smaller, cheaper to manufacture, and lower power. This made them highly attractive in the embedded marketplace.
341:
technology at all, the new name was just a logical step. To improve power consumption and reduce manufacturing costs, Samuel 2 was produced with 150 nm process technology.
648:
527:. These and other high volume industrial applications are starting to generate big profits for VIA as the small form factor and low power advantages close embedded deals.
437:
This also enabled VIA to continue to scale the frequencies of their chips with each manufacturing process die shrink, while competitive products from Intel (such as the
474:, among other enhancements. While these features are not unique to VIA, memory access optimization is one area where they have not dropped features to save die space.
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and emulated. This saves die space and reduces power consumption. The impact upon the majority of real-world application scenarios is minimized.
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Clock frequency is in general terms favored over increasing instructions per cycle. Complex features such as
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The "Nehemiah+" (C5P) (stepping 8) revision brought a few more advancements, including a high-performance
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Because memory performance is the limiting factor in many benchmarks, VIA processors implement large
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was renamed VIA C3 with the switch to the advanced "Samuel 2" (C5B) core. The addition of an on-die
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VIA's embedded platform products have reportedly (2005) been adopted in Nissan's car series, the
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https://web.archive.org/web/20060615180950/http://www.sandpile.org/impl/c5xl.htm
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https://web.archive.org/web/20070717014946/http://www.sandpile.org/impl/c5.htm
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When this architecture was marketed it was often referred to as the "VIA C5".
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441:) encountered severe thermal management issues, although the later
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Family of x86 central processing units for personal computers
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649:"Evaluation of VIA C3 "Nehemiah" Random Number Generator"
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These design guidelines are derivative from the original
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allowing lower-level access to the CPU and in some cases
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improved performance somewhat. As it was not built upon
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Infrequently used x86 instructions are implemented in
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A sub-notebook utilising a VIA Nehemiah C3 processor
766:
GHz_processor_review/ VIA C3 1 GHz
Processor Review
309:instructions, VIA C3 CPUs contain an undocumented
298:. The different CPU cores are built following the
958:
691:"VIA and Intel Settle Patent Infringement Cases"
576:"Hacker Finds Hidden 'God Mode' on Old x86 CPUs"
445:generation of chips were substantially cooler.
818:
399:encryption engine along with a notably small
373:. However, it was still based upon the aging
348:Uniquely, the retail C3 CPU shipped inside a
679:The Inquirer report, Friday 30 December 2005
654:. Cryptography Research, Inc. Archived from
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771:BlueSmoke - Review : VIA C3 Processor
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25:
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426:While slower than x86 CPUs being sold by
605:, Digit-Life, accessed January 15, 2007.
603:VIA Cyrix III (Samuel 2) 600 and 667 MHz
452:
417:
300:design methodology of Centaur Technology
693:. VIA Technologies, Inc. Archived from
608:
369:instructions in favour of implementing
977:Computer-related introductions in 2001
959:
719:Diefendorff, Keith (7 December 1998).
617:
806:
761:VIA's Small & Quiet Eden Platform
413:
388:"Nehemiah" (C5XL) core were the twin
967:VIA Technologies x86 microprocessors
832:
13:
711:
479:out-of-order instruction execution
14:
988:
744:
730:. MDR Electronic Publishing Group
574:Wagenseil, Paul (9 August 2018).
390:hardware random number generators
355:
776:http://www.cpushack.com/VIA.html
551:List of VIA Eden microprocessors
102:64 KiB instruction + 64 KiB data
530:
115:Architecture and classification
721:"WinChip 4 Thumbs Nose at ILP"
683:
672:
641:
595:
567:
546:List of VIA C3 microprocessors
170:(RNG, Nehemiah; AES Nehemiah+)
1:
618:Rutter, Daniel (2011-12-03).
