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168:(as a bulk material) and significant creep under stress. This is borne out by its comparatively low values for tensile strength, shear strength and modulus of elasticity. Copper, on the other hand, has a much higher melting point, so foils are working at only 0.16T
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Additionally, for a given fixed homologous temperature, two materials with different melting points would have similar diffusion-dependent deformation behaviour. For example, solder (T
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For example, the homologous temperature of lead at room temperature (25 °C) is approximately 0.50 (T
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In electronics applications, where circuits typically operate over a −55 °C to +125 °C range,
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The homologous temperature of a substance is useful for determining the rate of steady state
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194:"DoITPoMS - TLP Library Creep Deformation of Metals - Effects of stress and temperature"
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141:= 456 K) at 115 °C would have comparable mechanical properties to copper (T
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of a material as a fraction of the thermodynamic temperature of its
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145:= 1358 K) at 881 °C, because they would both be at 0.85T
105:{\displaystyle T_{H}={\frac {T({\text{K}})}{T_{mp}({\text{K}})}}}
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and their properties are little affected by temperature.
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156:tin-lead (Sn63) solder is working at 0.48T
126:Significance of the homologous temperature
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122:= 298 K/601 K = 0.50).
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360:Standards and measurement stubs
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16:Fraction of the melting point
303:. You can help Knowledge by
242:. You can help Knowledge by
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24:thermodynamic temperature
299:-related article is a
238:-related article is a
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20:Homologous temperature
350:Scales of temperature
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206:. Retrieved
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32:Kelvin scale
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297:measurement
344:Categories
208:2018-11-12
180:References
293:standards
172:to 0.29T
160:to 0.87T
154:eutectic
295:- or
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132:creep
118:= T/T
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93:K
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49:H
45:T
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