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Flexible electronics

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serve the vast majority of all flexible circuit applications. Copper's excellent balance of cost and physical and electrical performance attributes make it an excellent choice. There are actually many different types of copper foil. The IPC identifies eight different types of copper foil for printed circuits divided into two much broader categories, electrodeposited and wrought, each having four sub-types.) As a result, there are a number of different types of copper foil available for flex circuit applications to serve the varied purposes of different end products. With most copper foil, a thin surface treatment is commonly applied to one side of the foil to improve its adhesion to the base film. Copper foils are of two basic types: wrought (rolled) and electrodeposited and their properties are quite different. Rolled and annealed foils are the most common choice, however thinner films which are electroplated are becoming increasingly popular.
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material provides all of the characteristic properties. While a wide range of thickness is possible, most flexible films are provided in a narrow range of relatively thin dimension from 12 μm to 125 μm (1/2 mil to 5 mils) but thinner and thicker material are possible. Thinner materials are of course more flexible and for most material, stiffness increase is proportional to the cube of thickness. Thus for example, means that if the thickness is doubled, the material becomes eight times stiffer and will only deflect 1/8 as much under the same load. There are a number of different materials used as base films including: polyester (PET), polyimide (PI), polyethylene naphthalate (PEN), polyetherimide (PEI), along with various fluropolymers (FEP) and copolymers. Polyimide films are most prevalent owing to their blend of advantageous electrical, mechanical, chemical and thermal properties.
662:, though the plated through hole variation is much more common. When constructed without plated through holes, connection features are accessed from one side only, and the circuit is defined as a "Type V (5)" according to military specifications. Because of the plated through hole, terminations are provided on both sides of the circuit, thus allowing components to be placed on either side. Depending on design requirements, double-sided flex circuits can be fabricated with protective coverlayers on one, both or neither side of the completed circuit, but are most commonly produced with the protective layer on both sides. One major advantage is that it allows easy crossover connections. Many single sided circuits are built on a double sided substrate because of the crossover connections. An example of this use is the circuit that connects a 735:
many polyimide flex circuits presently employ adhesive systems of different polymer families. However some newer thermoplastic polyimide adhesives are making important in-roads. As with the base films, adhesives come in different thickness. Thickness selection is typically a function of the application. For example, different adhesive thickness is commonly used in the creation of cover layers in order to meet the fill demands of different copper foil thickness which may be encountered.
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connectors. Consumer electronics devices make use of flexible circuits in cameras, personal entertainment devices, calculators, or exercise monitors.Flexible circuits are found in industrial and medical devices where many interconnections are required in a compact package. Cellular telephones are another widespread example of flexible circuits.
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Rigid-flex circuits are a hybrid combining rigid and flexible substrates laminated into a single structure. Rigid-flex circuits are not rigidized flex constructions, which are flex circuits to which a stiffener is attached to support the weight of the components. A rigidized or stiffened flex circuit
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In certain non standard cases, the circuit manufacturer may be called upon to create a specialty laminate by using a specified alternative metal foil, such as a special copper alloy or other metal foil in the construction. This is accomplished by laminating the foil to a base film with or without an
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Adhesives are used as the bonding medium for creating a laminate. When it comes to temperature resistance, the adhesive is typically the performance limiting element of a laminate especially when polyimide is the base material. Because of the earlier difficulties associated with polyimide adhesives,
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A metal foil is most commonly used as the conductive element of a flexible laminate. The metal foil is the material from which the circuit paths are normally etched. A wide variety of metal foils of varying thickness are available from which to choose and create a flex circuit, however copper foils
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Each element of the flex circuit construction must be able to consistently meet the demands placed upon it for the life of the product. In addition, the material must work reliably in concert with the other elements of the flexible circuit construction to assure ease of manufacture and reliability.
