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UltraSPARC III

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tags are located on-die to enable it be clocked at the microprocessor's clock frequency. This increases bandwidth for accessing the cache tags, enabling the UltraSPARC to scale to higher clock frequencies easily. Part of the increased bandwidth to the cache tags is used by cache coherency traffic, which is required in the multiprocessor systems the UltraSPARC III is designed to be used in. As the maximum capacity of L2 cache is 8 MB, the L2 cache tags is 90 KB in size.
34: 902: 291:. This enabled it to operate at 750 to 900 MHz. The die is packaged using the Controlled Collapse Chip Connection method and is the first Sun microprocessor to do so. Unlike most other microprocessors bonded in such a way, the majority of the solder bumps are placed in a peripheral ring instead of being distributed across the die. It was packaged in a 1368-pad 376:
The UltraSPARC IV combined two UltraSPARC III cores onto a single piece of silicon and offered increased clock rates. The CPU's packaging was nearly identical, offering the difference of a single pin, simplifying board manufacturing and system design. Some systems which used UltraSPARC III processors
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with a 32-byte cache line. The external L2 cache has a maximum capacity of 8 MB. It is accessed via a dedicated 256-bit bus operating at up 200 MHz for a peak bandwidth of 6.4 GB/s. The cache is built synchronous static random access memory clocked at frequencies up to 200 MHz. The L2 cache
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The UltraSPARC IIIi has a unified 1 MB L2 cache that operates at half of the microprocessor's clock frequency. As such, it has a six-cycle latency and a two-cycle throughput. The load to use latency is 15 cycles. The tag store is protected by parity and the data by ECC. For every 64-byte cache
221:(ALUs), a load and store unit and two floating-point units. One of the ALUs can only execute simple integer instructions and loads. The two floating point units are also not equal. One can only execute simple instructions such as adds while the other executes multiplies, divides and square roots. 324:
line, there are 36 ECC bits, enabling the correction of one-bit errors and the detection of any error within a four bits. The cache is four-way set-associative, has a 64-byte line size and is physically indexed and tagged. It uses a 2.76 ÎĽm SRAM cell and consists of 63 million transistors.
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It fetches up to four instructions per cycle from the instruction cache. Decoded instructions are sent to a dispatch unit at up to six at a time. The dispatch unit issues the instructions to the appropriate execution units depending on operand and resource availability. The execution resources
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The on-die memory controller supports 256 MB to 16 GB of 133 MHz DDR-I SDRAM. The memory is accessed via a 137-bit memory bus, of which 128 bits are for data and 9 are for ECC. The memory bus has a peak bandwidth of 4.2 GB/s. The microprocessor was designed to support four-way
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The UltraSPARC IIIi, code named "Jalapeño", is a derivative of the UltraSPARC III for workstations and low-end (one to four processor) servers introduced in 2003. It operates at 1064 to 1593 MHz, has an on-die L2 cache and an integrated memory controller, and is capable of four-way
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and implements a dedicated 128-bit bus operating at 150 MHz to access up to 4 GB of "local" memory. The integrated memory controller is used to reduce latency and thus improve performance, unlike some other UltraSPARC microprocessors that use the feature to reduce cost.
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multiprocessing with a glue-less system bus optimized for the function. It contains 87.5 million transistors and has a 178.5 mm die. It was fabricated by Texas Instruments in a 0.13 ÎĽm, seven-layer metal (copper) CMOS process with low-k dielectric.
307:, code-named "Cheetah+", is a further development of the original UltraSPARC III that operated at higher clock frequencies of 1002 to 1200 MHz. It has a die size of 232 mm and was fabricated in a 0.13 ÎĽm, 7-layer 336:
The UltraSPARC IIIi+, code-named "Serrano", was a further development of the UltraSPARC IIIi. It was scheduled for introduction in the second half of 2005, but was cancelled in the same year in favor of the
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multiprocessing. Jbus is used to connect up to four microprocessors. It is a 128-bit address and data multiplexed bus that operates at one half or one third of the microprocessor's clock frequency.
181:(Merced). This was not to be the case as it was delayed until 2001. Despite being late, it was awarded the Analysts' Choice Award for Best Server/Workstation Processor of 2001 by 173:
When presented at the '97 Microprocessor Forum, the probable introduction date for the UltraSPARC III was 1999, and it would have competed with Digital Equipment Corporation's