561:
510:
86:100 MHz to 200 MHz
75:500 MHz to 1.4 GHz
7:
620:"Review: 800MHz Via C3 CPU"
556:List of VIA microprocessors
539:
505:
403:chip package the size of a
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218:Products, models, variants
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881:
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791:VIA C3 Kernel for FreeBSD
311:Alternate Instruction Set
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972:Embedded microprocessors
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284:central processing units
756:VIA C3 Gold CPU - 1 GHz
601:Poluvyalov, Alexander.
326:Samuel 2 and Ezra cores
178:Physical specifications
751:VIA-C3-Nehemiah review
458:
423:
384:at just 133 MHz.
728:Microprocessor Report
456:
448:
421:
315:privilege escalation
131:Instruction set
121:Technology node
282:is a family of x86
47:Common manufacturer
34:General information
21:
935:Centaur Technology
796:2011-07-23 at the
459:
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414:Design methodology
292:Centaur Technology
288:personal computers
125:0.13 ÎĽm to 0.15 ÎĽm
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470:, and aggressive
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834:VIA Technologies
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626:. Archived from
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379:single data rate
296:VIA Technologies
110:64 KiB exclusive
29:
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848:Microprocessors
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798:Wayback Machine
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712:Further reading
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457:VIA C3, 800 MHz
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401:ball grid array
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305:In addition to
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244:Nehemiah+ (C5P)
241:Nehemiah (C5XL)
223:Core names
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899:VIA CoreFusion
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464:primary caches
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405:US 1 cent coin
382:front-side bus
377:, running the
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356:Nehemiah cores
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350:decorative tin
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232:Samuel 2 (C5B)
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697:on 2007-03-11
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661:on 2006-12-31
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630:on 2018-03-25
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331:VIA Cyrix III
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732:. Retrieved
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699:. Retrieved
695:the original
685:
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663:. Retrieved
656:the original
643:
632:. Retrieved
628:the original
623:
597:
585:. Retrieved
579:
569:
534:
531:Legal issues
514:
436:
425:
409:
394:
386:
359:
347:
343:
329:
304:
294:and sold by
290:designed by
279:
277:
238:Ezra-T (C5N)
229:Samuel (C5A)
940:WonderMedia
930:VIA PadLock
486:processors.
472:prefetching
439:P4 Prescott
257:Predecessor
61:Performance
961:Categories
701:2007-03-12
665:2007-03-12
634:2018-10-15
624:Dan's Data
562:References
482:scenarios.
443:Intel Core
375:Socket 370
235:Ezra (C5C)
206:Socket 370
146:Extensions
71:clock rate
914:Cyrix III
734:14 August
587:10 August
511:Contracts
491:microcode
267:Successor
261:Cyrix III
923:See also
894:VIA Eden
889:VIA Nano
882:Products
853:Chipsets
794:Archived
540:See also
506:Business
501:however.
466:, large
335:L2 cache
210:EBGA 368
107:L2 cache
39:Launched
945:Zhaoxin
525:Presage
517:Lafesta
252:History
199:Sockets
168:PadLock
909:VIA C3
904:VIA C7
523:, and
521:Murano
367:3DNow!
280:VIA C3
271:VIA C7
158:3DNow!
136:x86-16
83:speeds
841:Lists
724:(PDF)
659:(PDF)
652:(PDF)
432:Intel
339:Cyrix
321:Cores
184:Cores
140:IA-32
98:cache
91:Cache
66:Max.
863:Eden
858:Nano
736:2018
589:2018
498:RISC
468:TLBs
430:and
286:for
278:The
42:2001
428:AMD
397:AES
371:SSE
363:FPU
307:x86
164:SSE
153:MMX
96:L1
81:FSB
68:CPU
53:VIA
963::
947:JV
873:C3
868:C7
726:.
622:.
610:^
578:.
519:,
449:C3
352:.
317:.
302:.
166:,
138:,
20:C3
826:e
819:t
812:v
738:.
704:.
668:.
637:.
591:.
191:1
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