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Flex circuits with three or more layers of conductors are known as multilayer flex circuits. Commonly the layers are interconnected by means of plated through holes, though this is not required because it is possible to provide openings to access lower circuit level features. The layers may or may
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Double access flex, also known as back-bared flex, are flexible circuits that have a single conductor layer, but allow access to selected features of the conductor pattern from both sides. While this type of circuit has benefits, the specialized processing requirements for accessing the features
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The base material is the flexible polymer film which provides the foundation for the laminate. Under normal circumstances, the flex circuit base material provides most primary physical and electrical properties of the flexible circuit. In the case of adhesiveless circuit constructions, the base
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computer boards in the 1990s. While the computer's main rigid-flex PCBA did not flex during use, subsequent Compaq designs utilized rigid-flex circuits for the hinged display cable, passing tens of thousands of flexures during testing. By 2013, the use of rigid-flex circuits in consumer laptop
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packaging engineers who have found ways to employ flexible circuit technology. Flexible circuits are one of the fastest growing interconnection product market segments. One variation on flexible circuit technology is called "flexible electronics". It involves the integration of both active and
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Polymer thick film (PTF) flex circuits print circuit elements onto a polymer film. They are typically single conductor layer structures, however two or more metal layers can be printed sequentially separated by printed insulating layers. While lower in conductivity and thus limited to certain
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Most flexible circuits are passive wiring structures that are used to interconnect electronic components such as integrated circuits, resistors, capacitors and the like; however, some are used only for making interconnections between other electronic assemblies either directly or by means of
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not be continuously laminated together throughout the construction with the exception of the areas occupied by through-holes. Discontinuous lamination is common in cases requiring maximum flexibility. This is accomplished by leaving unbonded the areas where flexing or bending is to occur.
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fabrication, glass is used as a substrate. If thin flexible plastic or metal foil is used as the substrate instead, the entire system can be flexible, as the film deposited on top of the substrate is usually very thin, on the order of a few micrometres.
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switching applications. One of the earliest descriptions of what could be called a flex circuit was unearthed by Dr Ken Gilleo and disclosed in a 1903 English patent by Albert Hansen that described a construction consisting of flat metal conductors on
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Specifications are developed to provide a common ground of understanding of what a product should look like and how it should perform. Standards are developed directly by manufacturer's associations such as the
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Vicente, António T.; Araújo, Andreia; Mendes, Manuel J.; Nunes, Daniela; Oliveira, Maria J.; Sanchez-Sobrado, Olalla; Ferreira, Marta P.; Águas, Hugo; Fortunato, Elvira; Martins, Rodrigo (2018-03-29).
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Flex circuits are often used as connectors in various applications where flexibility, space savings, or production constraints limit the serviceability of rigid circuit boards or hand wiring.
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film. Component termination features are accessible only from one side. Holes may be formed in the base film to allow component leads to pass through for interconnection, normally by
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conductors wherein the conductor thickness differs at various places along their length. (I.e., the conductors are thin in flexible areas and thick at interconnection points.)
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In computer peripherals flexible circuits are used on the moving print head of printers, and to connect signals to the moving arm carrying the read/write heads of disk drives.
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In the automotive field, flexible circuits are used in instrument panels, under-hood controls, circuits to be concealed within the headliner of the cabin, and in ABS systems.
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The 1947 publication "Printed Circuit Techniques" by Brunetti and Curtis a brief discussion of creating circuits on what would have been flexible insulating materials (e.g.
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announced the creation of stretchable and skin-like semiconductor circuits. In the future, these wearable electronics may be used to send health data to doctors wirelessly.
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The layers are normally interconnected by plated through holes. Rigid-flex circuits are often chosen by military product designers and increasingly in commercial products.
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Boane, Jenny L. N.; Centeno, Pedro; Mouquinho, Ana; Alexandre, Miguel; Calmeiro, Tomás; Fortunato, Elvira; Martins, Rodrigo; Mendes, Manuel J.; Águas, Hugo (2021).
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to the motherboard. All connections on that circuit are located on only one side of the substrate, except a small crossover connection that uses the other side.
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Manufacturing sculptured flex circuits involves a special flex circuit multi-step etching method that yields a flexible circuit having finished
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D. Shavit: The developments of LEDs and SMD Electronics on transparent conductive Polyester film, Vacuum International, 1/2007, S. 35 ff
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applications, PTF circuits have found a home in low-power applications at slightly higher voltages. Keyboards are a common application.
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Flexible printed circuits (FPC) are made with a photolithographic technology. An alternative way of making flexible foil circuits or
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Single-sided flexible circuits have a conductor layer made of either a metal or conductive (metal filled) polymer on a flexible
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powder to create what would have clearly been flexible circuits, though no evidence indicates that it was reduced to practice.
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are batteries, both primary and secondary, that are designed to be conformal and flexible, unlike traditional rigid ones.
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Electrical connections between sub-assemblies to replace wire harnesses, which are heavier and bulkier, such as in cars,
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Rigid-flex boards are normally multilayer structures; however, two metal layer constructions are sometimes used.