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The UltraSPARC III has split primary instruction and data caches. The instruction cache has a capacity of 32 KB. The data cache has a capacity of 64 KB and is four-way
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performance, and it has several features that aid in achieving that goal: an integrated memory controller and a dedicated multiprocessing bus.
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The UltraSPARC III consisted of 16 million transistors, of which 75% are contained in the caches and tags. It was initially fabricated by
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operating at 150 MHz. The data bus is not used to access memory, but the memory of other microprocessors and the shared I/O devices.
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Konstadinidis, Georgios K. et al. (2002). "Implementation of a Third-Generation 1.1-GHz 64-bit Microprocessor".
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The external interface consists of a 128-bit data bus and a 43-bit
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Song, Peter (27 October 1997). "UltraSparc-3 Aims at MP Servers".
283:(CMOS) process with a 0.18 ÎĽm feature size and six-levels of 1194: 1010: 990: 955: 732: 701: 595: 590: 508: 178: 146:, code-named "Cheetah", is a microprocessor that implements the 1292: 1144: 1005: 948: 931: 916: 832: 727: 513: 503: 498: 493: 369:
The UltraSPARC III family of processors was succeeded by the
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MB) on-die L2 cache, support for DDR-333 SDRAM, and a new 90
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microprocessor. The UltraSPARC III was designed for
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complementary metal–oxide–semiconductor
404:"Sun kills off much delayed UltraSPARC IIIi+ chip" 165:in 2004. Gary Lauterbach was the chief architect. 1345: 377:could accept UltraSPARC IV CPU board upgrades. 448: 16:Microprocessor developed by Sun Microsystems 1165:Common Development and Distribution License 900: 455: 441: 266: 1354:Computer-related introductions in 2001 1346: 436: 237: 462: 388:IEEE Journal of Solid-State Circuits 298: 249: 331: 13: 314: 14: 1385: 254:The UltraSPARC has an integrated 402:Vance, Ashlee (31 August 2006). 32: 78:Architecture and classification 271:A prototype UltraSPARC III die 194: 1: 1200:Open Source University Meetup 1109:Sun Microsystems Laboratories 416:"UltraSPARC III Cu Processor" 380: 364: 151:instruction set architecture 73:600 MHz to 900 MHz 7: 1369:Superscalar microprocessors 1319:The Network is the Computer 421: 262: 10: 1390: 519:SPARCstation/server/center 168: 18: 1332: 1311: 1245: 1208: 1160: 1153: 1132: 1101: 1065: 1029: 1001:Sun Secure Global Desktop 909: 898: 825: 720: 486: 479: 470: 279:in their C07a process, a 199:The UltraSPARC III is an 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135:UltraSPARC IV 133: 129: 126: 125:UltraSPARC II 123: 119: 114: 107: 106: 104: 102: 98: 93: 90: 87: 85: 81: 76: 72: 70: 67: 62: 57: 54: 51: 47: 42: 35: 30: 22: 1246:Acquisitions 1233:Vinod Khosla 1047:Open Storage 768: 645:Blade server 576:SPARCclassic 409:The Register 407: 394: 387: 375: 368: 361:nm process. 335: 326: 322: 318: 304: 302: 274: 253: 241: 228: 215: 198: 182: 177:and Intel's 172: 143: 141: 1185:OpenSolaris 1088:Grid Engine 1066:Performance 996:Java System 966:OpenWindows 707:Cobalt Qube 692:JavaStation 244:address bus 204:superscalar 195:Description 175:Alpha 21264 121:Predecessor 59:Performance 49:Designed by 1348:Categories 1303:Tarantella 1298:StorageTek 1021:VirtualBox 986:StarOffice 748:UltraSPARC 743:SuperSPARC 738:microSPARC 721:Processors 712:Cobalt RaQ 633:Enterprise 381:References 365:Successors 191:features. 69:clock rate 1190:OpenSPARC 1154:Community 1133:Education 1016:GlassFish 843:Fireplane 428:Fireplane 131:Successor 1335:Category 1278:MySQL AB 1263:Gridware 1218:Bill Joy 1175:NetBeans 1119:Fortress 1114:picoJava 1102:Research 910:Software 848:LOM port 807:SPARC T5 802:SPARC T4 797:SPARC T3 480:Hardware 422:See also 373:series. 263:Physical 201:in-order 187:for its 148:SPARC V9 89:SPARC V9 1312:Slogans 1195:OpenJDK 1030:Storage 991:iPlanet 956:SunView 922:Solaris 863:Neptune 733:MB86900 509:Sun386i 487:Systems 179:Itanium 169:History 116:History 1293:SavaJe 1210:People 1093:Lustre 976:Studio 763:Gemini 359:  355:  351:  1145:BlueJ 1073:Cloud 1006:MySQL 917:SunOS 833:Sun4d 826:Other 728:SPARC 680:X4500 675:T2000 638:10000 586:Ultra 581:Netra 514:Sun-4 504:Sun-3 499:Sun-2 494:Sun-1 225:Cache 101:Cores 64:Max. 1283:Pixo 1140:SCPs 981:Java 961:NeWS 949:ZFS+ 932:NIS+ 878:SPOT 853:MBus 838:SBus 817:MAJC 812:Rock 670:E25K 655:Fire 345:and 303:The 142:The 1057:ZFS 1052:QFS 1011:xVM 944:ZFS 939:NFS 927:NIS 702:Ray 665:15K 660:12K 559:IPX 554:IPC 66:CPU 1350:: 626:80 621:60 616:30 611:24 606:10 569:ZX 564:LX 549:20 544:10 406:. 341:, 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Index

UltraSPARC IIi

Sun Microsystems
CPU
clock rate
Instruction set
SPARC V9
Cores
UltraSPARC II
UltraSPARC IV
SPARC V9
instruction set architecture
Sun Microsystems
Texas Instruments
UltraSPARC IV
Alpha 21264
Itanium
Microprocessor Report
multiprocessing
in-order
superscalar
shared memory
multiprocessing
arithmetic logic units
set-associative
address bus
memory controller

Texas Instruments
complementary metal–oxide–semiconductor

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