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circuits. The ability to directly photoimage the printed layers means that the technology can provide the high line and gap resolution required by high frequency planar components. It provides a feasible fabrication process to produce circuits operating at microwave and millimetre-wave frequencies.
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This technology also enables both single-layer and multi-layer filters to be produced conveniently. Recent research work has investigated the combination of conventional thick film and fine line photoimageable technologies, in order to accommodate fine pitch and high density applications on the
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Another reason of choosing this structure in a multi-layer form is due to limitation on the structure when it has been fabricated on a single layer. The gap between the two resonant structures becomes very small and cannot easily be fabricated due to the limitations of low-cost fabrication
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activities. The technology allows extremely fine lines and structures to be produced with minimal investment in a simple process and use of special paste materials. Most of the production steps needed are already used by the industry. Only two extra production steps are required. No extra
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requirements are needed. No special lighting is required. No chemicals are required. This can be advantageous for sections of the thick film circuits community which would allow them to offer greater added value, fine line products to compete with other thick film, thin film and
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layer. However, to some extent the problem of fabricating small gaps has been exchanged for that of achieving high alignment between the conductor layers. Normally a modern mask aligner will be needed to achieve the required degree of resolution.
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Circuits made using this technology meet the modern requirements for high density packaging, whilst yielding the high quality components required for very high frequency applications, including
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Edge coupled band-pass filters were chosen for this study as they are one of the most common and useful microwave and millimetre-wave planar components. The filter performance is based on the
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ceramic substrates. Furthermore, previous work has shown that this technology is capable of realizing the circuit quality necessary for high performance microwave components.
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C. Y. Ng, M. Chongcheawchamnan, M. S. Aftanasar, I. D. Robertson, and J. Minalgience, "X-band microstrip bandpass filter using photoimageable thick-film materials",
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between the resonant sections and controlled by the size of the gap. This characteristic makes edge coupled band-pass filters very sensitive to fabrication errors.
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D. Stephens, P. R. Young, and I. D. Robertson, "Design and characterization of 180GHz filters in photoimageable thick-film technology",
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R.A. Tacken, D. Mitcan, and J. Nab, "Combining fine line photoimageable with multi-layer thick film for improved circuit density",
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C.-M. Tsai, and K. C. Gupta, "A generalized model for coupled lines and its applications to two-layer planar circuits",
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The target market for photoimageable thick film pastes is the thick film (hybrid) circuit and component industries plus
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with ceramic/dielectrics). 10 μm lines/15 μm spaces at 10 μm fired thickness are possible.
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technologies. In multi-layer circuits, the coupling between resonant sections is achieved by overlapping
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technology, and it provides a low cost solution to producing high quality
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30 μm line/40 μm space with 50 μm vias for multilayers.
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20 μm lines/30 μm space within LTCC & HTCC structures.
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line/20 μm space with high yield on alumina ceramic substrates.
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Sensor elements (narrow conductors and windows in dielectric and
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Advantages of 'conventional' thick film over thin film
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IEEE Transactions on
Microwave Theory & Techniques
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may be too technical for most readers to understand
284:IEEE MTT-S Int. Microwave Symp. Dig., Vol. 3, 2002
234:Very fine lines with precise geometry, sharp edges
192:RF and microwave (up to 200 GHz is reported)
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323:Foundation of Interconnect and Microstrip Design
123:Comparison of thick film processes for fine line
218:Through hole metallisation easy for small holes
231:Added advantages of photoimageable thick film
271:IEEE MTT-S Int. Microwave Symp. Dig., 2005
205:Plasma displays and RF shielding on glass
202:Components, such as fuses & inductors
59:Learn how and when to remove this message
43:, without removing the technical details.
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210:Thick films for microwave applications
75:Progress for photoimageable thick film
41:make it understandable to non-experts
80:Photoimageable thick-film technology
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115:Benefits of choosing this structure
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82:is a combination of conventional
321:T. C. Edwards, and M. B. Steer,
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139:which are separated by a thin
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325:, J. Wiley & Sons, 2000.
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228:Low cost process technology
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174:High Density Interconnect
355:Electronics manufacturing
339:Aurel Fine Line Equipment
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97:wireless communication
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84:thick film technology
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259:Hibridas Enterprise
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297:CICMT Proceedings
86:with elements of
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49:December 2011
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239:resistivity
225:is possible
221:A range of
148:Application
105:measurement
246:References
163:clean room
141:dielectric
137:conductors
223:resistors
107:systems.
92:microwave
88:thin film
349:Category
177:15
129:coupling
299:, 2017.
35:Please
101:radar
237:Low
197:MEMS
158:HTCC
156:and
154:LTCC
103:and
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