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issued at the turn of the 20th century show interest in flat electrical conductors sandwiched between layers of
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Following are brief descriptions of the basic elements of flex circuit construction and their functions.
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Electrical connections where the assembly is required to flex during its normal use, such as folding
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Double-sided flex circuits have two conductor layers. They can be fabricated with or without plated
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on sputtered conductive films has enabled the production of transparent LED Films, which is used in
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Tightly assembled electronic packages, where electrical connections are required in 3 axes, such as
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that states a Knowledge editor's personal feelings or presents an original argument about a topic.
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The growing markets related with flexible and/or portable electronics, such as for self-powered
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Wong, William S.; Salleo, Alberto (2009). "Flexible Electronics (Materials and Applications)".
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Electrical connections where board thickness or space constraints are driving factors.
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can have one or more conductor layers. The terms represent quite different products.
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or transparent conductive polyester film. Additionally, flex circuits can be
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An Olympus Stylus camera without the case, showing the flex circuit assembly.
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2021 IEEE International Flexible Electronics Technology Conference (IFETC)
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Flexible circuits display significant variation in their construction.
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IEEE International Flexible Electronics Technology Conference (IFETC)
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Single-sided circuits are ideal for dynamic or high-flex applications
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Flexible circuits are variously known around the world variously as
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Image of Miraco flexible printed circuits prior to de-panelization.
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adhesive depending on the nature and properties of the base film.
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like computer keyboards; most keyboards use flex circuits for the
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Hussain, Muhammad Mustafa; El-Atab, Nazek, eds. (2019-11-11).
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over circuits is the most common practice. The development of
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Generally worse panel utilization resulting in increased cost
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Mounting of electronic devices on flexible plastic substrates
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are used in many products. Credit is due to the efforts of
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personal reflection, personal essay, or argumentative essay
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Potential to replace multiple rigid boards or connectors
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Flexible circuit industry standards and specifications
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but also in flexible automotive lighting composites.
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flexible printed wiring, flex print, flexi circuits,
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Seaside, OR: BR Publishing, Inc. 2110: 1293:Handbook of Flexible and Stretchable Electronics 377:Increased risk of damage during handling or use 1289: 596: 1840: 1350: 770:IEEE Journal on Flexible Electronics (J-FLEX) 759:Association Connecting Electronics Industries 711: 653: 604: 407:A common application of flex circuits is in 383:Repair and rework is difficult or impossible 669: 641: 53:Learn how and when to remove these messages 2091: 1847: 1833: 1357: 1343: 1212:Flexible Circuit Technology, Third Edition 1150: 764: 504:, have driven the development of bendable 1854: 1034: 1024: 983: 774: 761:(IPC) and by users of flexible circuits. 633:Double access or back-bared flex circuits 226:Learn how and when to remove this message 208:Learn how and when to remove this message 106:Learn how and when to remove this message 1208: 368: 245: 237: 1251: 2111: 1947:Differential technological development 1270: 1232: 1189: 678: 462: 364:Stacked FPCs in various configurations 1828: 1338: 1237:(1992 ed.). New York: Springer. 955: 511: 451: 446:flexible organic light-emitting diode 352: 146:adding citations to reliable sources 117: 59: 18: 2036:Future-oriented technology analysis 1057: 729: 13: 1144: 269:by mounting electronic devices on 14: 2140: 1327: 593:passive functions in the device. 516:In December 2021, engineers from 493:have been developed for powering 34:This article has multiple issues. 2090: 1468:Failure of electronic components 923:Journal of Materials Chemistry C 720: 703:Polymer thick film flex circuits 436: 402: 302: 122: 64: 23: 1364: 1129: 423: 390: 380:More difficult assembly process 133:needs additional citations for 42:or discuss these issues on the 1111: 1087: 1078: 1051: 1000: 949: 908: 885: 876: 797:Copper indium gallium selenide 478: 1: 2063:Technology in science fiction 1902:Nanoelectromechanical systems 1235:Handbook of Flexible Circuits 1153:Electronic Materials: Science 895:solar jacket and the Voltaic 869: 738: 696:computers had become common. 442:Organic light-emitting diodes 374:Cost increase over rigid PCBs 1463:List of emerging electronics 976:10.1021/acsphotonics.2c00446 905:and similar solar backpacks. 563:applied to linen paper with 7: 784: 597:Flexible circuit structures 470: 418: 10: 2145: 2068:Technology readiness level 2004:Technological unemployment 1912:Thermal copper pillar bump 1254:Flexible Printed Circuitry 712:Flexible circuit materials 654:Double-sided flex circuits 605:Single-sided flex circuits 527: 482: 2124:Electronics manufacturing 2086: 2051:Technological singularity 2011:Technological convergence 1929: 1869: 1862: 1663: 1521: 1438: 1372: 1296:(1 ed.). CRC Press. 1209:Fjelstad, Joseph (2007). 1192:Printed Circuits Handbook 1165:10.1007/978-0-387-74363-9 1252:Stearns, Thomas (1995). 670:Multilayer flex circuits 642:Sculptured flex circuits 2016:Technological evolution 1989:Exploratory engineering 1706:Electromagnetic warfare 1275:. New York: CRC Press. 1058:Fox, Dan (2021-12-14). 956:Haque, Sirazul (2022). 848:Stretchable electronics 765:Scientific Publications 691:chose the approach for 623:surface mounted devices 543:were to serve in early 506:thin-film photovoltaics 2129:Electronic engineering 2026:Technology forecasting 2021:Technological paradigm 1994:Proactionary principle 1676:Automotive electronics 1625:Robotic vacuum cleaner 1585:Information technology 1390:Electronic engineering 1271:Gurley, Steve (1984). 1190:Coombs, Clyde (2007). 775:Scientific Conferences 334:(dynamic application). 297:printed circuit boards 251: 243: 157:"Flexible electronics" 86:by rewriting it in an 1952:Disruptive innovation 1897:Molecular electronics 1856:Emerging technologies 1610:Portable media player 1483:Molecular electronics 1478:Low-power electronics 891:See for instance the 369:Disadvantages of FPCs 327:(static application). 249: 241: 2119:Flexible electronics 1999:Technological change 1942:Collingridge dilemma 1887:Flexible electronics 1804:Terahertz technology 1785:Open-source hardware 1741:Consumer electronics 1711:Electronics industry 1473:Flexible electronics 1380:Analogue electronics 1233:Gilleo, Ken (1998). 1026:10.3390/micro1020016 863:Zero insertion force 823:Rollable electronics 489:Flexible, thin-film 485:Thin-film solar cell 309:flexible flat cables 255:Flexible electronics 142:improve this article 2056:Technology scouting 2031:Accelerating change 1780:Nuclear electronics 1605:Networking hardware 1508:Quantum electronics 1493:Organic electronics 1415:Printed electronics 1385:Digital electronics 828:Printed electronics 679:Rigid-flex circuits 541:electrical circuits 537:insulating material 522:Stanford University 463:Automotive circuits 291:silver circuits on 267:electronic circuits 2073:Technology roadmap 1758:Marine electronics 1731:Integrated circuit 1650:Video game console 1448:2020s in computing 1430:Thermal management 935:10.1039/C7TC05271E 901:2014-01-15 at the 619:protective coating 512:Skin-like circuits 457:Flexible batteries 452:Flexible batteries 252: 244: 88:encyclopedic style 75:is written like a 2106: 2105: 1925: 1924: 1822: 1821: 1799:Radio electronics 1425:Schematic capture 1410:Power electronics 1311:978-1-315-11279-4 1273:Flexible Circuits 1225:978-0-9796189-0-1 1174:978-0-387-74362-2 929:(13): 3143–3181. 808:Flexible keyboard 792:Amorphous silicon 353:Advantage of FPCs 236: 235: 228: 218: 217: 210: 192: 116: 115: 108: 57: 2136: 2094: 2093: 2041:Horizon scanning 1957:Ephemeralization 1867: 1866: 1849: 1842: 1835: 1826: 1825: 1794:Radio navigation 1691:Data acquisition 1400:Microelectronics 1359: 1352: 1345: 1336: 1335: 1323: 1286: 1267: 1248: 1229: 1217: 1205: 1186: 1138: 1133: 1127: 1126: 1115: 1109: 1108: 1106: 1105: 1091: 1085: 1082: 1076: 1075: 1073: 1072: 1055: 1049: 1048: 1038: 1028: 1004: 998: 997: 996:– via ACS. 987: 970:(7): 2408–2421. 961: 953: 947: 946: 920: 912: 906: 889: 883: 880: 803:Flexible circuit 730:Bonding adhesive 638:limits its use. 539:. 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